33062 results about "Heat resistance" patented technology

This ceramic sheath type thermocouple has a long service life, an improved temperature measuring responsibility and an improved temperature measuring precision, and enables repetitive use. The ceramic sheath type thermocouple has its protective tube 1 formed of a heat resisting ceramics selected from silicon nitride, sialon and silicon carbide. In the protective tube 1 are installed a pair of W-Re wires that are connected to form a joint portion constituting a temperature measuring point 5. A filler made of Si3N4 reaction-sintered ceramics is loaded into the front end portion of the protective tube to enclose the W-Re wires. Another filler made of SiC whisker with a heat conductivity smaller than that of the filler of the front end portion is loaded into the rear portion of the protective tube. An inert gas is sealed in the protective tube. Alternatively, the temperature measuring portion may be formed by exposing from the front end portion of the protective tube the joint portion where the ends of the W-Re wires are connected. The temperature measuring portion is coated with a cover film that is made of silicon carbide, silicon nitride or a composite of these, all having excellent heat resisting and corrosion resisting properties.

The present invention relates to a photosensitive composition comprising a triazine-based photoactive compound containing oxime ester. The photosensitive composition according to the present invention has good sensitivity, retention rate, mechanical strength, heat resistance, chemical resistance and developing durability since it contains, as photopolymerization initiator, a compound having an oxime ester group and a triazine group in one molecule and thus effectively absorbs UV radiation. Therefore, the photosensitive composition according to the present invention is advantageous not only in curing of materials for color filters, resin black matrixes, column spacers, overcoats and passivation films of liquid crystal displays, but also in high temperature process characteristics.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

The invention provides a thermoplastic elastomer composition having mechanical properties equivalent or superior to those of conventional thermoplastic elastomer compositions and having excellent heat resistance and oil resistance and a preparation process thereof, and molded or formed products making use of this thermoplastic elastomer composition. The thermoplastic elastomer composition according to the present invention contains a thermoplastic resin having a polar group and an ethylene•α-olefin elastomer having a functional group. The ethylene•α-olefin elastomer having the functional group is preferably a random copolymer obtained by copolymerizing ethylene, an α-olefin having 3 to 10 carbon atoms, an unsaturated monomer having the functional group and an optional non-conjugated diene.

The present invention provides a decorative floor covering comprising a surface layer and a substrate layer underneath, wherein the surface layer comprises a polyethylene terephthalate film layer, and a method for preparing the same. Furthermore, the present invention provides a decorative floor covering comprising a surface layer and a substrate layer underneath, wherein a light weight back layer is further comprised under the substrate layer, and a method for preparing the same. A decorative floor covering of the present invention is a decorative floor covering which has superior surface heat resistance, printing sharpness and realism, and it can be installed conveniently since not only can non-foamed polyvinyl chloride resin be used as a substrate layer, but also the weight of a floor covering is light when a light weight back layer is comprised under the substrate layer.

The composite oxide and the composite oxide carrier are manufactured by the precursor forming step and firing step. The composite oxide catalyst is obtained by preparing a composite of catalytic components simultaneously with the formation of the precursor of composite oxide in the step of forming the precursor of composite oxide. The composite oxide and the composite oxide carrier are composed of a composite oxide in which at least one of cerium and zirconium, and aluminium disperse with extremely high homogeneity. With this structure, the heat resistance of the carrier is improved and consequently, enlargement of particles of the composite oxide defining the carrier, and sintering of adjacent particles of the composite oxide can be restrained, whereby the catalyst using the composite oxide carrier in accordance with the present invention is excellent in heat resistance.

A heat-expandable microcapsule comprising a polymer shell formed by polymerizing (I) acrylonitrile, a main monomer component, (II) a monomer having carboxyl and (III) a monomer having groups reactive with the carboxyl of the monomer (II) and of a liquid having a boiling point lower than the softening point of the polymer and being encapsulated in the polymer shell. The heat-expandable microcapsules expand within high temperature range, 240° C. or above, and have heat-resistance.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

A plasma etching apparatus is provided which can prevent corrosion of an aluminum substrate constituting an etching processing chamber or an inside component thereof, thereby avoiding a reduction in productivity due to scattering of a sprayed coating. In the plasma etching apparatus, an anodic oxide film is disposed between a ceramic sprayed coating with excellent resistance to plasma, and the etching processing chamber and the inside component thereof made of aluminum alloy. The anodic oxide film has a thickness of 5 μm or less to have heat resistance.

A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and the color filters. Light emitting elements cover the thin film transistors and emit light through the substrate that is through the adhesive layer and color filter. The substrate may be plastic, thus increasing the heat resistance.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

An organic electroluminescence element comprising: an anode layer, a cathode layer, and an organic luminescence layer therebetween, the organic luminescence layer having a carbazole derivative with a glass-transition temperature of 110° C. or higher, and a phosphorescent dopant. This structure makes it possible to provide an organic electroluminescence element which can make use of the triplet exciton state of the carbazole derivative even at room temperature and which has a practical life and superior heat-resistance.