40290 results about "Heat spreader" patented technology

A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.

A light emitting diode (LED) light bulb that includes plural individual elements as sub-assembly elements of the overall light bulb. Different sub-assembly elements of a lens, a LED printed circuit board, a housing also functioning as a heat sink, a lower housing, and other individual sub-assembly components are utilized. The LED printed circuit board sub-assembly containing the LEDs can also be provided relatively close to a base.

A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

In many processes used in fabricating semiconductors the wafer is seated on the top surface of a pedestal and heated in a high energy process step, such as plasma etching. The pedestal, chuck or platen may be cooling but the wafer gradually heats until the process can no longer continue. Where large, e.g. 300 mm diameter, wafers are being processed the temperature level across the wafer is difficult to maintain substantially constant. In this system and method the lateral temperature distribution is equalized by a heat sink structure in a chamber immediately under the wafer support on top of the pedestal. A number of spatially distributed wicking posts extend downwardly from a layer of wicking material across the top of the chamber, into a pool of a vaporizable liquid. At hot spots, vaporized liquid is generated and transported to adjacent condensation posts extending up from the liquid. The system thus passively extracts heat to equalize temperatures while recirculating liquid and assuring adequate supply. The free volume above and within the liquid, and the short distances between posts, assure adequate heat transfer rates.

An LED lighting device for use in place of a commercial-standard light bulb. For example, a commercial-standard light bulb typically has an outer surface profile, generally defining its shape and the LED lighting device has its own surface profile which substantially mimics the surface profile of the commercial-standard light bulb. Additionally, LED lighting device may further comprise a heat sink for dissipating energy generated by the LED lighting device. In accordance with various embodiments, the heat sink creates the LED lighting device's outer surface profile and is configured to substantially mimic the outer surface profile of the commercial-standard light bulb.

The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal management system that includes a thermal interface formed from a flexible graphite sheet and / or a heat sink formed from a graphite article.

System and methods for flash heating of materials deposited using atomic layer deposition techniques are disclosed. By flash heating the surface of the deposited material after each or every few deposition cycles, contaminants such as un-reacted precursors and byproducts can be released from the deposited material. A higher quality material is deposited by reducing the incorporation of impurities. A flash heating source is capable of quickly raising the temperature of the surface of a deposited material without substantially raising the temperature of the bulk of the substrate on which the material is being deposited. Because the temperature of the bulk of the substrate is not significantly raised, the bulk acts like a heat sink to aid in cooling the surface after flash heating. In this manner, processing times are not significantly increased in order to allow the surface temperature to reach a suitably low temperature for deposition.

A medical procedure utilizes a high-intensity focused ultrasound instrument having an applicator surface, a liquid-containing bolus or expandable chamber acting as a heat sink, and a source of ultrasonic vibrations, the applicator surface being a surface of a flexible wall of the bolus, the source of ultrasonic vibrations being in operative contact with the bolus. The applicator surface is placed in contact with an organ surface of a patient, the source is energized to produce ultrasonic vibrations focused at a predetermined focal region inside the organ, and a temperature of liquid in the bolus is controlled while the applicator surface is in contact with the organ surface to control temperature elevation in tissues of the organ between the focal region and the organ surface to necrose the tissues to within a desired distance from the organ surface.

A method of treating a brain disorder by heat transfer from brain tissue comprising the steps of surgically cutting a heat transfer aperture into a patient's skull, thereby exposing a predetermined portion of patient's brain; surgically implanting into said heat transfer aperture a heat pump having one or more electrical sensor elements and one or more temperature sensor elements; surgically implanting a heat transfer management unit in a body cavity of said patient such that a micro controller of the heat transfer management unit is connected to one or more activity sensor elements and one or more temperature sensor elements contacting brain tissue and connecting the heat transfer management unit to said heat pump via a lead bundle. Optionally, the heat transfer unit may be located external to the patient's body. Responsive to signals from one or more activity or temperature sensor elements, mathematical algorithms of the heat transfer management unit determine abnormal brain activity, causing the heat pump to remove heat from the brain tissue into a heat sink, thereby cooling the predetermined portion of the patient's brain. This technique utilizes acute hypothermia by means of a Peltier cooler or similar device to cool the brain temperature to reduce or prevent seizure initiation and / or propagation. The method may be used in association with brain stimulation and / or drug application to acutely avoid the occurrence of a seizure episode.

