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6390 results about "Exposure" patented technology

In photography, exposure is the amount of light per unit area (the image plane illuminance times the exposure time) reaching a photographic film or electronic image sensor, as determined by shutter speed, lens aperture and scene luminance. Exposure is measured in lux seconds, and can be computed from exposure value (EV) and scene luminance in a specified region.

Microlithographic projection exposure apparatus

InactiveUS20050068499A1Simple structureReliable and low-maintenance operationProjectorsPhotomechanical exposure apparatusCamera lensPhysics
A microlithographic projection exposure apparatus contains an illumination system (12) for generating projection light (13) and a projection lens (20; 220; 320; 420; 520; 620; 720; 820; 920; 1020; 1120) with which a reticle (24) that is capable of being arranged in an object plane (22) of the projection lens can be imaged onto a light-sensitive layer (26) that is capable of being arranged in an image plane (28) of the projection lens. The projection lens is designed for immersion mode, in which a final lens element (L5; L205; L605; L705; L805; L905; L1005; L1105) of the projection lens on the image side is immersed in an immersion liquid (34; 334a; 434a; 534a). A terminating element (44; 244; 444; 544; 644; 744; 844; 944; 1044; 1144) that is transparent in respect of the projection light (13) is fastened between the final lens element on the image side and the light-sensitive layer.
Owner:CARL ZEISS SMT GMBH

Up and down conversion systems for production of emitted light from various energy sources

A system for energy upconversion and / or down conversion and a system for producing a photostimulated reaction in a medium. These systems include 1) a nanoparticle configured, upon exposure to a first wavelength λ1 of radiation, to generate a second wavelength λ2 of radiation having a higher energy than the first wavelength λ1 and 2) a metallic structure disposed in relation to the nanoparticle. A physical characteristic of the metallic structure is set to a value where a surface plasmon resonance in the metallic structure resonates at a frequency which provides a spectral overlap with either the first wavelength λ1 or the second wavelength λ2, or with both λ1 and λ2. The system for producing a photostimulated reaction in a medium includes a receptor disposed in the medium in proximity to the nanoparticle which, upon activation by the second wavelength λ2, generates the photostimulated reaction.
Owner:DUKE UNIV +1

Electronic image sensor

An electronic imaging sensor. The sensor includes an array of photo-sensing pixel elements for producing image frames. Each pixel element defines a photo-sensing region and includes a charge collecting element for collecting electrical charges produced in the photo-sensing region, and a charge storage element for the storage of the collected charges. The sensor also includes charge sensing elements for sensing the collected charges, and charge-to-signal conversion elements. The sensor also includes timing elements for controlling the pixel circuits to produce image frames at a predetermined normal frame rate based on a master clock signal (such as 12 MHz or 10 MHz). This predetermined normal frame rate which may be a video rate (such as about 30 frames per second or 25 frames per second) establishes a normal maximum per frame exposure time. The sensor includes circuits (based on prior art techniques) for adjusting the per frame exposure time (normally based on ambient light levels) and novel frame rate adjusting features for reducing the frame rate below the predetermined normal frame rate, without changing the master clock signal, to permit per frame exposure times above the normal maximum exposure time. This permits good exposures even in very low light levels. (There is an obvious compromise of lowering of the frame rate in conditions of very low light levels, but in most cases this is preferable to inadequate exposure.) These adjustments can be automatic or manual.
Owner:E PHOCOS

Device And Method For Processing Light-Polymerizable Material For Building Up An Object In Layers

A method and a device for processing a light-polymerizable material (5, 55) for building up an object (27) in layers, using a lithography based generative manufacture having a construction platform (12) for building up the object (27), a projecting exposure unit (10, 60) that can be controlled for locally selected exposing of a surface on the construction platform (12, 62) to an intensity pattern having a prescribed shape, and a control unit (11, 61) prepared for polymerizing overlapping layers (28) on the construction platform (12, 62) in successive exposure steps, each having a prescribed geometry, by controlling the projecting exposure unit (10, 60), in order to thus successively build up the object (27) in the desired shape, said shape resulting from the sequence of layer geometries. The invention is characterized in that a further exposure unit (16, 66) for exposing the surface of the construction platform (12, 62) is provided on the side opposite the projecting exposure unit (10, 60), and that the construction platform (12, 62) is designed to be at least partially transparent to light, and that the control unit (11, 61) is designed for controlling the further exposure unit (16, 66) at least while building up the first layer (28), said layer adhering to the construction platform (12, 62), for exposing in the prescribed geometry.
Owner:VIENNA UNIVERSITY OF TECHNOLOGY +1

Image recording material

A heat mode type negative image recording material is provided which comprises (A) a polymer compound that is insoluble in water but is soluble in an alkali aqueous solution and has at least one of groups represented by general formulae (1) to (3) on a side chain; (B) a photothermal conversion agent; and (C) an onium salt compound forming radicals by heat mode exposure with light that is capable of being absorbed by said photothermal conversion agent (B), said heat mode type negative image recording material being capable of recording an image by heat mode exposure. The general formulae are defined in the specification.
Owner:FUJIFILM CORP

System and method for lithography process monitoring and control

In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and / or evaluating optical lithographic equipment, methods, and / or materials used therewith, for example, photomasks. In one embodiment, the system, sensor and technique measures, collects and / or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and / or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a product-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and / or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. In this way, the aerial image used, generated or produced to measure, inspect, characterize and / or evaluate the photomask is the same aerial image used, generated or produced during wafer exposure in integrated circuit manufacturing. In another embodiment, the system, sensor and technique characterizes and / or evaluates the performance of the optical lithographic equipment, for example, the optical sub-system of such equipment. In this regard, in one embodiment, an image sensor unit measures, collects, senses and / or detects the aerial image produced or generated by the interaction between lithographic equipment and a photomask having a known, predetermined or fixed pattern (i.e., test mask). In this way, the system, sensor and technique collects, senses and / or detects the aerial image produced or generated by the test mask—lithographic equipment in order to inspect, evaluate and / or characterize the performance of the lithographic equipment.
Owner:ASML NETHERLANDS BV
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