15957 results about "Heat pipe" patented technology

An electrosurgical cutting blade (1) comprises a first electrode (2), a second electrode (3), and an electrical insulator (4) separating the first and second electrodes. The first and second electrodes have dissimilar characteristics (cross-sectional area, thermal conductivity etc.) such that the first electrode (2) is encouraged to become an active electrode and the second electrode (3) is encouraged to become a return electrode. The spacing between the first and second electrodes (between 0.25 mm and 3.0 mm) and the peak voltage supplied to the electrodes (2 and 3) are both selected such that arcing does not occur directly between the electrodes, but between the first electrode and the tissue at the target site. The arrangement is such that, in use, a thermal differential of at least 50° C. is established between the first and second electrodes (2 and 3), such that the second electrode is maintained below a temperature of 70° C. This is achieved either by thermally insulating the second electrode from the first electrode, and / or by transferring heat away from the second electrode, e.g. by conduction, forced cooling, or by means of a heat pipe (27).

Light Emitting Diode Light Sources for Dental Curing are disclosed. Some embodiments of the invention include structures such as Light Emitting Diode Array(s), heat sink, heat dissipation, heat pipe, and control circuitry are disclosed.

An automotive lighting assembly cooling system includes a heat pipe with an evaporation area proximate to a heat generating component, such as a Light Emitting Diode (LED), and a condensing area located remote from the evaporation area. Evaporation of fluid within the heat pipe transfers heat away from the heat generating component. The efficiency of the cooling system in one embodiment is increased by including fins associated with the condensing area and placing the fins in an area where air flow external to a moving vehicle assists in cooling the fins.

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

A backlight unit is provided with LEDs having a cooling structure. The backlight according to an embodiment includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. In operation, heat generated from the LEDs is conducted via the PCB and the heat pipe and is radiated by the heat sink.

The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.

A hard disk system having a disk housing shock mounted in an environmental housing employs a device to transfer heat from the disk housing while avoiding any mechanical connection that would impose significant rigidity between the disk housing and the environment housing so as to defeat the shock mounting. In one embodiment, a Peltier effect heat pump has a cold side in contact with the disk housing and a hot side in contact with heat-conducting spring fingers contacting the environmental housing. In another embodiment, a fan is positioned in a space between the outside of the disk housing and the inside of the environmental housing to circulate air around the disk housing, while a Peltier effect heat pump moves heat to the environmental housing. In yet another embodiment, the fan is positioned in the space between the disk housing and the environmental housing, and the Peltier effect heat pump has a cold side in contact with an exterior surface of the environmental housing and a hot side in contact with a heat sink. In still another embodiment, a flexible heat pipe comprising a shell containing a low vapor-point liquid is positioned in the space between the outside of the disk housing and the inside of the environmental housing with respective ends in contact with each of the housings.

A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14), and heat pipes thermally connecting the heat spreader and the fins. The fins form a plurality of channels (140) therebetween, and include a guiding fin (15). The guiding fin includes a body (150) spaced from the heat spreader and an inclined sidewall (152) bent from the body. An airflow generated by the fan has a portion flowing through the channels of the fins and another portion flowing between the body and the heat spreader for blowing a second heat generating electronic device by guiding of the sidewall of the guiding fin.