114results about How to "Reduce size and thickness" patented technology

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

An image display module include a flat panel display, a sound source element disposed on a rear surface side opposite to a display observation side of the panel display, and a sound leading path through which a sound wave generated from the sound source element is led to the display observation side.

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

An electro-optical device includes a frame including a conduction part and a resin part, an electro-optical panel that is housed in the inner side of the resin part, and an exposure part that is formed by exposing the conduction part from the resin part. The exposure part is disposed to face at least a part of an end face of the electro-optical panel or protrude from a surface of the electro-optical panel over the end face.

An image recording apparatus including: a sheet-supply cassette which accommodates a stack of recording sheets and which is insertable into and removable from a main body of the apparatus; an end wall which is disposed at a downstream end of the cassette in a sheet-supply direction in which the sheets are supplied, so as to extend in a direction perpendicular to the sheet-supply direction and which has a height larger than that of a maximum number of the sheets that can be accommodated in the cassette; an image recording unit disposed in the main body for recording an image on the sheets; an arm disposed in the main body and pivotable about a shaft which extends in the direction perpendicular to the sheet-supply direction; a sheet-feed roller which is disposed at a free end of the arm and which is, in a state in which the cassette is inserted into the main body, in contact with an uppermost one of the sheets accommodated in the cassette and which feeds the uppermost one of the sheets toward the image recording unit; and a link mechanism which is disposed in the main body for raising and lowering the roller and the arm and which cooperates with the end wall to retract the roller and the arm above the cassette when the cassette is inserted into and removed from the main body.

Disclosed is a hinge device for a mobile phone having a rotation type display including a body housing, a folder having a display unit, and a connection member for rotatably connecting the folder to the body housing such that the folder is rotatably moved into an open position or a closed position with respect to the body housing. The hinge device includes a hinge module having a plate shape. The hinge module is accommodated in the folder and rotatably coupled to the connection member while facing the connection member so as to rotate the folder relative to the connection member about a hinge axis thereof.

An image recording apparatus including: a sheet-supply cassette which accommodates a stack of recording sheets and which is insertable into and removable from a main body of the apparatus; an end wall which is disposed at a downstream end of the cassette in a sheet-supply direction in which the sheets are supplied, so as to extend in a direction perpendicular to the sheet-supply direction and which has a height larger than that of a maximum number of the sheets that can be accommodated in the cassette; an image recording unit disposed in the main body for recording an image on the sheets; an arm disposed in the main body and pivotable about a shaft which extends in the direction perpendicular to the sheet-supply direction; a sheet-feed roller which is disposed at a free end of the arm and which is, in a state in which the cassette is inserted into the main body, in contact with an uppermost one of the sheets accommodated in the cassette and which feeds the uppermost one of the sheets toward the image recording unit; and a link mechanism which is disposed in the main body for raising and lowering the roller and the arm and which cooperates with the end wall to retract the roller and the arm above the cassette when the cassette is inserted into and removed from the main body.

A disk drive includes base with a spindle motor, first and second rockers and first and second sliders. The spindle motor has a turntable to mount a disk. The first and second rockers rock substantially parallelly to the turntable. The first rocker pulls in the disk, inserted externally, to a position where the disk and motor have their centers aligned. The second rocker unloads the disk from the position to a point where the disk is exposed partially. The first and second sliders are engaged with the first and second rockers to make them pull in and unload the disk, respectively, and reciprocate substantially parallelly to the turntable. The rockers and sliders are located under the turntable. The slider(s) support(s), raise(s) and lower(s) a side face of the base through the reciprocation.

An image blur correction apparatus according to the present invention includes a base, a movable holding member, a support mechanism that supports the movable holding member to be movable within a plane vertical to an optical axis of a lens, a driving means for driving the movable holding member, a position detecting means, and a returning means for returning the movable holding member to a pause position, wherein the driving means includes coils (121, 131) fixed to the base and drive magnets (122, 132) fixed to the movable holding member, the returning means includes return magnets (161, 162) fixed to the base to face the drive magnets, the position detecting means includes magnetic sensors (171, 172) fixed to the base, and the support mechanism includes at least three concave portions (104) provided on the base, at least three spheres (150) rollably arranged in the concave portions, and at least three abutment surfaces (114) provided on the movable holding member to abut on the spheres. With this arrangement, the lens can be automatically centered while achieving simplification of the structure and miniaturization.

The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.

A plurality of first conductor patterns (200) are insular electrode patterns located at a first layer. The first conductor patterns (200) are arranged in a repetitive pattern and are separated from each other. A second conductor pattern (100) is located at a second layer parallel to the first layer, and extends in a sheet shape in a region opposite the plurality of first conductor patterns (200). An opening (300) is provided in each of the plurality of first conductor patterns (200). Third conductor patterns (400) are located at the first layer and disposed in each of a plurality of openings (300). The third conductor patterns (400) are separated from the first conductor patterns (200). Connection conductors (500) connect the third conductor patterns (400) to the first conductor patterns (200).