A light emitting diode (LED) bulb includes a heat sink, a circuit layer having two opposite sides, multiple LEDs mounted on one side and an electrical insulating layer connected between the opposite side and the heat sink. Heat generated by the LEDs is conducted to the heat sink through the circuit layer and the electrical insulting layer and is dissipated quickly. Further, a fan can be mounted on the fins to dissipate heat from the heat sink more quickly. Therefore, the LED bulb has good heat dissipating efficiency.

A light-emitting diode (LED) includes a heat sink (10) having a cross section along an axial direction thereof being U-shaped. The heat sink includes a substrate (102) and a sidewall (11) extending from an outer periphery of the substrate. A circuit board (40) is received in the heat sink and arranged on the substrate. At least one LED (30) is arranged on and electrically connected to the circuit board and thermally connected with the substrate of the heat sink. A plurality of fins (100) extend outwardly from an outer surface (110) of the sidewall of the heat sink. Each fin has a plurality of branches (100a, 100b) being connected together at the outer surface of the sidewall and being spaced from each other at outer-peripheries thereof.

A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.

A semiconductor package having heat sink at the outer surface is constructed on a lead frame. The package comprises a chip, a die pad, a plurality of leads, a plurality of bonding wires, and a molding compound. The die pad has a first surface and a second surface, and the chip has its active surface bonded to the first surface of the die pad. The area of the die pad is smaller than the area of the chip in order to expose the bonding pads on the active surface of the chip. The leads having an inner lead portions and an outer lead portions are disposed at the periphery of the die pad, and the inner lead portions are electrically connected to the bonding pads by a plurality of bonding wires. The molding compound encapsulates the chip, the die pad, the inner lead portions of the leads, and the bonding wires. The second surface of the die pad is exposed on the top surface of the package structure while the outer lead portion of the leads is exposed at the side edge of the package structure.

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

A lighting device comprises a heat sink, a housing mounted to and / or thermally coupled to the heat sink, a basket assembly attached to the housing, a solid state light emitter thermally coupled to the heat sink, and a baffle assembly attached to the housing. Also, a lighting device comprising a basket assembly and a baffle assembly. In some embodiments, the basket assembly comprises a first member defining a first opening, a second member, a space between the first and second members, and lenses in the opening and in the space. In some embodiments, the heat sink extends farther in a first direction in a first plane than a largest dimension of the housing in any plane which is parallel to the first plane. In some embodiments, at least one additional component (e.g., a power supply module or a junction box) is in contact with the heat sink element.

A method is for making at least one semiconductor device including providing a sacrificial growth substrate of Lithium Aluminate (LiAlO2); forming at least one semiconductor layer including a Group III nitride adjacent the sacrificial growth substrate; attaching a mounting substrate adjacent the at least one semiconductor layer opposite the sacrificial growth substrate; and removing the sacrificial growth substrate. The method may further include adding at least one contact onto a surface of the at least one semiconductor layer opposite the mounting substrate, and dividing the mounting substrate and at least one semiconductor layer into a plurality of individual semiconductor devices. To make the final devices, the method may further include bonding the mounting substrate of each individual semiconductor device to a heat sink. The step of removing the sacrificial substrate may include wet etching the sacrificial growth substrate.

A recessed lighting fixture providing illumination from a light source comprising a plurality of light emitting diodes (LEDs) placed within a cavity of a planar surface, such as a ceiling, wall, or shower. The fixture comprises a baffle integrated with a low profile heat sink that is used to draw heat out of the fixture and communicate that heat to a trim ring of the fixture for dissipation of the heat in the room so that higher intensity light sources can be used. Improved grounding of the recessed trim unit to the recessed housing is provided with combination support and grounding springs. One embodiment of the light source is fixed in position while a second embodiment is gimbal mounted for aiming the light produced by the fixture.

A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

An LED-based luminaire includes a driver configured to convert line voltage into a desired power configuration. Elongate fasteners attach one or more LED-based lighting modules to a mount member and also to energized poles of the power driver. The fasteners communicate electrical energy from the power driver to the lighting module. In one embodiment, the mount member functions as a heat sink, and it includes a bumpy surface coating having a texture with sufficient feature heights to enhance heat transfer between the heat sink and the surrounding environment.

Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.

