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110893results about "Final product manufacture" patented technology

System and method for recharging a battery exposed to a harsh environment

A rechargable battery with an internal microcontroller. The microcontroller contains a memory in which data regarding the environment to which the battery is exposed are stored. These data are read by a processor integral with the charger used to charge the battery. If these data indicates the battery may have been subjected to a harsh environment for an excessive period of time, the charger performs a complete state of health evaluation of the battery.
Owner:STRYKER CORP

Wind turbine and a shaft for a wind turbine

A drive shaft for a wind turbine is shaped so as to allow for increased bending of the shaft, while being suitable for transferring torque in a wind turbine system. An example of such a shaping is a drive shaft having a helical rib defined on the surface of the shaft. A wind turbine incorporating such a shaft, and a method of manufacture of such a shaft are also described.
Owner:ENVISION ENERGY DENMARK

Lithium-Ion Secondary Battery

A lithium-ion secondary battery includes: a winding body in a coil formation at a battery container, the winding body wrapping a cathode film in which lithium ions store and from which lithium ions extract and a anode film in which lithium ions store and from which lithium ions extract, and the cathode film and the anode film being electrically separated from each other via a porous separator; and a heat sink disposed inside the battery container, which contacts the battery container and transmits heat inside the winding body to the battery container.
Owner:HITACHI LTD

Nanostructure and nanocomposite based compositions and photovoltaic devices

Nanocomposite photovoltaic devices are provided that generally include semiconductor nanocrystals as at least a portion of a photoactive layer. Photovoltaic devices and other layered devices that comprise core-shell nanostructures and / or two populations of nanostructures, where the nanostructures are not necessarily part of a nanocomposite, are also features of the invention. Varied architectures for such devices are also provided including flexible and rigid architectures, planar and non-planar architectures and the like, as are systems incorporating such devices, and methods and systems for fabricating such devices. Compositions comprising two populations of nanostructures of different materials are also a feature of the invention.
Owner:NANOSYS INC

Optical systems fabricated by printing-based assembly

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and / or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
Owner:X DISPLAY CO TECH LTD +1

Stretchable semiconductor elements and stretchable electrical circuits

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS

Flexible high-temperature ultrabarrier

A flexible barrier assembly having a flexible visible light-transmissive substrate having a Tg greater than or equal to that of heat-stabilized polyethylene terephthalate (“HSPET”) overcoated with a first polymer layer having a Tg greater than or equal to that of HSPET and further overcoated with at least two visible light-transmissive inorganic barrier layers separated by at least one second polymer layer having a Tg greater than or equal to that of HSPET can be used to mount, cover, encapsulate or form moisture- and oxygen-sensitive articles such as organic light emitting devices and light valves.
Owner:3M INNOVATIVE PROPERTIES CO

Release strategies for making transferable semiconductor structures, devices and device components

Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS

Slotted insulator for unsealed electrode edges in electrochemical cells

In fabrication of conventional spirally wound cells, a length of separator is provided at least twice as long as one of the electrodes, for example, the cathode, and then folded to cover both sides of the electrode. The separator is also somewhat wider than the covered electrode to extend beyond the upper and lower edges thereof. The cathode assembly is then placed along side a strip of anode material and rolled into a jellyroll configuration. The separator sheet is not sealed at the opposed upper and lower edges of the cathode, and during high shock and vibration conditions the edges tend to mushroom which can lead to short circuit conditions. The insulator of the present invention is a slotted member that covers the upper and lower edges of the other electrode not covered by the separator, for example the anode with the anode leads extending through the slots to shield them from short circuit conditions with the cell casing or other leads if the cell should be subjected to severe shock forces and the like.
Owner:WILSON GREATBATCH LTD

Method of doping organic semiconductors with quinone derivatives and 1, 3, 2 - dioxaborine derivatives

The invention relates to the use of an organic mesomeric compound as organic dopant for doping an organic semiconducting matrix material for varying the electrical properties thereof. In order to be able to handle organic semiconductors more easily in the production process and to be able to produce electronic components with doped organic semiconductors more reproducibly, a quinone or quinone derivative or a 1,3,2-dioxaborine or a 1,3,2-dioxaborine derivative may be used as a mesomeric compound, which under like evaporation conditions has a lower volatility than tetrafluorotetracyanoquinonedimethane (F4TCNQ).
Owner:KUEHL OLAF +4

Remote Hydrogen Plasma With Ion Filter for Terminating Silicon Dangling Bonds

Apparatus and methods for repairing silicon dangling bonds resulting from semiconductor processing are disclosed. The silicon dangling bonds can be repaired by introducing hydrogen radicals with substantially no hydrogen ions into the processing chamber to react with the silicon dangling bonds, eliminating them.
Owner:APPLIED MATERIALS INC

Process for producing semiconductor article

A process for producing a semiconductor article is provided which comprises the steps of bonding a film onto a substrate having a porous semiconductor layer, and separating the film from the substrate at the porous semiconductor layer by applying a force to the film in a peeling direction.
Owner:CANON KK

Solid-state imaging device, method of manufacturing the same, and electronic apparatus

A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.
Owner:SONY CORP

Hybrid Group IV/III-V Semiconductor Structures

Described herein are semiconductor structures comprising (i) a Si substrate; (ii) a buffer region formed directly over the Si substrate, wherein the buffer region comprises (a) a Ge layer having a threading dislocation density below about 105 cm−2; or (b) a Ge1-xSnx layer formed directly over the Si substrate and a Ge1-x-ySixSny layer formed over the Ge1-xSnx layer; and (iii) a plurality of III-V active blocks formed over the buffer region, wherein the first III-V active block formed over the buffer region is lattice matched or pseudomorphically strained to the buffer region. Further, methods for forming the semiconductor structures are provided and novel Ge1-x-ySixSny, alloys are provided that are lattice matched or pseudomorphically strained to Ge and have tunable band gaps ranging from about 0.80 eV to about 1.4O eV.
Owner:ARIZONA STATE UNIVERSITY

