3392results about How to "Efficient heating" patented technology

A pre-baking apparatus for heating a substrate upstream of a process tool is adapted to be connected to an EFEM (equipment front end module) and includes: a chamber which has a front face with multiple slots arranged in a height direction of the chamber, and which is divided into multiple compartments extending from the multiple slots, respectively, toward a rear end of the chamber for loading and unloading substrates; and a connecting frame for connecting the chamber to the process tool. The multiple compartments are separated from each other by a divider plate and provided with heaters for heating the multiple compartments, and each compartment has a gas injection port for blowing a hot inert gas over the substrate placed therein toward the slot.

A pedestal for supporting a substrate includes: a heating plate for heating the substrate; an upper cooling plate for cooling the substrate, installed on the heating plate and provided with an upper fluid path for passing a cooling fluid therethrough; and an lower cooling plate for cooling the substrate, installed under the heating plate and including a lower fluid path for passing a cooling fluid therethrough.

The present invention describes a light emitting diode illumination apparatus made of a light bulb base, a heat dissipating device, a plastic lid, a drive substrate, a metal substrate, a circular insulated base and a casing, and the heat dissipating device is in contact with the metal substrate in normal conditions, such that the heat source produced by each light emitting diode is conducted to the heat dissipating device through the metal substrate and then conducted from the heat dissipating device to the light bulb base for effectively dispersing the heat source and maintaining the light emitting efficiency of each light emitting diode.

An induction plasma torch comprises a tubular torch body, a gas distributor head located at the proximal end of the torch body for supplying at least one gaseous substance into the chamber within the torch body, a higher frequency power supply connected to a first induction coil mounted coaxial to the tubular torch body, a lower frequency solid state power supply connected to a plurality of second induction coils mounted coaxial to the tubular torch body between the first induction coil and the distal end of this torch body. The first induction coil provides the inductive energy necessary to ignite the gaseous substance to form a plasma. The second induction coils provide the working energy necessary to operate the plasma torch. The second induction coils can be connected to the solid state power supply in series and / or in parallel to match the impedance of this solid state power supply.

A heatsink mounted to an electronic device having an area substantially greater than that of the device includes a heatpipe in the heatsink for transferring heat within the heatsink to reduce thermal gradients therein.

A compound having a of the present invention has the diphenylanthracene structure at the center and a specific structure substituted with an aryl group at end portions. An organic electroluminescence device comprises a plurality of layers of thin films of organic compounds which comprise a light emitting layer or a plurality of layers comprising a light emitting layer and are disposed between a pair of electrodes and at least one of the layers of thin films of organic compounds comprises the above compound. The compound exhibits excellent efficiency of light emission and heat resistance, has a long life and emits bluish light having excellent purity of color and the organic electroluminescence device comprises the compound and exhibits the same advantageous properties.

For manufacture of a semiconductor device using a low heat resistant substrate such as a glass substrate, a method of heat treatment for activating an impurity element that is used to dope a semiconductor film and for performing gettering on the semiconductor film in a short period of time without deforming the substrate, is provided. Also provided is a heat treatment apparatus for carrying out the above heat treatment. The heat treatment method of the present invention involves irradiating an object with light emitted from a lamp light source, and is characterized in that the lamp light source emits light for 0.1 to 20 seconds at a time and that light from the lamp light source irradiates the object several times. The method is also characterized in that the irradiated region is subjected to pulsating light from the lamp light source such that the irradiated region holds the temperature to its highest for 0.5 to 5 seconds. The method is also characterized in that the amount of coolant to be supplied is increased or reduced in accordance with blinking of the lamp light source to enhance the effect of the heat treatment on the semiconductor film and to prevent a heat-induced damage to the substrate.