15852 results about "Support surface" patented technology

A surgical power tool includes a hand unit and a tool holder. The tool holder engages a hub of a tool to hold the tool during use. One tool holder includes a substantially planar support surface, a pair of spaced-apart sidewalls protruding from the support surface, each sidewall having at least one tab extending from the sidewall toward the other of the sidewalls. A tool clamp, including a post protrudes from the support surface with an enlarged head at a distal end thereof. A lock button protrudes from the support surface, the lock button being depressible toward the support surface. Another tool holder includes an output shaft having a driven end and a free end, the free end of the output shaft having a slot formed therein. A collet is disposed coaxially with the output shaft and is rotatable relative thereto. The collet has a collet wall extending between the first and second ends of the collet. The collet has a plurality of slots in the first end of the collet, a plurality of grooves in an inner surface of the collet wall, and a plurality of internal ridges protruding from the inner surface of the collet wall.

The invention discloses a tissue clamping member of a linear cutting anastomat and a nail granary of the tissue clamping member. The left side and the right side of a nail discharging surface of the nail granary are respectively provided with one column of barrier bars and barrier bulges, which are parallel to a knife pushing groove, and the front end part of a nail supporting surface of a nail supporting base of the tissue clamping member is provided with one row of semi-spherical concave holes along the left-right direction. During the use, the barrier bulges apply an acting force with the direction which is opposite to the advancing direction of a cutting knife to the clamped human body tissue, the two columns of barrier bars apply leftwards and rightwards acting forces which have the direction opposite to the advancing direction of the cutting knife and face outside to the clamped human body tissue, therefore the clamped tissue is stable and firm without slipping, wherein the left column of barrier bar applies to a leftwards acting force to the human body tissue and the right column of barrier bar applies to a rightwards acting force to the human body tissue, therefore, the clamped tissue is tightened, and the cutting knife carries out cutting more smoothly when advancing forwards.

An improved gas deposition chamber includes a hollow gas deposition volume formed with a volume expanding top portion and a substantially constant volume cylindrical middle portion. The hollow gas deposition volume may include a volume reducing lower portion. An aerodynamically shaped substrate support chuck is disposed inside gas deposition chamber with a substrate support surface positioned in the constant volume cylindrical middle portion. The volume expanding top portion reduces gas flow velocity between gas input ports and the substrate support surface. The aerodynamic shape of the substrate support chuck reduces drag and helps to promote laminar flow over the substrate support surface. The volume reducing lower portion helps to increase gas flow velocity after the gas has past the substrate support surface. The improved gas deposition chamber is configurable to 200 mm diameter semiconductor wafers using ALD and or PALD coating cycles. An improved coating method includes expanding process gases inside the deposition chamber prior to the process gas reaching surfaces of a substrate being coated. The method further includes compressing the process gases inside the deposition chamber after the process gas has flowed past surfaces of the substrate being coated.

An improved method of performing surgery on a joint in a patient's body, such as a knee, includes making an incision in a knee portion of one leg while a lower portion of the one leg is extending downward from an upper portion of the one leg and while a foot connected with the lower portion of the one leg is below a support surface on which the patient is disposed. The incision is relatively short, for example, between seven and thirteen centimeters. A patella may be offset from its normal position with an inner side of the patella facing inward during cutting of a bone with a cutting tool. During cutting of the bone, one or more guide members having opposite ends which are spaced apart by a distance less than the width of an implant may be utilized to guide movement of a cutting tool.

A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber, a remote plasma source coupled to the processing chamber through an outlet port formed through the processing chamber, the outlet port having an opening pointing toward an periphery region of a substrate disposed on the substrate support assembly, and a substrate supporting surface of the substrate support assembly that substantially electrically floats the substrate disposed thereon relative to the substrate support assembly.

An expandable bone device including a unitary body extending along a longitudinal axis and including a deformable distal end portion having a collapsed orientation for placement adjacent a spinal structure, the deformable distal end portion including relatively wide, mutually contiguous support surfaces outlined by relatively narrow cutouts, the support surfaces being contiguous with the rest of the unitary body via relatively narrow deformable splines, the deformable distal end portion having an expanded orientation wherein the support surfaces are moved transversely outwards away from and generally parallel to the longitudinal axis, and an actuator coupled to the deformable distal end portion and operative to cause movement of the deformable distal end portion between the collapsed orientation and the expanded orientation.

A substrate-supporting device for CVD having a substrate-supporting region includes: a substrate-supporting surface which is a continuous surface defining a reference plane on which a substrate is placed; and multiple dimples having bottom surfaces lower than the reference plane. The respective dimples are isolated from each other by a portion of the substrate-supporting surface.