A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

A light emitting diode lighting device and system that can be used for illuminating the interior and / or exterior of vehicles, aircraft, watercraft, signage or buildings is provided. It includes a voltage feedback constant current power supply circuitry and high power LEDs. The printed circuit assemblies are firmly mounted onto a continuous or semi-continuous mounting channel case that also works as a heat sink. By this means, it not only increases the reliability of the LED lighting tube but also it provides sufficient heat dissipation capability for the heat generated by the LEDs. Since the operating temperature of the LEDs is controlled and stays in cool condition, it dramatically increases the LED's lifetime and efficiency. The end caps of this LED lighting device are fully compatible with existing conventional fluorescent light fixtures and can directly replace those fluorescent lighting tubes in vehicles, mass-transit, watercrafts, aircrafts, signage or buildings with minimal modifications.

Methods and apparatuses are provided for cooling semiconductor substrates prior to handling. In one embodiment, a substrate and support structure combination is lifted after high temperature processing to a cold wall of a thermal processing chamber, which acts as a heat sink. Conductive heat transfer across a small gap from the substrate to the heat sink speeds wafer cooling prior to handling the wafer (e.g., with a robot). In another embodiment, a separate plate is kept cool within a pocket during processing, and is moved close to the substrate and support after processing. In yet another embodiment, a cooling station between a processing chamber and a storage cassette includes two movable cold plates, which are movable to positions closely spaced on either side of the wafer.

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W / m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.

An LED lamp may be made with a heat sink optic. The lamp has a base having a first electrical contact and a second electrical contact for receiving current. At least one LED is mounted on a thermally conductive support; that supports electrical connections for the LED and provides thermal conduction of heat from the LED to the optic. The LED support mounted in the base and electrically coupled through the first electrical contact to electrical current. The light transmissive, and heat diffusing optic has an external an internal wall defining a cavity with the LED positioned in the cavity. The optic is in thermal contact with the LED support and mechanically coupled to the base. The snap together structure enables rapid manufacture while allowing numerous variations.

A lamp includes a linearly extending heat sink, blue-light-emitting LEDs mounted on the heat sink, and a light emitting cover mounted on the heat sink in line with the LEDs, a first portion of the cover opposite the LEDs including a phosphor that is excited by the LEDs to emit white light. The cover may be a tube with the LEDs outside the tube, a portion of the tube nearest the LEDs being transparent and receiving light from the LEDs. The tube may include reflectors that are attached to an exterior surface of the tube to hold the tube on the heat sink. Alternatively, the cover may enclose the LEDs on the heat sink, where a portion of the cover has an interior surface that reflects light from the LEDs to the first portion. The lamp may include electrical connections that allow for multiple lamps to be connected in series.

Apparatus for performing a medical procedure on a tissue within a body of a subject includes a wireless tag which is fixed to the tissue and includes a first sensor coil. A second sensor coil is fixed to a medical device for use in performing the procedure. An integral processing and display unit includes a plurality of radiator coils, along with processing circuitry and a display. The radiator coils generate electromagnetic fields in a vicinity of the tissue, thereby causing currents to flow in the sensor coils. The processing circuitry processes the currents so as to determine coordinates of the tag relative to the medical device. The display is driven by the processing circuitry so as to present a visual indication to an operator of the medical device of an orientation of the device relative to the tag.

A battery module of the present invention is adaptable to be utilized in various configurations including and not limited to an overlapping battery cell packaging configuration and a vertical stack battery cell packaging configuration used in an automotive vehicle. The battery module has a plurality of battery heatsink assemblies with the cells disposed therebetween. A plurality of rods extend through the each heatsink assemblies to secure the heatsink assemblies and the cell with one another to form the battery module.

Work light has LEDs that require heatsink. Desired radiation pattern achieved by using optical components designed to produce beam or LEDs may have beams in different directions. Radiation pattern of LEDs may be changed by refractive-reflective optics or by convex lenses. Convex lenses may be hemispheres, other planoconvex shapes, concavo-convex shapes, or other shapes. Curved surfaces on any lenses may be spherical or aspheric. Ballast to operate the LEDs from line voltage AC or low voltage DC. Work light may contain batteries. The work light may be mounted on a stand. May have accessory mount. May have charging station. May have a paging transmitter to activate a paging receiver in work light. May have openings for heat transfer from heatsink to ambient air external to light.