33156 results about "Heat resistance" patented technology

A material for organic electroluminescence devices for use as a host material in combination with at least one phosphorescent metal complex, which comprises a compound having a specific heterocyclic structure, is described. Also described is an organic electroluminescence device having an anode, a cathode and an organic thin film layer having one or more layers. The organic thin film layer is interposed between the anode and cathode and has a light emitting layer containing a host material in combination with at least one phosphorescent metal complex. At least one layer of the organic thin film layer contains the material for organic electroluminescence devices. The material for organic electroluminescence devices provides an organic electroluminescence device which has a high emitting efficiency, causes little pixel defects, is excellent in heat resistance, and show a long lifetime.

The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for use in a UV-cure chamber. The heat transfer assembly includes a heating element to control the wafer temperature and a cooling element to remove incident IR heat from the wafer and pedestal. A heat resistant layer having a calibrated heat resistance is located between the heating and cooling elements and between the wafer and the cooling elements. The heat resistant layer is able to sustain high temperature gradient from the wafer to the coolant so that the coolant does not boil while permitting enough heat to be conducted away from the wafer to maintain the desired set-point temperature.

In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).

This ceramic sheath type thermocouple has a long service life, an improved temperature measuring responsibility and an improved temperature measuring precision, and enables repetitive use. The ceramic sheath type thermocouple has its protective tube 1 formed of a heat resisting ceramics selected from silicon nitride, sialon and silicon carbide. In the protective tube 1 are installed a pair of W-Re wires that are connected to form a joint portion constituting a temperature measuring point 5. A filler made of Si3N4 reaction-sintered ceramics is loaded into the front end portion of the protective tube to enclose the W-Re wires. Another filler made of SiC whisker with a heat conductivity smaller than that of the filler of the front end portion is loaded into the rear portion of the protective tube. An inert gas is sealed in the protective tube. Alternatively, the temperature measuring portion may be formed by exposing from the front end portion of the protective tube the joint portion where the ends of the W-Re wires are connected. The temperature measuring portion is coated with a cover film that is made of silicon carbide, silicon nitride or a composite of these, all having excellent heat resisting and corrosion resisting properties.

Provided is an LED lighting system with a smaller heat resistance of the LED, which can be produced by simpler mounting steps and is capable of three-dimensionally arranging the LEDs depending on required directivity of each system. A plurality of LEDs 2 are mounted on an FPC 1 which has a radial shape and can be flat when developed. The LEDs 2 connected by printed wiring to each other and linked to terminals 3 and 4 are attached on a surface of a core 5 made of a material having a high thermal conductivity. Heat generated at a p-n junction of the LEDs 2 is transmitted to the core 5 via the FPC 1 and a thermal-conductive adhesive.

This invention relates to flexible, transparent and conductive coatings and films formed using single wall carbon nanotubes and polymer binders. Preferably, coatings and films are formed from carbon nanotubes (CNT) applied to transparent substrates forming one or multiple conductive layers at nanometer level of thickness. Polymer binders are applied to the CNT network coating having an open structure to provide protection through infiltration. This provides for the enhancement of properties such as moisture resistance, thermal resistance, abrasion resistance and interfacial adhesion. Polymers may be thermoplastics or thermosets, or any combination of both. Polymers may also be insulative or inherently electrical conductive, or any combination of both. Polymers may comprise single or multiple layers as a basecoat underneath a CNT coating, or a topcoat above a CNT coating, or combination of the basecoat and the topcoat forming a sandwich structure. Binder coating thickness can be adjusted by changing binder concentration, coating speed and / or other process conditions. Resulting films and articles can be used as transparent conductors for flat panel display, touch screen and other electronic devices.