A tray 15 for a dry etching apparatus 1 has substrate accommodation holes 19A to 19D penetrating thickness direction and a substrate support portion 21 supporting an outer peripheral edge portion of a lower surface 2a of a substrate 2. A dielectric plate 23 has a tray support surface 28 supporting a lower surface of the tray 15, substrate placement portions 29A through 29D inserted from a lower surface side of the tray 15 into the substrate accommodation holes 19A through 19D and having a substrate placement surface 31 at its upper end surface for placing the substrate 2. A dc voltage applying mechanism 43 applies a dc voltage to an electrostatic attraction electrode 40. A heat conduction gas supply mechanism 45 supplies a heat conduction gas between the substrate 2 and substrate placement surface 31. The substrate 2 can be retained on the substrate placement surface 31 with high degree of adhesion. This results in that the cooling efficiency of the substrate 2 is improved and processing is uniformed at the entire region of the substrate surface including the vicinity of the outer peripheral edge.

A delivery appliance for delivering an expandable annular device, particularly an expandable intravascular device, to a desired location in a lumen, includes an annular array of supporting strips extending from a proximal end of the annular array to a distal end of the annular array, to define an annular supporting surface for the expandable annular device. Each of the supporting strips is laterally deformable to radially expand or radially contract the annular array and the annular supporting surface defined thereby. A connecting stem passes through the annular array of supporting strips and has a distal end coupled to the supporting strips at the distal end of the annular array for axial movement therewith, and a proximal end passing through the proximal end of the annular array of supporting strips for axial movement with respect thereto. The proximal end of the connecting stem is axially movable in opposite directions to move the distal end of the annular array axially away from or towards, the proximal end of the annular array to radially contract or radially expand the annular supporting surface.

A system for monitoring medical conditions including pressure ulcers, pressure-induced ischemia and related medical conditions comprises at least one sensor adapted to detect one or more patient characteristic including at least position, orientation, temperature, acceleration, moisture, resistance, stress, heart rate, respiration rate, and blood oxygenation, a host for processing the data received from the sensors together with historical patient data to develop an assessment of patient condition and suggested course of treatment. In some embodiments, the system can further include a support surface having one or more sensors incorporated therein either in addition to sensors affixed to the patient or as an alternative thereof. The support surface is, in some embodiments, capable of responding to commands from the host for assisting in implementing a course of action for patient treatment. The sensor can include bi-axial or tri-axial accelerometers, as well as resistive, inductive, capactive, magnetic and other sensing devices, depending on whether the sensor is located on the patient or the support surface, and for what purpose.

Disclosed is a susceptor which achieves uniform temperature distribution of a wafer placed on the susceptor, and also disclosed is a substrate processing apparatus provided with the susceptor. An annular recess 12a is formed in an intermediate portion between the central portion and the peripheral portion of a wafer support surface of the susceptor 12. Due to the provision of the recess, the substrate heating effect by thermal radiation from the susceptor is suppressed in the intermediate portion. The geometrical dimension of the recess is determined taking the chamber internal pressure into consideration.

An apparatus for supporting a substrate is described that has a ball adapted to minimize damage between the substrate support and the substrate supported thereon. In one embodiment, an apparatus for supporting a substrate includes ball disposed on an inclined ball support surface. The ball support surface is adapted to bias the ball toward one side of the ball support surface thereby providing space for the ball to roll as the substrate supported thereon changes in length when exposed to thermal influences. In another embodiment, the apparatus further comprises a cage adapted to capture the ball to the ball support surface.

A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

Methods and apparatuses for restoration of human or animal bone anatomy, which may include introduction, into a bone of an expansible implant capable of expansion in a single determined plane, positioning the expansible implant in the bone in order to correspond the single determined plane with a bone restoration plane and opening out the expansible implant in the bone restoration plane. A first support surface and a second support surface spread tissues within bone. The embodiments of the invention may also include injecting a filling material around the implant.

A suction assisted ablation device having a support surface, suction elements disposed adjacent the support surface, at least one electrode and at least one suction conduit is provided. The device may further include fluid openings, which allow fluid to irrigate target tissue and aid in ablation. A method for ablating tissue using suction is also provided.

