164 results about "Three dimensional integration" patented technology

The invention discloses a vertical foldaway memory array structure. The structure comprises vertical foldaway memory modules and a plurality of memory unit tubes; the vertical foldaway memory modules are in line and row distribution; each vertical foldaway memory module comprises a drain selection tube, a bottom connection wire and a source selection tube; the grid structure of each storage unit tube is connected with a word line; the drain of each drain selection tube is connected with a bit line; the drain of the drain selection tube of the Mth vertical foldaway memory module in the Nth line and the source of the source selection tube in the (M-1)th vertical foldaway memory module in the (N+1)th line are connected with the same bit line; and the grids of the drain selection tubes and the source selection tubes of all vertical foldaway memory modules in the N lines are respectively connected with the same drain selection line and the same source selection line. The vertical foldaway memory array structure disclosed by the embodiment of the invention not only has a simple structure and but also is very suitable for the three-dimensional integration of memories, so that the high-density high-capacity storage capacity of the vertical foldaway memory structure is greatly improved.