83904 results about "High heat" patented technology

A medical instrument sterilization method is disclosed, which characterizes in following process: pending medical instrument for sterilization treatment being placed in a closed container, then being vacuum pumped, the vacuum pressure of the container being controlled between 1 Pa to 1500 Pa, air and / or oxygen and / or inert gases are charged to closed container and the vacuum pressure being between 1 Pa to 1500 Pa, microwave is fed, the favorable power of which should make the gas charged into the container to generate ionization, the microwave be cut after the sterilization, then air being charged to release vacuum to finish the whole process.

The invention relates to a non-smokable electronic spray cigarette which only comprises nicotine without harmful tar. The cigarette includes a smoke mouth integer comprised with a shell, a cell, a high frequency ionzer, nicotine solution storage and its container, control circuit, a display screen, a human contact sensor, a piezoelectric supersound atomizer, a high temperature vaporization nozzle and attachments, an electro-thermal vaporization nozzle installed in the air suction end of the shell goes through an electric control pump or a valve with a measuring chamber and a liquid storage container which contains nicotine solution and is connected to the electric control pump or a valve with a one-way flow valve, the control circuit plate has four export ends individually connected with the high frequency ionizer, electric heater, pump or valve and the display screen, a human resistence sensor and an air flow sensor are connected to the input end of the control circuit. The advantages of the present invention are smoking without tar, reducing the cancerogenic risk, the user still feel smoking and experiercing the excitement, the cigarette is no need to be lit and is no fire danger.

Holey optical fibers (e.g. photonic fibers, random-hole fibers) are fabricated with quantum dots disposed in the holes. The quantum dots can provide light amplification and sensing functions, for example. When used for sensing, the dots will experience altered optical properties (e.g. altered fluorescence or absorption wavelength) in response to certain chemicals, biological elements, radiation, high energy particles, electrical or magnetic fields, or thermal / mechanical deformations. Since the dots are disposed in the holes, the dots interact with the evanescent field of core-confined light. Quantum dots can be damaged by high heat, and so typically cannot be embedded within conventional silica optical fibers. In the present invention, dots can be carried into the holes by a solvent at room temperature. The present invention also includes solid glass fibers made of low melting point materials (e.g. phosphate glass, lead oxide glass) with embedded quantum dots.

Process for removing mercury from flue gases of high-temperature plants, in particular power stations and waste incineration plants in which a bromine compound is fed to the multistage furnace and / or the flue gas in a plant section downstream of the furnace, the temperature during contact of the bromine compound with the flue gas being at least 500° C., preferably at least 800° C. The combustion is carried out in the presence of a sulphur compound, in particular sulphur dioxide. Subsequently to the furnace, the flue gas is subjected to an optional multistage cleanup for removing mercury from the flue gas, which cleanup comprises a wet scrubber and / or a dry cleanup.

The present invention provides a wafer support tool for heat treatment easy in working and capable of realizing reduction in cost without generating damages or slip dislocations that would be otherwise caused by high temperature heat treatment and a heat treatment apparatus. The present invention is directed to a wafer support tool for heat treatment comprising: a plurality of wafer support members for supporting a wafer to be heat treated; and a support member holder for holding the wafer support members, wherein the wafer support members each has a contact portion with the wafer, at least one of the contact portions being movable relative to the support member holder.

The invention discloses a medical disposable electric motor saw, which comprises a handle and an enclosure main body, wherein a non-removable battery and a circuit control panel which is connected with the battery are arranged in the handle; a press part of the handle is provided with a speed adjusting switch which is connected with the circuit control panel; a hollow motor which is provided with a driving shaft is arranged in the enclosure main body; the battery is a rechargeable lithium battery; a charging socket is formed in the bottom or the lateral part of the handle; a sterile sealing bag is arranged on the outer sides of the handle and the enclosure main body. After the structure is adopted, and the hollow motor is used, the medical disposable electric motor saw is stable in transmission and good in braking performance, the weight of the medical disposable electric motor saw is about a half of that of an electric motor saw with a common motor, the structure is simple, the fault rate is low, the medical disposable electric motor saw is easy to carry and use, the manufacturing cost is low, the battery cannot be detached, so the loosening or dropping phenomenon cannot occur, and the completion quality of a surgery is effectively ensured. The sterile sealing bag is used, the wait for high-temperature high-pressure sterilization is not needed, and the medical disposable electric motor saw can be used any time. The precious operation time is saved for an emergency operation patient.

