725results about How to "Inhibit temperature rise" patented technology

A backlight unit is provided with LEDs having a cooling structure. The backlight according to an embodiment includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. In operation, heat generated from the LEDs is conducted via the PCB and the heat pipe and is radiated by the heat sink.

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

A secondary battery includes a case having positive and negative electrodes, a safety device attached to a surface of the case and having a resistance value which changes during swelling of the case, and a protective circuit module attached to a side of the case while being electrically connected to the safety device. The resistance value of the safety device changes as the case swells, and the protective circuit module reduces or interrupts charging / discharging currents in response thereto. The safety device can be used for all secondary batteries regardless of capacity, can quickly react against abruptly rising internal temperature and rapid swelling, and can stably prevent swelling which occurs above an allowable temperature.

A printing system capable of writing RFID data consistent with print information printed on a print-information recoding medium into a RFID chip carried on the print-information recording medium. The printing system includes a printer engine for printing print information, including at least either one of contactlessly readable information and image information visible to human being, onto at least the print-information recording medium, and an RFID reader / writer for writing RFID data consistent with the print information into the RFID chip carried on the print-information recording medium.

A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic components; a heat sink; and a member with insulation characteristics and high thermal conductivity, which is disposed between plural devices with high heating value among the above-mentioned electronic components and the above-mentioned heat sink, embeds at least part of each of the above-mentioned plural devices with high heating value therein and transfers heat from the above-mentioned plural devices with high heating value to the above-mentioned heat sink.

An ultrasonic probe has a probe proper, a connector and a cable for electrically connecting between the probe proper and the connector. The probe proper includes a transducer that converts between ultrasonic wave and electricity, and a phase change member having a property to cause a phase change of from solid to liquid at a particular temperature reached in an operation time period of the transducer and a phase change of from liquid to solid at lower than the particular temperature.

A lighting apparatus with LED includes a metal-made main body 90; a plurality of LED chip units 1 each including an LED chip and a pair of lead terminals 42, 43 electrically connected to electrodes of the LED chip; and a dielectric layer 80 disposed between the main body 90 and each LED chip unit 1 for making electrical insulation therebetween as well as bond the same. The circuit board 20 is formed with a plurality of windows 23 through which the individual LED chip units 1 extend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main body 90 through the dielectric layer 80, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.

A portable information device such as a notebook type computer is provided with a highly efficient thermal insulator capable of blocking transfer of heat between an internal heating component and a device enclosure, so as to reduce temperature rise on a surface of the device. The portable information device is also provided with a highly efficient thermal insulator to block transfer of heat between the heating component and an expansion unit mounting case, thereby reducing temperature rise and preventing malfunction of an external expansion unit. The information device includes the thermal insulator to separate between the internal heating component and the device enclosure, another thermal insulator to separate between the heating component and the expansion unit mounting case, and a heat sink. The thermal insulator is a vacuum thermal insulator including inorganic fiber as a core member.

A backlight unit is provided with LEDs having a cooling structure. The backlight includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. Heat generated from the LEDs conducts via the PCB and the heat pipe and is then radiated by the heat sink. The cooling performance of the backlight unit is thus enhanced and the temperature increase in the light emission region is thus suppressed, so that thermal reliability of the LEDs is enhanced and light efficiency is increased to increase the brightness and to decrease the power consumption.

An object is to provide a method for manufacturing an SOI substrate provided with a single crystal semiconductor layer which can be used practically even when a substrate having a low heat resistant temperature, such as a glass substrate or the like, is used. Another object is to manufacture a highly reliable semiconductor device using such an SOI substrate. An SOI substrate having a single crystal semiconductor layer which is transferred from a single crystal semiconductor substrate to a supporting substrate, and an entire region of which is melted by laser light irradiation to cause re-single-crystallization is used. Accordingly, the single crystal semiconductor layer has reduced crystal defects, high crystallinity and high planarity.

A power reception coil unit includes a power reception coil configured to be magnetically coupled to a power supply coil during a power transmission and a magnetic plate made of a magnetic material having electrical conductivity. The power reception coil is a planar coil. The magnetic plate has its surface opposed to the power reception coil and is parallel to the power reception coil. The magnetic plate is provided with a plurality of slits in the surface.

