722results about How to "Inhibit temperature rise" patented technology

A backlight unit is provided with LEDs having a cooling structure. The backlight according to an embodiment includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. In operation, heat generated from the LEDs is conducted via the PCB and the heat pipe and is radiated by the heat sink.

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

An ultrasonic probe has a probe proper, a connector and a cable for electrically connecting between the probe proper and the connector. The probe proper includes a transducer that converts between ultrasonic wave and electricity, and a phase change member having a property to cause a phase change of from solid to liquid at a particular temperature reached in an operation time period of the transducer and a phase change of from liquid to solid at lower than the particular temperature.

A lighting apparatus with LED includes a metal-made main body 90; a plurality of LED chip units 1 each including an LED chip and a pair of lead terminals 42, 43 electrically connected to electrodes of the LED chip; and a dielectric layer 80 disposed between the main body 90 and each LED chip unit 1 for making electrical insulation therebetween as well as bond the same. The circuit board 20 is formed with a plurality of windows 23 through which the individual LED chip units 1 extend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main body 90 through the dielectric layer 80, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.

A portable information device such as a notebook type computer is provided with a highly efficient thermal insulator capable of blocking transfer of heat between an internal heating component and a device enclosure, so as to reduce temperature rise on a surface of the device. The portable information device is also provided with a highly efficient thermal insulator to block transfer of heat between the heating component and an expansion unit mounting case, thereby reducing temperature rise and preventing malfunction of an external expansion unit. The information device includes the thermal insulator to separate between the internal heating component and the device enclosure, another thermal insulator to separate between the heating component and the expansion unit mounting case, and a heat sink. The thermal insulator is a vacuum thermal insulator including inorganic fiber as a core member.

A battery cooling system includes a depression-shaped battery accommodating section formed at a bottom surface of a floor panel of a vehicle and dented to side of a passenger compartment so as to accommodate therein a battery. An introduction device is disposed in front of the battery in a vehicle traveling direction, to introduce travel air flow into the battery accommodating section. Here, the battery is accommodated within the battery accommodating section in a condition where a bottom surface of the battery is located at a level above or at a substantially same level as a level of a bottom surface of the vehicle which bottom surface is around the accommodating section. Additionally, the battery includes a plurality of thin cells which are electrically connected with each other, and disposed in a posture that a major surface of each thin cell extends substantially parallelly with the vehicle traveling direction.

A power reception coil unit includes a power reception coil configured to be magnetically coupled to a power supply coil during a power transmission and a magnetic plate made of a magnetic material having electrical conductivity. The power reception coil is a planar coil. The magnetic plate has its surface opposed to the power reception coil and is parallel to the power reception coil. The magnetic plate is provided with a plurality of slits in the surface.

A fixing apparatus and an image formation apparatus therewith are disclosed. According to the fixing apparatus, a heating range that is heated by electromagnetic induction caused by a current flowing through a coil unit is finely tunable by covering a part of a core unit with a shielding member. Further, the core unit has a projecting section at an end of the core unit, which projecting section projects toward the coil unit in comparison with the central part of the core unit.

A fixing apparatus and an image formation apparatus therewith are disclosed. According to the fixing apparatus, a heating range that is heated by electromagnetic induction caused by a current flowing through a coil unit is finely tunable by covering a part of a core unit with a shielding member. Further, the core unit has a projecting section at an end of the core unit, which projecting section projects toward the coil unit in comparison with the central part of the core unit.

In the optical element fixing method, when optical element 10 is adhesively fixing member 20 by using the optical-curing adhesive, the optical-curing adhesive is applied on at least one of the adhesion sections of the optical element and the adhesive section of the fixing member, and the optical-curing adhesive is irradiated with the light from the light source through the loading jig while the load is being applied to the adhesion fixing section through loading jig 31 made of light-transmissive material.

A radiation imaging apparatus is capable of taking a moving picture by acquisition by a reading circuit of a plurality of radiation image signals on the basis of a plurality of successive times of irradiation of a radiation detector with radiation rays. The radiation detector has a two-dimensional array of pixels. In a period between a start of an n-th time of irradiation with radiation rays and a start of an (n+1)-th time of irradiation with radiation rays, where n is a natural number, a controller switches an operation status of an analog-to-digital converter that converts electric signals read by the reading circuit into digital signals so that power consumption of the analog-to-digital converter is reduced.

A power transmission coil in which heat generation by a magnetic shield itself can be suppressed as far as possible is provided.A power transmission coil is configured by: a coil (1) wound in a plane; and a magnetic shield member (2) disposed on the rear surface of the coil (1). A most part, e.g. 65% or more, and preferably 70% or more of the area of the surface of the magnetic shield member (2) on which the coil is disposed is covered by the coil (1). In this case, the magnetic shield member (2) is formed in a rectangular shape, and the coil (1) is formed in a rectangular shape similar to the magnetic shield member (2).

A light emitting device (1) includes a LED chip (10) as well as a mounting substrate (20) on which the LED chip (10) is mounted. Further, the light emitting device (1) includes a cover member (60) and a color conversion layer (70). The cover member (60) is formed to have a dome shape and is made of a translucency inorganic material. The color conversion layer (70) is formed to have a dome shape and is made of a translucency material (such as, a silicone resin) including a fluorescent material excited by light emitted from the LED chip (10) and emitting light longer in wavelength than the light emitted from the LED chip (10). The cover member (60) is attached to the mounting substrate (20) such that there is an air layer (80) between the cover member (60) and the mounting substrate (20). The color conversion layer (70) is superposed on a light-incoming surface or a light-outgoing surface of the cover member (60).

A bulb-type fluorescent lamp has a case having an open end portion for housing a lighting circuit therein, an arc tube extending outside through the open end portion of the case, and a globe having an open end portion for housing the arc tube therein. An adhesive is supplied to the inner surface of the open end portion of the case at four circumferentially spaced areas, and the open end portion of the globe is inserted into the open end portion of the case. As a result, the globe is fixed to the case with the adhesive.

A surface-emission laser diode comprises a cavity region over a semiconductor substrate and includes an active layer containing at least one quantum well active layer producing a laser light and a barrier layer, a spacer layer is provided in the vicinity of the active layer and formed of at least one material, an upper and lower reflectors are provided at a top part and a bottom part of the cavity region, the cavity region and the upper and lower reflectors form a mesa structure over the semiconductor substrate, the upper and lower reflectors being formed of a semiconductor distributed Bragg reflector having a periodic change of refractive index and reflecting incident light by interference of optical waves, at least a part of the semiconductor distributed Bragg reflector is formed of a layer of small refractive index of AlxGa1-xAs (0<x≦1) and a layer of large refractive index of AlyGa1-yAs (0≦y<x≦1), the lower reflector is formed of a first lower reflector having a low-refractive index layer of AlAs and a second lower reflector formed on the first lower reflector, the second lower reflector has a low-refractive index layer of AlGaAs, any one layer constituting the cavity region contains In.