A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

Disclosed is a heat treatment system for semiconductor devices. The heat treatment system is used in a heat treatment process for semiconductor devices, such as a crystallization process for an amorphous silicon thin film or a dopant activation process for a poly-crystalline silicon thin film formed on a surface of a glass substrate of a flat display panel including a liquid crystal display (LCD) or an organic light emitting device (OLED). The heat treatment system transfers a semiconductor device after uniformly preheating the semiconductor device in order to prevent deformation of the semiconductor device during the heat treatment process, rapidly performs the heat treatment process under the high temperature condition by heating the semiconductor device using a lamp heater and induction heat derived from induced electromotive force, and unloads the semiconductor device after uniformly cooling the semiconductor device such that the semiconductor device is prevented from being deformed when the heat treatment process has been finished. The heat treatment system rapidly performs the heat treatment process while preventing deformation of the semiconductor device by gradually heating or cooling the semiconductor device.

A system and method for depositing a film within a reaction chamber are disclosed. An exemplary system includes a temperature measurement device, such as a pyrometer, to measure an exterior wall surface of the reaction chamber. A temperature of the exterior wall surface can be controlled to mitigate cleaning or etching of an interior wall surface of the reaction chamber.

A light emitting diode (LED) bulb includes a heat sink, a circuit layer having two opposite sides, multiple LEDs mounted on one side and an electrical insulating layer connected between the opposite side and the heat sink. Heat generated by the LEDs is conducted to the heat sink through the circuit layer and the electrical insulting layer and is dissipated quickly. Further, a fan can be mounted on the fins to dissipate heat from the heat sink more quickly. Therefore, the LED bulb has good heat dissipating efficiency.

A method for producing a stretch-thinned elastic article having dimensional stability over time and at elevated temperatures in which a thermoplastic block copolymer is melt-processed into a stretchable article such as a film or fiber. The article is then conditioned at an elevated temperature greater than or equal to a glass transition temperature (Tg) of a hard phase of the thermoplastic block copolymer. The article is stretch-thinned at the elevated temperature to a desired percentage stretch, forming a stretch-thinned article, after which it is cooled to a temperature below the glass transition temperature of the hard phase of the thermoplastic block copolymer. Films produced by this method are suitable for use in durable and disposable articles including personal care articles such as diapers, incontinence wear, training pants, and feminine care articles, as well as wound dressings, wipes, towels, napkins, and protective apparel.

An electrosurgical instrument with a disposable electrosurgical cartridge is provided. The cartridge has first and second energy-delivery surfaces that carry first and second opposing polarity conductors coupled to a voltage source, together with first and second temperature-responsive variable impedance bodies exposed partly in the respective-delivery surfaces. The cartridge further carries a slidable blade member. The temperature-responsive variable impedance bodies are coupled to the voltage source by series and parallel circuitry. In use, the variable impedance bodies are adapted to modulate current flow and ohmic heating in engaged tissue by providing controlled current paths in the tissue and through the variable impedance bodies as the temperature-responsive bodies sense the temperature of adjacent engaged tissue. The engagement surfaces are capable of highly localized modulation of Rf energy application to engage engaged tissue to provide high and low temperatures, voltage and current in the tissue to create high strength welds.

An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

Embodiments of the subject invention pertain to a method and apparatus for contactless power transfer. A specific embodiment relates to an impedance transformation network, a new class of load network for application to a contactless power system. Embodiments of the impedance transformation network enable a contactless power system to operate without encountering the common problems of: 1) over-voltage and / or under-voltage conditions; 2) over-power and / or under-power conditions; 3) power oscillations; and 4) high heat dissipation.