An organic electroluminescence device having a layer of an organic light emitting medium which comprises (A) a specific arylamine compound and (B) at least one compound selected from specific anthracene derivatives, spirofluorene derivatives, compounds having condensed rings and metal complex compounds and is disposed between a pair of electrodes and an organic light emitting medium comprising the above components (A) and (B) are provided. The organic electroluminescence device exhibits a high purity of color, has excellent heat resistance and a long life and efficiently emits bluish to yellowish light. The organic light emitting medium can be advantageously used for the organic electroluminescence device.

A luminous body of prolonged fluorescence lifetime characterized by comprising not only an activator but also at least one coactivator selected from the group consisting of La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Bi, Sn, Sb and analogues thereof as a further luminescent center for enhancing the thermostability of luminous body. This luminous body excels in thermostability and fluorescence lifetime, so that it is useful as a luminous body for LED.

A material for organic electroluminescence device with specific structure. An an organic electroluminescence device comprising a cathode, an anode and an organic thin film layer which is sandwiched between the cathode and the anode and comprises at least one layer, wherein at least one layer in the organic thin film layer contains a material for the organic electroluminescence device described above. An organic electroluminescence device with excellent efficiency of light emission, without pixel defects, which is superior in heat resistance and prolonged lifetime is obtained.

A filled polymer composition comprises (i) an ethylene / α-olefin interpolymer, and (ii) a filler. The ethylene / α-olefin interpolymer is a block copolymer having at least a hard block and at least a soft block. The soft block comprises a higher amount of comonomers than the hard block. The block interpolymer has a number of unique characteristics disclosed here. The filled polymer compositions provided herein, in certain embodiments, have relatively higher heat resistance and improved noise, vibration and harshness properties and can be used in automotive floorings, roofings, wire and cable coating applications.

The invention provides a thermoplastic elastomer composition having mechanical properties equivalent or superior to those of conventional thermoplastic elastomer compositions and having excellent heat resistance and oil resistance and a preparation process thereof, and molded or formed products making use of this thermoplastic elastomer composition. The thermoplastic elastomer composition according to the present invention contains a thermoplastic resin having a polar group and an ethylene•α-olefin elastomer having a functional group. The ethylene•α-olefin elastomer having the functional group is preferably a random copolymer obtained by copolymerizing ethylene, an α-olefin having 3 to 10 carbon atoms, an unsaturated monomer having the functional group and an optional non-conjugated diene.

New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

The following resist composition which is excellent particularly in transparency to light beams and dry etching properties and gives a resist pattern excellent in sensitivity, resolution, evenness, heat resistance, etc., as a chemical amplification type resist, is presented. A resist composition which comprises a fluoropolymer (A) having repeating units represented by a structure formed by the cyclopolymerization of one molecule of a fluorinated diene and one molecule of a monoene, in which the monoene unit in each repeating unit has a blocked acid group capable of regenerating the acid group by the action of an acid, an acid-generating compound (B) which generates an acid upon irradiation with light, and an organic solvent (C).

The present invention provides a decorative floor covering comprising a surface layer and a substrate layer underneath, wherein the surface layer comprises a polyethylene terephthalate film layer, and a method for preparing the same. Furthermore, the present invention provides a decorative floor covering comprising a surface layer and a substrate layer underneath, wherein a light weight back layer is further comprised under the substrate layer, and a method for preparing the same. A decorative floor covering of the present invention is a decorative floor covering which has superior surface heat resistance, printing sharpness and realism, and it can be installed conveniently since not only can non-foamed polyvinyl chloride resin be used as a substrate layer, but also the weight of a floor covering is light when a light weight back layer is comprised under the substrate layer.

To provide the method of forming the thin coating film of fluorine-containing polymer having heat resistance and non-sticking property by adhering directly to a substrate without lowering characteristics such as reflection and light transmission which the substrate has. The thin coating film is a film which comprises a continuous layer of fluorine-containing polymer formed by adhering directly to the substrate and has a thickness of less than 3 mum, wherein the fluorine-containing polymer in the coating film has a hydrophilic functional group and a crystalline melting point of not less than 200° C.

The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.

