2988 results about "Microlens" patented technology

A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.

In part, the invention relates to a lens assembly. The lens assembly includes a micro-lens; a beam director in optical communication with the micro-lens; and a substantially transparent film. The substantially transparent film is capable of bi-directionally transmitting light, and generating a controlled amount of backscatter. In addition, the film surrounds a portion of the beam director.

Imager arrays, array camera modules, and array cameras in accordance with embodiments of the invention utilize pixel apertures to control the amount of aliasing present in captured images of a scene. One embodiment includes a plurality of focal planes, control circuitry configured to control the capture of image information by the pixels within the focal planes, and sampling circuitry configured to convert pixel outputs into digital pixel data. In addition, the pixels in the plurality of focal planes include a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information, and the pixel stack defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area.

Disclosed is a method of fabricating a molded structure including both micro lenses and metallic pins. The method comprises the steps of providing a mold apparatus having a set of first cavities and a set of second cavities, depositing a first material in the first cavities to form a set of metallic pins, and depositing a second material in the second cavities to form a set of micro lenses. The formed molded structure comprises a substrate, a set of molded microlenses on said substrate, and a set of molded metallic pins on that same substrate. The metallic pins may be formed as alignment pins or as electrical connectors. The invention enables the micro lenses and metallic pins to be manufactured by way of molding on a common substrate for the first time.

An image sensor and manufacturing process thereof are provided. An image sensor according to an embodiment comprises a first wafer formed with a photodiode cell without a microlens and a second wafer formed with a circuit part including transistor and a capacitor. The first wafer is stacked on the second wafer such that a connecting electrode can be used to electrically connect the photodiode cell of the first wafer to the circuit part of the second wafer.

An electronic device of an embodiment of the invention is disclosed that at least partially displays a pixel of a display image. The device includes a first reflector and a second reflector defining an optical cavity therebetween that is selective of a visible wavelength at an intensity. The device includes a mechanism to allow optical properties of the cavity to be varied such that the visible wavelength and / or the intensity are variably selectable in correspondence with the pixel of the displayable image. The device also includes one or more transparent deposited films, one or more absorbing layers, an integral micro-lens, and / or one or more anti-stiction bumps. The deposited films are over one of the reflectors, for self-packaging of the device. The absorbing layers are over one of the reflectors, to reduce undesired reflections. The integral micro-lens is over one of the reflectors, and the anti-stiction bumps are between the reflectors.

A photoelectric conversion device suitable for use as an element of a photodetector array includes a photodiode for generating a first signal charge in response to incident light, an output unit including a JFET, and at least one transistor having an electrode that generates a second signal charge in response to incident light. The first and second signal charges may be output separately or combined. The second signal charge, or the first and second signal charges combined, may be monitored during an exposure time to determine the desired end of the exposure. An image sensor array may have one or more pixels with such light monitoring capability. The output signal for monitoring the light may be output over a reset drain interconnection, directly from the monitoring pixel or through other pixels via inter-pixel MOSFETS. Exposure time may be controlled, by timing a shutter or a strobe or the like, based on the monitored accumulation of signal charge during exposure. Microlenses may be provided on-chip to increase the effective aperture ratio of the array. The microlenses are designed to avoid interfering with the incident light used for monitoring. Resulting pixel-to-pixel variations in effective aperture ratio, if any, may be electronically compensated.

A light emitting array including at least a plurality of light emitting elements, each of which is provided thereon with a microlens in one-to-one correspondence. Light emitting portions of the light emitting element are provided having the shape of a rectangle and formed so as to satisfy the relational expression, Lmin≦D≦P, where Lmin is the length of the shorter side of the rectangle, P an alignment pitch of the light emitting elements, and D the diameter of microlens. In addition, light emitting elements are formed in line on a transparent thin film layer to satisfy the relationship, T1≦2·D2, where T1 is the thickness of the transparent thin film layer and D2 the diameter of each microlens. The light emitting array may suitably be included in the light source unit which is then incorporated into image forming apparatuses for forming mono-color or multiple-color images.

A solid-state image sensing element has a photoelectric conversion element which converts incoming light into an electrical signal in accordance with an amount of the light, a microlens which is arranged on an incident surface, a light guide which is arranged between the photoelectric conversion element and the microlens, and an insulating interlayer which is arranged around the light guide. The solid-state image sensing element located at a distance (H) satisfies:H·DL·P<a·NHNL⁢⁢for⁢⁢0<a<1where L is the distance from an exit pupil of an image sensing optical system of an image sensing device, which mounts an image sensor formed by two-dimensionally arranging a plurality of the solid-state image sensing elements, H is the distance from a center of the image sensor to a position of the solid-state image sensing element on the image sensor, D is the height from the photoelectric conversion element to an apex of the microlens, P is the spacing between the plurality of solid-state image sensing elements, NH is the refractive index of the light guide, and NL is the refractive index of the insulating interlayer.

A MEMS vertical displacement device capable of moving one or more vertically displaceable platforms relative to a base. In particular, the vertical displacement device may be capable of moving a vertically displaceable platform so that the vertically displaceable platform remains generally parallel to a base. The vertically displaceable platform may be, but is not limited to, a microlens, a micromirror, micro-grating, or other device. The vertical displacement device may also be included in optical coherence and confocal imaging systems.

Translucent, transparent, or semi-translucent microlens sheetings with composite images are disclosed, in which a composite image floats above or below the sheeting, or both. The composite image may be two-dimensional or three-dimensional. The sheeting may have at least one layer of material having a surface of microlenses that form one or more images at positions internal to the layer of material, at least one of the images being a partially complete image. Additional layers, such as retroreflective, translucent, transparent, or optical structure layers may also be incorporated into the sheeting.