This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer on it. The base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically. The LED is electrically connected to a driving circuit through its outgoing wires. The driving circuit is in turn electrically connected to an electrical connector through its housing. A LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing. The LED has high efficiency, high power and long lifetime and can be used to fabricate LED traffic lamps, LED plane light sources, etc.

Provided is a substrate-processing device capable of preventing a top lid from sagging downward by the own weight of the substrate-processing device and / or a vacuum suction force generated by a vacuum pump and / or thermal shock at high temperature process, in a chamber including a plurality of reactors. Also, provided is a rotating shaft for transferring a substrate between the plurality of reactors.

An orthopedic screw with an internal bore and mating driver has a bioabsorbable polymer component. To increase the torque tolerance of the screw and to minimize the likelihood of the driver stripping inside the bore of the screw, the screw and driver are heat treated together to shrink fit the screw onto the driver thereby increasing the driver-to-screw contact and distributing the loading force over a greater area to protect against material failure. The heat treatment involves heating the screw to an elevated temperature and holding that temperature for a period to promote stress relaxation and / or crystallization of the material.

Susceptor plates are provided for high temperature (e.g., greater than 1000° C.) batch processing of silicon wafers. The susceptor plates are designed to accommodate one wafer each, and a plurality of loaded susceptor plates are vertically spaced apart in a susceptor plate holder during batch or furnace processing. The susceptor plates provide “full” support beneath the wafers, with openings of at most 20 mm in diameter in the support surface. Protrusions are also kept to a minimum. The susceptor plates thus prevent the wafers from sagging beyond the point of plastic deformation. The support surface is also ground or polished to remove protrusions beyond a prescribed height. For a given treatment temperature, the susceptor plates permit higher ramp rates without wafer plastic deformation or sticking to the susceptor plate. In one embodiment, the susceptor plates are pre-bent in a direction opposing the direction of sag.

A filled polymer composition comprises (i) an ethylene / α-olefin interpolymer, and (ii) a filler. The ethylene / α-olefin interpolymer is a block copolymer having at least a hard block and at least a soft block. The soft block comprises a higher amount of comonomers than the hard block. The block interpolymer has a number of unique characteristics disclosed here. The filled polymer compositions provided herein, in certain embodiments, have relatively higher heat resistance and improved noise, vibration and harshness properties and can be used in automotive floorings, roofings, wire and cable coating applications.

The present invention provides a temperature control unit for an electrostatic adsorption electrode that is capable of controlling the wafer temperature rapidly over a wide temperature range without affecting in-plane uniformity while high heat input etching is conducted with high wafer bias power applied. A refrigerant flow path provided in the electrostatic adsorption electrode serves as an evaporator. The refrigerant flow path is connected to a compressor, a condenser, and a first expansion valve to form a direct expansion type refrigeration cycle. A second expansion valve is installed between the electrostatic adsorption electrode and the compressor to adjust the flow rate of a refrigerant. This makes it possible to compress the refrigerant in the refrigerant flow path of the electrostatic adsorption electrode and adjust the wafer temperature to a high level by raising the refrigerant evaporation temperature. Further, a thin-walled cylindrical refrigerant flow path is employed so that the thin-walled cylinder is deformed only slightly by the refrigerant pressure.

Disclosed herein is a method of operating a polymerization reactor for a polymerization reaction comprising modifying a recycle gas composition to increase the heat capacity of the recycle gas wherein the recycle gas composition is modified by reducing or eliminating the nitrogen concentration in the recycle gas. In an embodiment, the nitrogen concentration is reduced or eliminated by reducing or eliminating one or more nitrogen input sources to the polymerization reactor and replacing the nitrogen with an alternate inert fluid (a gas or liquid that is inert to the catalyst and reactants). The alternate inert fluid has a higher heat capacity and a higher molecular weight than nitrogen. In an embodiment, the nitrogen utilized to convey a catalyst into the polymerization reactor is replaced with an alternate inert fluid. In an embodiment, the alternate inert fluid is ethane, propane, isobutane, or combinations thereof.