The composite oxide and the composite oxide carrier are manufactured by the precursor forming step and firing step. The composite oxide catalyst is obtained by preparing a composite of catalytic components simultaneously with the formation of the precursor of composite oxide in the step of forming the precursor of composite oxide. The composite oxide and the composite oxide carrier are composed of a composite oxide in which at least one of cerium and zirconium, and aluminium disperse with extremely high homogeneity. With this structure, the heat resistance of the carrier is improved and consequently, enlargement of particles of the composite oxide defining the carrier, and sintering of adjacent particles of the composite oxide can be restrained, whereby the catalyst using the composite oxide carrier in accordance with the present invention is excellent in heat resistance.

A heat-expandable microcapsule comprising a polymer shell formed by polymerizing (I) acrylonitrile, a main monomer component, (II) a monomer having carboxyl and (III) a monomer having groups reactive with the carboxyl of the monomer (II) and of a liquid having a boiling point lower than the softening point of the polymer and being encapsulated in the polymer shell. The heat-expandable microcapsules expand within high temperature range, 240° C. or above, and have heat-resistance.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

Reflective polarization valve engine and projection display are disclosed. Instead of prism PBS, the projector applies wire-grid polarizers with advantages of higher heat-resistance, no limitation of the incident angle and no birefringence effects, to provide excellent contrast luminance. The light source in the projector utilizes an elliptical lamp under a telecentric optical system to achieve higher efficiency and avoid color gradient. In addition, the light paths are in special arrangement. The original beam is first splitted into RGB, and then proceeding with color-recombining right after being polarized via wire-grid polarizers and analyzed by reflective polarization valves. Hence, the analyzed beams finally are recombined images with superior performances.

A plasma etching apparatus is provided which can prevent corrosion of an aluminum substrate constituting an etching processing chamber or an inside component thereof, thereby avoiding a reduction in productivity due to scattering of a sprayed coating. In the plasma etching apparatus, an anodic oxide film is disposed between a ceramic sprayed coating with excellent resistance to plasma, and the etching processing chamber and the inside component thereof made of aluminum alloy. The anodic oxide film has a thickness of 5 μm or less to have heat resistance.

A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and the color filters. Light emitting elements cover the thin film transistors and emit light through the substrate that is through the adhesive layer and color filter. The substrate may be plastic, thus increasing the heat resistance.

Polycrystalline diamond constructions of this invention have a polycrystalline diamond body and a substrate attached thereto, wherein the diamond body has a material microstructure comprising a plurality of bonded-together diamond crystals forming a polycrystalline matrix phase, and second phase formed from different types of materials or sintering aids designed to reduce or eliminate the amount of free Group VIII elements therein. The use of such materials and the reduction and / or elimination of free Group VIII elements, in addition to graphitization, facilitates the sintering the construction at high pressure / high temperature conditions, e.g., greater than about 65 Kbar, to produce a construction having a high degree of thermal stability and / or thermal resistance when compared to conventional PCD materials. Polycrystalline diamond constructions of this invention are preferably configured as cutting elements that are disposed on drill bits used for drilling subterranean earthen formations.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

A polysiloxane composition having high transparency, while being excellent in heat resistance and light resistance is provided.A polysiloxane composition is composed of (A) a polysiloxane which is a polysiloxane compound having a polyhedral skeleton having 6 to 24 silicon atoms in its molecule and which has at least one group containing a hydrolyzable silyl group bonded to a Si atom constituting the polyhedral skeleton, and (B) a photoacid generator. The hydrolyzable silyl group is preferably an alkoxysilyl group.

Cushioning net structures comprise random loops, such as three-dimensional random loops, bonded with one another, wherein the loops are formed by allowing continuous fibers, made of ethylene / α-olefin interpolymers, to bend to come in contact with one another in a molten state and to be heat-bonded at most contact points. The structures provided herein have desirable heat resistance, durability and cushioning property. The cushioning structures are used in furniture, vehicle seats etc.