The invention relates to a production technology of a PCB (Printed Circuit Board) solder mask, which comprises the following steps of: a first board grinding, a first silk screen, a first pre-braking,a first contraposition exposure, a first development, a first post-baking, a second board grinding, a second silk screen, a second pre-braking, a second contraposition exposure, a second developmentand a second post-baking, wherein the mesh number of the first silk screen is larger than that of the second silk screen, and the windowing size of the first contraposition exposure is larger than that of the second contraposition exposure. The production technology of the PCB solder mask better eliminates the harmful defects in the solder mask production process that green oil and the like easilysolders an oil plughole, the developing is dirty, the circuit becomes red, and the lateral erosion of a film printing and development is large and the like, thereby improving the production efficiency and the production quality, speeding up the production schedule and reducing the production cost.