21353 results about "Heat sink" patented technology

A lithium-ion secondary battery includes: a winding body in a coil formation at a battery container, the winding body wrapping a cathode film in which lithium ions store and from which lithium ions extract and a anode film in which lithium ions store and from which lithium ions extract, and the cathode film and the anode film being electrically separated from each other via a porous separator; and a heat sink disposed inside the battery container, which contacts the battery container and transmits heat inside the winding body to the battery container.

Light Emitting Diode Light Sources for Dental Curing are disclosed. Some embodiments of the invention include structures such as Light Emitting Diode Array(s), heat sink, heat dissipation, heat pipe, and control circuitry are disclosed.

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer on it. The base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically. The LED is electrically connected to a driving circuit through its outgoing wires. The driving circuit is in turn electrically connected to an electrical connector through its housing. A LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing. The LED has high efficiency, high power and long lifetime and can be used to fabricate LED traffic lamps, LED plane light sources, etc.

A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

An LED light bulb has a hollow LED support / heat sink (222, 602, 702, 900, 802, 1002, 1102, 1216, 1404, 1502, 1606, 1906) with fins (234, 406, 604, 706, 804, 904, 906,1008, 1106, 1620) extending internally and openings at two ends (230, 232, 1522). Heat generated by the LEDs (238, 908, 1242, 1624, 2504) is conducted through the heat sink fins and is removed by a convectively driven air flow that flows through the LED support / heat sink. LEDs are mounted on multiple external faces (236, 404, 910, 1524, 1622) of the LED support / heat sink thereby providing illumination in all directions. Lenses (1246, 2102, 2104) are provided for the LEDs to make the illumination highly uniform.

The invention provides an elongated lighting fixture with multiple light emitting diodes (LEDs) arrayed in two groups that are angled to each other. The fixture provides an extremely broad light emitting angle and includes an elongated housing having a pair of side walls with at least one fin to dissipate heat. Each side wall has a support member extending upward at angle from the side wall, wherein the side walls terminate at a central wall. A generally transparent cover is connected to the housing and extends between opposed ends of the housing. A first elongated fastener and a second elongated fastener are utilized to mount a first group of LEDs and a second group of LEDs to the first support member and the second support member, respectively. First and second interconnection board assemblies are affixed to respective support members beneath the group of LEDs by the first and second fasteners. When the first and second interconnection board assemblies are energized by an internal power source, current travels from each interconnection assembly through the fasteners to each group of LEDs for illumination.

A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface formed of a first material having a low surface energy, and a thermal dissipation member having a second heat transfer surface which is formed of a second material having a surface energy substantially higher than the surface energy of the first material, and which is disposable opposite the first heat transfer surface of the heat-generating source in a spaced-apart, heat transfer adjacency therewith. The interface includes a first pressure sensitive adhesive (PSA) surface which is bondable under pressure to at least a portion of the first heat transfer surface of the heat-generating source, and an opposing second pressure sensitive adhesive (PSA) surface bondable under pressure to at least a portion of the second heat transfer surface of the heat-generating source. The first PSA surface is presented from a layer of a thermally-conductive, first pressure sensitive adhesive composition, preferably silicone-based, having an affinity to the first heat transfer surface of the heat generating source. In turn, the second PSA surface is presented from a layer of a second pressure sensitive adhesive composition, preferably acrylic-based, different from the first composition and having an affinity to the second heat transfer surface of the thermal dissipation member. The interface is particularly adapted for bonding a plastic packaged electronic component to a metal heat sink.

This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer on it. The base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically. The LED is electrically connected to a driving circuit through its outgoing wires. The driving circuit is in turn electrically connected to an electrical connector through its housing. A LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing. The LED has high efficiency, high power and long lifetime and can be used to fabricate LED traffic lamps, LED plane light sources, etc.

A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

The invention provides a multi-use light fixture that includes a light engine, a rugged housing, and an external power supply removeably embedded within an optional external enclosure. The light fixture includes several novel heat management features designed to reduce the risk of failure and thereby increase the reliability of the light fixture. The light engine includes groups of light modules, each having a light emitting diode (LED) and a zener diode. The housing includes an internal gap defined between the a circuit board and the housing. The housing also includes an arrangement of external fins and vents that dissipate heat generated by the light engine. The lens cover includes a plurality of inlets to supply ambient air into the fixture. During operation, heat is generated by the light modules, namely the LEDs, and then is transferred along a first flow path through a main body portion of the housing and the fins for dissipation to ambient and a second air flow path whereby ambient air flows through the light engine to increase the performance and efficiency of the light engine.