5170 results about "Thermal radiation" patented technology

A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.

Disclosed is a susceptor which achieves uniform temperature distribution of a wafer placed on the susceptor, and also disclosed is a substrate processing apparatus provided with the susceptor. An annular recess 12a is formed in an intermediate portion between the central portion and the peripheral portion of a wafer support surface of the susceptor 12. Due to the provision of the recess, the substrate heating effect by thermal radiation from the susceptor is suppressed in the intermediate portion. The geometrical dimension of the recess is determined taking the chamber internal pressure into consideration.

Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.

In addition to the effect of harmonized illumination and increased heat radiation, a LED illumination lamp provides an improved effect of hermetic seal, anti-vibration and waterproofing between components and assures prolonged life span. The illumination lamp comprises a body adapted to be placed on or around a target illumination object, a LED module lying inside the body and a cover mounted on a seat part of the body. The LED module has a printed circuit board affixed to the body and a group of red, green and blue LEDs attached to the printed circuit. The cover is provided with a semitransparent color-producing part capable of harmonizing colors of the light emitted from the LEDs and an air passageway for permitting the heat generated from the LED module to dissipate to the outside.

An improved method and an improved instrument for analyte determination that uses infrared radiation naturally emitted by subject are disclosed. The method is based on Thermal Emission Spectroscopy (TES) whereby the spectral signal is measured in reference to a body's physiological and ambient parameters. The instrument that realizes the method incorporates temperature and humidity sensors. Ambient environmental parameters and subject parameters as disclosed allow normalization of spectrally specific analyte signal for grater precision and accuracy of analytes concentration determination. Such improvement leads to a universal calibration in, for example, non-invasive blood glucose measurements in human subjects.

A radiation-heated fluidized-bed reactor and a process for producing high-purity polycrystalline silicon by using this reactor are provided. In this reactor, a heater device (14) is a radiation source for thermal radiation which is arranged outside the inner reactor tube and as a cylinder around the heater zone, without being in direct contact with the inner reactor tube. The inner reactor tube is designed in such a manner that it uses thermal radiation to heat the silicon particles in the heating zone to a temperature which is such that the reaction temperature is established in the reaction zone.

An LED lighting device has high cooling efficiency and long life with a plurality of high-intensity LEDs mounted thereto. The LED lighting device is composed of a light emission part provided with a plurality of LEDs and a heat radiator for the LEDs, a power source part generating a current to be supplied to the LEDs from a commercial power source, and an air circulation part for circulating ambient air. The light emission part and the power source part are thermally separated by the air circulation part. The light emission part is provided with an annular heat radiation base having a hole formed at a central portion thereof and a substrate attaching face formed around the hole, and an LED substrate which is attached to the substrate attaching face and on which a plurality of LED chips are mounted. The heat radiation base has heat radiation fins as the heat radiator which are formed on an outer periphery of the heat radiation base and on an inner periphery of the hole. By the presence of the air circulating part, little heat generated from the power source part is transmitted to the light emission part. Therefore, it is possible to accomplish desired designing of heat radiation of the light emission part concerned with intensity and life of an LED, which is critical to performance of an LED lighting device.

Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is released therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.

A non-contact infrared (IR) thermometer for measuring temperature from the surface of an object includes an IR radiation sensor attached to a heating element and a thermal shield having an interior surface positioned within the sensor's field of view that has a high emissivity. An electronic circuit controlling the heating element maintains the temperatures of the sensor and shield substantially close to an anticipated surface temperature of the object. The IR radiation sensor is further thermally coupled to a reference temperature sensor. An optical system positioned in front of the shield focuses thermal radiation from the object on the surface of the sensor, while the shield prevents stray radiation from reaching the sensor. Signals from the IR and reference sensors are used to calculate the object's surface temperature.

An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

For achieving small-sizing and high efficiency by improving heat radiation of coils, and further for simple-construction to be easily disassembled, thereby being environment-friendly from a view point of recycling, an electric rotating machine comprising: a stator 1a being constructed by inserting coils 10a into slots 11 of a stator core 2a; an outer frame 4 being divided into a plurality thereof, so as to cover periphery of the stator core of said stator; a pair of bearing holder portions 6a and 6b, each having a fitting portion 35a or 35b to be fitted into an inner diameter reference surface 25a at both end portions of said stator and being provided with a bearing 8a or 8b at an axial center portion thereof, and being attached at both sides of said stator core so as to cover coil end portions dropping out at both sides of said stator; a squeezing mechanism (30, 32a, 32b, 6a, 6b) fixing the outer frame at an outer periphery of the stator core, by a wedge function between each of the bearing holder portions and the outer frame due to a squeezing function of attaching the each of said pair of bearing holder portions at both sides of said stator core; and a rotor 3 being formed with an escaping portion for escaping from an outer diameter of a portion opposing to a fitting portion of each of said bearing holder portion, rotatably positioned within said stator core.

There is provided a high power LED package and a method of manufacturing the same. The method includes: forming at least one chip mounting part and at least one through hole in a metal plate; forming an insulating layer of a predetermined thickness on an entire outer surface of the metal plate; forming an electrode part to be electrically connected to a light emitting chip mounted on the chip mounting part; and cutting the metal plate along a trimming line to separate the package. The LED package is free from thermal impact resulting from different thermal coefficients among components, thus ensuring stable heat radiation characteristics in a high temperature atmosphere. Also, the LED package is minimized in optical loss to improve optical characteristics. In addition, the LED package is simplified in a manufacturing and assembly process and thus can be manufactured in mass production at a lower cost.

In an apparatus for manufacturing a ceramic thin film by employing a thermal CVD method, an internal jig, which is provided with a heat radiation material film on the surface, is provided at a position that faces a substrate (S) on which the film is to be formed. The thin film and a semiconductor device are manufactured using such apparatus.

Disclosed herein is a device for controlling the temperature of batteries for electric vehicles. The device includes a thermoelectric semiconductor unit, a thermoelectric semiconductor unit, a temperature sensor, and a battery controller. The thermoelectric semiconductor unit is configured such that a portion thereof is exposed in a battery tray. The thermoelectric semiconductor unit controller causes the thermoelectric semiconductor unit to radiate heat, and causes the thermoelectric semiconductor unit to absorb heat. The temperature sensor detects and outputs the temperature of the battery tray. The battery controller outputs the heat radiating control signal to the thermoelectric semiconductor unit controller when the temperature detected by the temperature sensor is lower than a predetermined value, and outputting the heat absorbing control signal to the thermoelectric semiconductor unit controller when the temperature detected by the temperature is equal to or higher than the predetermined value.

A stack package with improved heat radiation capability and a module having the stack package mounted thereon are provided in which the back surfaces of first and second chips are exposed through the bottom and top surfaces of the stack package, allowing improved heat radiation capability as well as reduced thickness of the stack package. A heat sink may be attached to the stack package for increasing heat radiation capability. A solder bonding portion may be formed between the stack package and a module substrate, establishing good solder bondability between the stack package and the module substrate.

A backlight unit and an LCD employing the backlight unit are provided. The backlight unit includes: a plurality of division areas; a light source which is able to be lighted and is disposed on one sidewall surface of a barrier rib defining the plurality of division areas; and a heat radiation device disposed on an opposite wall surface of the barrier rib to the one sidewall surface, wherein each of the plurality of division areas is constructed to bi-divide light reflection and heat radiation.