A surface-emission laser diode comprises a cavity region over a semiconductor substrate and includes an active layer containing at least one quantum well active layer producing a laser light and a barrier layer, a spacer layer is provided in the vicinity of the active layer and formed of at least one material, an upper and lower reflectors are provided at a top part and a bottom part of the cavity region, the cavity region and the upper and lower reflectors form a mesa structure over the semiconductor substrate, the upper and lower reflectors being formed of a semiconductor distributed Bragg reflector having a periodic change of refractive index and reflecting incident light by interference of optical waves, at least a part of the semiconductor distributed Bragg reflector is formed of a layer of small refractive index of AlxGa1-xAs (0<x≦1) and a layer of large refractive index of AlyGa1-yAs (0≦y<x≦1), the lower reflector is formed of a first lower reflector having a low-refractive index layer of AlAs and a second lower reflector formed on the first lower reflector, the second lower reflector has a low-refractive index layer of AlGaAs, any one layer constituting the cavity region contains In.

A radiation imaging apparatus is capable of taking a moving picture by acquisition by a reading circuit of a plurality of radiation image signals on the basis of a plurality of successive times of irradiation of a radiation detector with radiation rays. The radiation detector has a two-dimensional array of pixels. In a period between a start of an n-th time of irradiation with radiation rays and a start of an (n+1)-th time of irradiation with radiation rays, where n is a natural number, a controller switches an operation status of an analog-to-digital converter that converts electric signals read by the reading circuit into digital signals so that power consumption of the analog-to-digital converter is reduced.

An imaging unit includes a plurality of imaging devices configured to capture images of an object; a circuit substrate configured to generate image data based on the images captured by the imaging devices; a chassis that holds the imaging devices; and a heat transfer member including a contacting portion configured to contact an installed member in a case where the imaging unit is installed on the installed member. The heat transfer member contacts the chassis or the circuit substrate, and heat conductivity of the heat transfer member is greater than the heat conductivity of the chassis.

A fixing apparatus and an image formation apparatus therewith are disclosed. According to the fixing apparatus, a heating range that is heated by electromagnetic induction caused by a current flowing through a coil unit is finely tunable by covering a part of a core unit with a shielding member. Further, the core unit has a projecting section at an end of the core unit, which projecting section projects toward the coil unit in comparison with the central part of the core unit.

Provided is a wind turbine generator system that can cool a nacelle interior by ventilation irrespective of the outside air temperature in various installation environments. In a wind turbine generator system in which equipment of drive and electricity generation mechanisms that are coupled to a rotor head provided with wind turbine blades is disposed inside a nacelle, and in which, by driving a ventilation fan provided in the nacelle, outside air introduced from an air inlet provided in a front face of the nacelle is exhausted outside the nacelle from an air outlet that communicates with a fan outlet, to perform ventilation cooling of the interior, a side air inlet is additionally provided in a side face of the nacelle at a position where a negative pressure is generated by air flowing outside the nacelle.

An exhaust particulate trapping means 12 for trapping particulates in exhaust gases is provided in an exhaust path 3 of an engine. When the engine enters a deceleration condition during the removal by burning of exhaust particulates trapped by the exhaust particulate trapping means 12, the drop of the flow rate of exhaust gases flowing into the exhaust particulate trapping means 12 is restricted. Thus, the cooling action of the exhaust particulate trapping means 12 through heat exchange with the exhaust gases can be kept up to suppress that the temperature of the exhaust particulate trapping means 12 excessively rises on engine deceleration.

To provide a method for manufacturing an SOI substrate provided with a single-crystal semiconductor layer which is suitable for practical use even when a substrate of which heat-resistant temperature is low, such as a glass substrate, is used, and to manufacture a highly reliable semiconductor device using such an SOI substrate. A semiconductor layer, which is separated from a semiconductor substrate and bonded to a supporting substrate having an insulating surface, is heated by supplying high energy by using at least one kind of particles having the high energy, and polishing treatment is performed on the heated surface of the semiconductor layer. At least part of a region of the semiconductor layer can be melted by the heat treatment by supplying high energy to reduce crystal defects in the semiconductor layer. Further, the surface of the semiconductor layer can be polished and planarized by the polishing treatment.

In the optical element fixing method, when optical element 10 is adhesively fixing member 20 by using the optical-curing adhesive, the optical-curing adhesive is applied on at least one of the adhesion sections of the optical element and the adhesive section of the fixing member, and the optical-curing adhesive is irradiated with the light from the light source through the loading jig while the load is being applied to the adhesion fixing section through loading jig 31 made of light-transmissive material.

A radiation imaging apparatus is capable of taking a moving picture by acquisition by a reading circuit of a plurality of radiation image signals on the basis of a plurality of successive times of irradiation of a radiation detector with radiation rays. The radiation detector has a two-dimensional array of pixels. In a period between a start of an n-th time of irradiation with radiation rays and a start of an (n+1)-th time of irradiation with radiation rays, where n is a natural number, a controller switches an operation status of an analog-to-digital converter that converts electric signals read by the reading circuit into digital signals so that power consumption of the analog-to-digital converter is reduced.

