3405 results about "Led array" patented technology

A compact and efficient optical illumination system featuring planar multi-layered LED light source arrays concentrating their polarized or un-polarized output within a limited angular range. The optical system manipulates light emitted by a planar array of electrically-interconnected LED chips positioned within the input apertures of a corresponding array of shaped metallic reflecting bins using at least one of elevated prismatic films, polarization converting films, micro-lens arrays and external hemispherical or ellipsoidal reflecting elements. Practical applications of the LED array illumination systems include compact LCD or DMD video image projectors, as well as general lighting, automotive lighting, and LCD backlighting.

A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.

A light emitting diode (LED) array comprises an array of LEDs mounted to a substrate. The LEDs emit light in a direction generally perpendicular to the substrate. An optical sheet is disposed over the LEDs. At least a portion of light entering one side of the optical sheet from the LEDs is guided within the optical sheet in a direction generally parallel to the substrate. Light extraction features direct light from the optical sheet in a generally forward direction. Such an array is useful for several applications, including space lighting, direct information display and backlighting of liquid crystal displays. The light spreading effect of the optical sheet reduces the amount of black space between LED pixels.

An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

Light emitted in side surface directions from side-emitting red, green, and blue LEDs which are arranged on an LED array substrate is introduced into a light guide from side surfaces of a groove-shaped recessed portion, and propagates in the light guide. Thus, the three colors are mixed. The light further propagates in the light guide while being reflected at both side end surfaces of the light guide by the function of a reflective sheet and the like. Thus, color mixing progresses. Further, the light is reflected upward by diffuse reflective means provided on the lower surface of the light guide, and emitted as backlight light to the outside through a diffuse sheet.

A system for focusing light on an illumination area. The system includes a reflector having a focusing reflective surface and a focal region and an LED array having a plurality of LEDs located within the focal region. Each of the plurality of LEDs in the LED array is positioned to emit light toward the focusing reflective surface. The focusing reflective surface reflects light from each of the plurality of LEDs of the LED array toward the illumination area.

The invented non-invasive vital signs monitor is in a flexible, nominally flat planar form having integral gel electrodes, a sticky-back rear surface, an internal flex circuit capable of sensing, recording and playing out several minutes of the most recently acquired ECG waveform data and a front surface that includes an outplay port. The invented non-invasive body composition ‘risk’ monitor includes a measurement device for monitoring one or more variables including body fluid mass, dehydration, respiratory rate, blood pressure, bio-impedance, cardiography such as cardiac output, and body conformation parameters. The risk monitor may be provided in a lightweight carrying case into which the vital signs monitor plugs. Finally, a lightweight portable probe or transducer containing a transmissive or reflective electro-optical emitter and receptor in the infrared spectrum is fitted on a subject's finger or toe. Associated electronics energize and monitor the probe, detect cardio-rhythmic fluctuations therefrom, and process digital data over a prescribed window to produce a non-invasive, qualitative or quantitative measure of the subject's circulation. In accordance with one embodiment of the invention, a simple tri-color LED array is used to indicate the subject's circulation as being normal, reduced, or borderline. Thus the vital signs, bio-impedance, and circulation monitors may be independent or they may be integrated into one portable, non-invasive device that can concurrently monitor and locally display or remotely convey important patient data including circulation data to a local subject or physician or to / from a remote patient medical data center via wireless telemetry for oversight, treatment and possible intervention by a remote physician.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

A method and apparatus for curing photosensitive materials uses LEDs and an optical concentrator to generate high optical power intensities. An LED array, comprising a plurality of LED assemblies, generates collimated light. A collection lens functions as an optical concentrator and focuses the collimated light to a desired spot size at a desired location. The LED assemblies may be at least partially disposed in a cooling plenum, where the cooling plenum is at least partially defined by the collection lens. Each LED assembly within the LED array may be detachably coupled to a mounting surface, enabling easy replacement of individual LED assemblies within the LED array. The photocuring assembly may also include a redirecting assembly disposed between the collection lens and the desired location that may further concentrate the light at the desired location. The photocuring assembly may include more than one of the above features.

An HDR display is a combination of technologies including, for example, a dual modulation architecture incorporating algorithms for artifact reduction, selection of individual components, and a design process for the display and / or pipeline for preserving the visual dynamic range from capture to display of an image or images. In one embodiment, the dual modulation architecture includes a backlight with an array of RGB LEDs and a combination of a heat sink and thermally conductive vias for maintaining a desired operating temperature.

The invention comprises use of Dynamically Switchable Bypass (DSB) elements in association with one or more Light Emitting Diodes (LEDs) in arrays for illumination circuits to provide rugged, reliable lighting. The DSBs are selected from Transient Voltage Suppressors, including Silicon, Metal Oxide Varistors, and Multi Layer Varistors as well as Zener Diodes. The DSBs are not used as circuit protecting devices, but rather as alternative paths for electric current to bypass failed LEDs. Bi-directional TVSs are used as alternative electric paths for circuits using Alternating Current (AC) and parallel LED arrays that light on both phases of AC. Zener Diodes are used in parallel to, but in the opposite polarity orientation to, one or more LEDs in DC or rectified AC circuits. The inventive paired DSB / LED elements overcomes the black-out problems of prior series LED illumination systems, making possible the use of robust LEDs in illumination systems where reliability, long life, low power consumption, low heat output, resistance to shock, vibration, and humidity, and self-diagnosis are important. The DSB elements have breakdown voltages slightly higher than the LED(s) they support, so that when an LED fails, the conduction through the DSB begins. Because the conduction voltage of the DSB so nearly matches the conduction voltage of the LED(s), the remainder of the circuit continues to function as normal. The system is self-diagnostic in that any LED failure presents itself as a dark LED rather than as a whole string of dark LEDs. DSBs may be used with incandescent bulbs.