Apparatus for producing an object by sequentially forming thin layers of a construction material one on top of the other responsive to data defining the object, the apparatus comprising: a plurality of printing heads each having a surface formed with a plurality of output orifices and controllable to dispense the construction material through each orifice independently of the other orifices; a shuttle to which the printing heads are mounted; a support surface; and a controller adapted to control the shuttle to move back and forth over the support surface and as the shuttle moves to control the printing heads to dispense the construction material through each of their respective orifices responsive to the data to form a first layer on the support surface and thereafter, sequentially the other layers; wherein each printing head is dismountable from the shuttle and replaceable independently of the other printing heads.

A tray 15 for a dry etching apparatus 1 has substrate accommodation holes 19A to 19D penetrating thickness direction and a substrate support portion 21 supporting an outer peripheral edge portion of a lower surface 2a of a substrate 2. A dielectric plate 23 has a tray support surface 28 supporting a lower surface of the tray 15, substrate placement portions 29A through 29D inserted from a lower surface side of the tray 15 into the substrate accommodation holes 19A through 19D and having a substrate placement surface 31 at its upper end surface for placing the substrate 2. A dc voltage applying mechanism 43 applies a dc voltage to an electrostatic attraction electrode 40. A heat conduction gas supply mechanism 45 supplies a heat conduction gas between the substrate 2 and substrate placement surface 31. The substrate 2 can be retained on the substrate placement surface 31 with high degree of adhesion. This results in that the cooling efficiency of the substrate 2 is improved and processing is uniformed at the entire region of the substrate surface including the vicinity of the outer peripheral edge.

A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with locks for restraining wafers against upward movement away from the support surfaces. Constraining the wafers against upward movement limits the effect of wafer distortion on the spacing between the wafer and the floor surfaces, and thus limits the effects of wafer distortion on heat transfer. The carrier may include a main portion and minor portions having higher thermal conductivity than the main portion, the minor portions being disposed below the pockets.

Methods and apparatuses for restoration of human or animal bone anatomy, which may include introduction, into a bone of an expansible implant capable of expansion in a single determined plane, positioning the expansible implant in the bone in order to correspond the single determined plane with a bone restoration plane and opening out the expansible implant in the bone restoration plane. A first support surface and a second support surface spread tissues within bone. The embodiments of the invention may also include injecting a filling material around the implant.

A fabricated microstructure comprising at least one protrusion capable of providing an adhesive force at a surface of between about 60 and 2,000 nano-Newtons. A stalk supports the protrusion at an oblique angle relative to a supporting surface. The microstructure can adhere to different surfaces.

A process chamber and a method for controlling the temperature of a substrate positioned on a substrate support assembly within the process chamber are provided. The substrate support assembly includes a thermally conductive body, a substrate support surface on the surface of the thermally conductive body and adapted to support a large area substrate thereon, one or more heating elements embedded within the thermally conductive body, and two or more cooling channels embedded within the thermally conductive body to be coplanar with the one or more heating elements. The cooling channels may be branched into two or more equal-length cooling passages being extended from a single point inlet and into a single point outlet to provide equal resistance cooling.

A suction assisted ablation device having a support surface, suction elements disposed adjacent the support surface, at least one electrode and at least one suction conduit is provided. The device may further include fluid openings, which allow fluid to irrigate target tissue and aid in ablation. A method for ablating tissue using suction is also provided.

Susceptor plates are provided for high temperature (e.g., greater than 1000° C.) batch processing of silicon wafers. The susceptor plates are designed to accommodate one wafer each, and a plurality of loaded susceptor plates are vertically spaced apart in a susceptor plate holder during batch or furnace processing. The susceptor plates provide “full” support beneath the wafers, with openings of at most 20 mm in diameter in the support surface. Protrusions are also kept to a minimum. The susceptor plates thus prevent the wafers from sagging beyond the point of plastic deformation. The support surface is also ground or polished to remove protrusions beyond a prescribed height. For a given treatment temperature, the susceptor plates permit higher ramp rates without wafer plastic deformation or sticking to the susceptor plate. In one embodiment, the susceptor plates are pre-bent in a direction opposing the direction of sag.

A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of + / −5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.

A bulb comprises a seat; a plurality of metal heat sink each having two fixing surfaces, one fixing surface being fixed with an light emitting chip; and one end of each metal heat sink being placed into an insulated frame and then being fixed to a supporting surface of a heat conductive base; the metal heat sinks having an effect of absorbing heat energy and then transferring heat to the seat so as to dissipate heat; the metal heat sinks being integrally formed with the bulb base and then being combined to the seat; the heat conductive base having an inclined surface which is advantageous to reflect light from a light emitting diode so as to increase the illumination of the light emitting chip; and a metal adhesive layer being assembled to the supporting surface of the heat conductive base and the fixing surfaces of the metal heat sinks.