A molding machine having a lubrication mechanism according to the present invention can effectively rubricate a ball screw and elongate a service life of the ball screw. In a clamping apparatus of an electric injection molding machine, a rotational movement of a rotational shaft of a motor is converted into a linear movement in an axial direction by a ball screw mechanism. Atomized lubrication oil is directly sprayed inside the ball screw nut from a spray nozzle. The lubrication oil, which has been sprayed from the spray nozzle, is recovered and reused.

The present invention suppresses temperature rise of an optical near-field generator while increasing optical near-field intensity in a thermally assisted magnetic recording head using a conductive scatterer as the optical near-field generator. The present invention uses a conductive scatterer having a cross-sectional shape in which its width is gradually reduced toward an apex where an optical near-field is generated, and also has a shape in which its width is reduced gradually or in a stepwise fashion toward the apex where the optical near-field is generated in a traveling direction of incident light.

A power transmission coil in which heat generation by a magnetic shield itself can be suppressed as far as possible is provided.A power transmission coil is configured by: a coil (1) wound in a plane; and a magnetic shield member (2) disposed on the rear surface of the coil (1). A most part, e.g. 65% or more, and preferably 70% or more of the area of the surface of the magnetic shield member (2) on which the coil is disposed is covered by the coil (1). In this case, the magnetic shield member (2) is formed in a rectangular shape, and the coil (1) is formed in a rectangular shape similar to the magnetic shield member (2).

A light emitting device (1) includes a LED chip (10) as well as a mounting substrate (20) on which the LED chip (10) is mounted. Further, the light emitting device (1) includes a cover member (60) and a color conversion layer (70). The cover member (60) is formed to have a dome shape and is made of a translucency inorganic material. The color conversion layer (70) is formed to have a dome shape and is made of a translucency material (such as, a silicone resin) including a fluorescent material excited by light emitted from the LED chip (10) and emitting light longer in wavelength than the light emitted from the LED chip (10). The cover member (60) is attached to the mounting substrate (20) such that there is an air layer (80) between the cover member (60) and the mounting substrate (20). The color conversion layer (70) is superposed on a light-incoming surface or a light-outgoing surface of the cover member (60).

A bulb-type fluorescent lamp has a case having an open end portion for housing a lighting circuit therein, an arc tube extending outside through the open end portion of the case, and a globe having an open end portion for housing the arc tube therein. An adhesive is supplied to the inner surface of the open end portion of the case at four circumferentially spaced areas, and the open end portion of the globe is inserted into the open end portion of the case. As a result, the globe is fixed to the case with the adhesive.

An ultrasonic probe has a probe proper, a connector and a cable for electrically connecting between the probe proper and the connector. The probe proper includes a transducer that converts between ultrasonic wave and electricity, and a phase change member having a property to cause a phase change of from solid to liquid at a particular temperature reached in an operation time period of the transducer and a phase change of from liquid to solid at lower than the particular temperature.

A surface-emission laser diode comprises a cavity region over a semiconductor substrate and includes an active layer containing at least one quantum well active layer producing a laser light and a barrier layer, a spacer layer is provided in the vicinity of the active layer and formed of at least one material, an upper and lower reflectors are provided at a top part and a bottom part of the cavity region, the cavity region and the upper and lower reflectors form a mesa structure over the semiconductor substrate, the upper and lower reflectors being formed of a semiconductor distributed Bragg reflector having a periodic change of refractive index and reflecting incident light by interference of optical waves, at least a part of the semiconductor distributed Bragg reflector is formed of a layer of small refractive index of AlxGa1-xAs (0<x≦1) and a layer of large refractive index of AlyGa1-yAs (0≦y<x≦1), the lower reflector is formed of a first lower reflector having a low-refractive index layer of AlAs and a second lower reflector formed on the first lower reflector, the second lower reflector has a low-refractive index layer of AlGaAs, any one layer constituting the cavity region contains In.

The invention relates to a multifunctional braking power testing platform which comprises the components of a base; a power and inertia chamber which is arranged on the base and comprises a power unit and a mechanical inertia unit; a first testing chamber which is arranged on the base and is mounted on one end of the power and inertial chamber; and a second testing chamber which is arranged on the base and is mounted on the other end of the power and inertia chamber, wherein a first braking device in the first testing chamber is different from a second braking device of the second testing chamber. The multifunctional braking power testing platform can be used for disc braking, tread braking, eddy current braking or magnetic rail braking tests of high-speed train and other rail vehicles, thereby reproducing a braking energy conversion process in a 1:1 manner and testing braking performance in real time.