The invention belongs to the field of light emitting semiconductor packaging, and discloses a high performance organosilicon epoxy material, a preparation method and applications thereof. According to the present invention, a vinyl epoxy monomer and methylhydrosiloxane are subjected to a catalysis reaction for 2-24 h, an end capping agent and a catalyst are added to continuously carry out the reaction to obtain end capped epoxy cyclosiloxane, 0.1-5.0 parts of a cyclosiloxane ring opening agent, 0.01-80 parts of an epoxy curing agent and 0.01-5.0 parts of a curing catalyst are added to 100 parts of the end capped epoxy cyclosiloxane in batches, stirring is performed for 0.5-12.0 h under a nitrogen condition during the addition, an auxiliary agent is added, stirring is continuously performed for 0.5-3.0 h, and curing is performed to obtain the organosilicon epoxy material; and the material has characteristics of the epoxy resin and the organosilicon material, further has characteristics of excellent light transmittance, excellent adhesion, excellent mechanical strength, excellent heat resistance and excellent UV performance, and can be adopted as a LED packaging material, an optical lens material, a photoelectric conversion material, an integrated circuit packaging material, an insulation material, a coating material and an adhesive.