A device is provided, in direct skin contact, surrounding an injured area for the treatment, reduction of joint inflammation, edema and excitation of neural and muscular stimulation associated with human and mammal tissues. This therapeutic light source includes a multiplicity of light emitting diodes (LED's) found in the ranges of 350 nm to 1000+ nm and fiber optic connections. A neoprene type material or other non-allergenic material is used to set the LED's and fiber optics in layers consisting of contact with the skin to few centimeters from the skin tissue. Distance will vary from contact or near contact with devices to several millimeters of separation. Each LED array is independently controlled allowing for optimal modulation of light frequencies and wavelengths. Technology is integrated allowing for biomedical feedback of tissue temperature and other statistical information. A low voltage, portable power supply, is integrated into the device as well as an analog / digital, input / output connection device. The design will be created for continuous wear, flexibility and comfort.

A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

An LED array chip (2) includes blue LEDs (6) and red LEDs (8). The blue LEDs (6) are formed by epitaxial growth on an SiC substrate (4). Bonding pads (46 and 48) are formed on the SiC substrate (4) in a wafer fabrication process. The red LEDs (8) are separately manufactured from the blue LEDs (6), and flip-chip mounted on the bonding pads (46 and 48) formed on the SiC substrate.

A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of the attach pads. The attach pads cover more of the top surface than the LEDs and spread heat from the LEDs to the top surface of the submount. A plurality of lenses are also included each of which is molded over a respective one of the attach pads and covers the LED mounted to the particular attach pad. The arrays are shaped and arranged so that they can be easily attached to similar arrays in a tiling fashion, with the desired number of arrays included to meet the desired lighting requirements. Methods for fabricating the arrays from a single submount or submounts panel are also disclosed.

An LED array package structure having a silicon substrate is disclosed. The LED array package structure comprises a silicon substrate having a plurality of cup-structures thereon, a reflective layer disposed on the silicon substrate, a transparent insulation layer disposed on the reflective layer, a conductive layer disposed on the transparent insulation layer and a plurality of LEDs disposed respectively on the conductive layer in each cup-structures.

An LED array surface-mounted on a circuit board and applied to a cooling member, such that any generated heat is optimally eliminated. The cooling member can be in any desired shape so that motor vehicle lights, such as blinkers, can be adapted to the outside contour of the vehicle. For a rotating light, the circuit board can be applied around a cooling member fashioned as a hollow cylindrical member which is adapted to rotate.

An LED array chip (2), which is one type of a semiconductor light emitting device, includes an array of LEDs (6), a base substrate (4) supporting the array of the LEDs (6), and a phosphor film (48). The array of LEDs (6) is formed by dividing a multilayer epitaxial structure including a light emitting layer into a plurality of portions. The phosphor film (48) covers an upper surface of the array of the LEDs (6) and a part of every side surface of the array of LEDs (6). Here, the part extends from the upper surface to the light emitting layer.

An LED based light source unit for an endoscopic imaging system produces illumination for a camera through an endoscope. The light source unit includes an array of LEDs mounted to a thermally conductive substrate. The light source unit is integrated into the proximal end of an endoscope and coupled directly to the optical fibers running to the tip of the endoscope. A plurality of such light source units may be integrated into the housing of an endoscope. Light emitted from each light source unit is directed to a distinctive section of the endoscope's tip and a doctor may control light output of each individual light source unit during a surgery.

The present invention is directed to a fluorescent light fixture assembly including a ballast and a novel lighting element that includes an array of LEDs and at least one converter module that enables the existing ballast providing an AC power input to supply DC power to the LED array. The lighting element includes a body that contains the LED array and the converter modules and shares the configuration of the lighting element that is to be retrofitted. The lighting element receives power from the pre-existing ballast, wherein the converter module provides a constant current source to power the LED array. Thus, the lighting element, including the converter module, replaces the conventional fluorescent light tube in a cost-effective retrofit manner with the existing ballast.

An implantable lead having at least one electrode contact at or near its distal end prevents undesirable movement of the electrode contact from its initial implant location. One embodiment relates to a spinal cord stimulation (SCS) lead. A balloon may be positioned on the electrode lead array. The balloon is filled with air, liquid or a compliant material. When inflated, the balloon stabilizes the lead with respect to the spinal cord and holds the lead in place. The pressure of the balloon is monitored or otherwise controlled during the filling process in order to determine at what point the filling process should be discontinued. An elastic aspect of the balloon serves as a contained relief valve to limit the pressure the balloon may place on the surrounding tissues when the epidural space is constrained.

High resolution light emitting diode (LED) displays can be formed from freestanding small epitaxial LED chips or small LED arrays. The addressing elements for the LED display can be active matrix backplane. The LED display may use isotropic and directional luminescent elements. The LED displays can be flat screen, fixed image, projection or low resolution or high resolution direct view. A macro freestanding epitaxial LED chip with multiple addressable pixels is described which forms a complete microdisplay.