A stacked chip device includes a first chip having a first function, and a second chip having a second function which is different from the first function, which is stacked on the first chip. The first chip is a through-silicon-via chip which is comprised of a first semiconductor substrate having first and second surfaces, a first semiconductor integrated circuit which is provided on the first surface of the first semiconductor substrate, a first conductive layer connecting to the first semiconductor integrated circuit, which goes through the first surface of the first semiconductor substrate to the second surface of the first semiconductor substrate, and a second conductive layer not connecting to the first semiconductor integrated circuit, which goes through the first surface of the first semiconductor substrate to the second surface of the first semiconductor substrate. The first and second conductive layers have the same shape and the same structure.