A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

A polarizing film assembly includes a polarizing film, a speaker film, a vibration improving layer, and a line member. The polarizing film includes a polarizer layer transmitting a vibrating component of light in parallel with an axis of polarization. The speaker film is disposed on the polarizing film to change an electric signal into a mechanical vibration to generate a sound. The vibration improving layer is interposed between the polarizing film and the speaker film to improve the mechanical vibration of the speaker film. The line member is electrically connected to the speaker film to transmit the electric signal. Therefore, display is small-sized, lightweight and improved in sound quality.

A magnetic detection device of the present invention includes at least one pair of first magnetosensitive bodies each comprising a soft magnetic material extending in a first axis direction and being sensitive to an external magnetic field oriented in the first axis direction; and a magnetic field direction changer comprising a soft magnetic material and changing an external magnetic field oriented in a different axis direction from the first axis direction into a measurement magnetic field having a component in the first axis direction which can be detected by the at least one pair of first magnetosensitive bodies. With this magnetic detection device, the external magnetic field oriented in the different axis direction can be detected by way of the first magnetosensitive bodies. As a result, while attaining magnetic detection with high accuracy, the magnetic detection device can be reduced in size or thickness by omitting a magnetosensitive body extending long in the different axis direction.

There is provided a near-infrared cut filter which has a visible light transmitting property and a near-infrared shielding property both at high levels by that its transmission spectrum has a steep inclination in the vicinity of the boundary between the visible light and the near-infrared, and which can also be sufficiently reduced in size and thickness. The near-infrared cut filter has a near-infrared absorbing layer which contains a near-infrared absorbing dye containing at least one dye in which a condensed ring structure containing at least a benzene ring and a ring having nitrogen atom is bonded to both sides of a squarylium skeleton and which have a carboxylic acid amide structure at a second position of the benzene ring (where the carboxylic acid has a substituent having 5 to 25 having one or more branches), and a transparent resin with a refractive index of 1.45 or more.

There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.

A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

A planar light source directly mixes three colors of light from light-emitting diodes into white light. The planar light source has a plurality of red (2r), green (2g) and blue (2b) light-emitting diodes mounted on a mount surface of a substrate to define a plurality of light source sets, each having mutually adjacent red, green and blue light-emitting diodes, and further has first and second prism sheets (PS1 and PS2) stacked to face the mount surface. The stacked prism sheets receive and mix three colors of light from the light-emitting diodes constituting each light source set and emit lights from the red, green and blue light-emitting diodes of each of the light source sets as white light.

In the present invention, a first circuit pattern 3 composing a semiconductor element is formed on the front side of a substrate 1, a first insulating layer 2 is formed on the first circuit pattern 3, solder electrodes 5 for external connection are formed on the first insulating layer 2, a second insulating layer 6 is formed on the backside of the substrate 1, a second circuit pattern 7 is formed on the second insulating layer 6, through vias 8 are formed to connect the first circuit pattern 3 and the second circuit pattern 7, chip passive components 9 are placed on the second circuit pattern 7, and the backside of the substrate is integrally molded with epoxy resin 10 such that the epoxy resin 10 covers the chip passive components 9.

A variable capacitance element includes a piezoelectric substrate, a buffer layer located on the piezoelectric substrate with an orientation, a dielectric layer located on the buffer layer and having a relative dielectric constant that varies in accordance with an applied voltage, and a first electrode and a second electrode arranged to apply an electric field to the dielectric layer.

A method for manufacturing a thin but robust stack of electrically connected thin film semiconductor elements includes the steps of forming a first element to be stacked: forming a separation layer and a semiconductor element layer over a substrate, forming a wiring connected to the semiconductor element layer, forming a protective material over the semiconductor layer and the wiring, forming a conductive region electrically connected to the wiring in the protective layer, and separating the semiconductor element layer from the substrate along the separation layer. A second element is formed according to the aforementioned process, and the first element is stacked thereon, before separating the second element from its substrate. The first element is bonded to the protective layer of the second element so that the semiconductor element layers of the first and the second element are electrically connected to each other through the protective layer, without damaging the protective layer.

Disclosed is a hinge device for a mobile phone having a rotation type display including a body housing, a folder having a display unit, and a connection member for rotatably connecting the folder to the body housing such that the folder is rotatably moved into an open position or a closed position with respect to the body housing. The hinge device includes a hinge module having a plate shape. The hinge module is accommodated in the folder and rotatably coupled to the connection member while facing the connection member so as to rotate the folder relative to the connection member about a hinge axis thereof.

Disclosed is a semiconductor package wherein a semiconductor chip is mounted on one surface of a substrate. In this semiconductor package, an inflection point forming portion made of a material having a higher coefficient of thermal expansion than the substrate is formed in a part of the substrate surface on which the semiconductor chip is mounted.

A non-aqueous electrolyte cell is provided having improved cell characteristics and which maintains a cell shape encapsulated in a laminate film even when overdischarged to a cell voltage of 0 V. The cell includes an anode, an electrolyte, and a cathode containing a compound having the formula LixFe1-yMyPO4, wherein 0.05≦x≦1.2 and 0≦y≦0.8, and wherein M is at least one element selected from the group consisting of Mn, Cr, Co, Cu, Ni, V, Mo, Ti, Zn, Al, Ga, Mg, B and Nb. Exposed portions of an anode current collector and a cathode current collector prevent internal shorting of the cell.