Solar cell and method of manufacture

A solar cell that is readily manufactured using processing techniques which are less expensive than microelectronic circuit processing. In preferred embodiments, printing techniques are utilized in selectively forming masks for use in etching of silicon oxide and diffusing dopants and in forming metal contacts to diffused regions. In a preferred embodiment, p-doped regions and n-doped regions are alternately formed in a surface of the wafer in offset levels through use of masking and etching techniques. Metal contacts are made to the p-regions and n-regions by first forming a seed layer stack that comprises a first layer such as aluminum that contacts silicon and functions as an infrared reflector, second layer such titanium tungsten that acts as diffusion barrier, and a third layer functions as a plating base. A thick conductive layer such as copper is then plated over the seed layer, and the seed layer between plated lines is removed. A front surface of the wafer is preferably textured by etching or mechanical abrasion with an antireflection layer provided over the textured surface. A field layer can be provided in the textured surface with the combined effect being a very low surface recombination velocity.
Owner:MAXEON SOLAR PTE LTD +1

Apparatus for depositing a uniform silicon film and methods for manufacturing the same

Methods and apparatus having a gradient spacing created between a substrate support assembly and a gas distribution plate for depositing a silicon film for solar cell applications are provided. In one embodiment, an apparatus for depositing films for solar cell applications may include a processing chamber, a substrate support disposed in the processing chamber and configured to support a quadrilateral substrate thereon, and a gas distribution plate disposed in the processing chamber above the substrate support, wherein a bottom surface of the gas distribution plate has a perimeter that includes edges and corners, and wherein the corners of the gas distribution plate are closer to the substrate support than the edges of the gas distribution plate.
Owner:APPLIED MATERIALS INC

Ordered Nanoscale Domains by Infiltration of Block Copolymers

A method of preparing tunable inorganic patterned nanofeatures by infiltration of a block copolymer scaffold having a plurality of self-assembled periodic polymer microdomains. The method may be used sequential infiltration synthesis (SIS), related to atomic layer deposition (ALD). The method includes selecting a metal precursor that is configured to selectively react with the copolymer unit defining the microdomain but is substantially non-reactive with another polymer unit of the copolymer. A tunable inorganic features is selectively formed on the microdomain to form a hybrid organic / inorganic composite material of the metal precursor and a co-reactant. The organic component may be optionally removed to obtain an inorganic feature s with patterned nanostructures defined by the configuration of the microdomain.
Owner:UCHICAGO ARGONNE LLC

Gas distribution blocker apparatus

Embodiments of the present invention generally provide apparatus and methods for altering the flow and pressure differential of process gases supplied across a showerhead of a processing chamber to provide improved deposition uniformity across the surface of a substrate disposed therein. In one embodiment, a blocker plate is disposed between a backing plate and a showerhead. In one embodiment, the distance between the blocker plate and the showerhead is adjustable. In another embodiment, the blocker plate has a non-planar surface contour. In another embodiment, a regional blocker plate is disposed between a backing plate and a showerhead. In another embodiment, a central blocker plate and a peripheral blocker plate are disposed between a backing plate and a showerhead.
Owner:APPLIED MATERIALS INC

Vehicle, display device and manufacturing method for a semiconductor device

To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a light emitting element attached to a base with a curved surface. A layer to be peeled, which contains a light emitting element furnished to a substrate using a laminate of a first material layer which is a metallic layer or nitride layer, and a second material layer which is an oxide layer, is transferred onto a film, and then the film and the layer to be peeled are curved, to thereby produce a display having a curved surface.
Owner:SEMICON ENERGY LAB CO LTD

Resilient contact structures formed and then attached to a substrate

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.
Owner:FORMFACTOR INC

Back-contact photovoltaic cells

A photovoltaic cell comprising a wafer comprising a semiconductor material of a first conductivity type, the wafer comprising a first light receiving surface and a second surface opposite the first surface; a first passivation layer positioned over the first surface of the wafer; a first electrical contact positioned over the second surface of the wafer; a second electrical contact positioned over the second surface of the wafer and separated electrically from the first electrical contact; a second passivation layer positioned over the second surface of the wafer in the region on the wafer that is at least between the first electrical contact and the second surface of the wafer; and a layer comprising a semiconductor material of a conductivity opposite the conductivity of the wafer and positioned in the region between the second passivation layer and the first contact.
Owner:BP CORP NORTH AMERICA INC

Flexible organic light emitting display device and method for manucaturing the same

There is provided a flexible display having a new wire structure and a new insulating layer structure. A flexible display includes a flexible substrate having a first area and a second area. The second area is curved in a non-zero angle relative to the plane of the first area. The flexible display further includes a plurality of wires that extend over from the first area to the second area of the flexible substrate. Each of the wires is covered by an upper insulating pattern, which is separated from other upper insulating pattern. Each upper insulating pattern covering the wire has substantially the same trace pattern shape of the corresponding wire thereunder. Accordingly, by adopting the above-described wire structure and upper insulating layer structure, crack generation and propagation in the wires and the insulating layers from bending of the flexible display can be minimized.
Owner:LG DISPLAY CO LTD
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