18323 results about "Melting point" patented technology

This invention relates generally to low ethylene insertions into I-olefin polymers and processes for production of such polymers using unbridged fluxional metallocenes, primarily substituted aryl indenyl metallocenes, and more particularly to use of unbridged, fluxional, cyclopentadienyl or indenyl metallocene catalyst systems in methods of production of high melting point I-olefin homo- and co-polymers, particularly elastomeric crystalline and amorphous block homo- and co-polymers of I-olefins. The activity of fluxional unbridged metallocene polymerization catalysts containing at least one 2-arylindene ligand is increased 10x or more by the addition of small (typically 0.1-10 wt. %) amounts of ethylene to the polymerization system, which increase is termed the Polymerization Rate-Enhancement effect (PRE), which is measured in terms of an Ethylene Enhancement Factor (EEF) as a dimensionless ratio in the range of from about 1.1 to about 10 or above. The amount of ethylene included in the reaction system can be selected and controlled to be so small as to result in essentially minimal (<2 mole %) incorporation of ethylene units into the resulting elastomeric polymer and the molecular weight may be increased. Amounts of ethylene to generate the PRE effect may be greater than 0.1 wt. % and preferably range up to about 2 wt. %. However, if a polymer with more ethylene is desired, additional ethylene may be incorporated into the polymerization feed, including up to 10 to about 50 mole % based on olefin units. A second important aspect of this invention is the ability to use a PRE activity-enhancing amount of ethylene in an olefin polymerization without substantially affecting the physical properties of the elastomer. In a third important aspect of this invention, I-olefin elastomers are produced through incorporation of ethylene using unbridged fluxional catalyst systems which may not otherwise produce acceptable elastomeric homopolymers. This effect is termed the EPE effect, for Elastomeric Property-Enhancing effect. The EPE amount of ethylene required to produce such elastomers typically overlaps the PRE activity-enhancing amount. Incorporation of up to about 5 mole % or more of ethylene typically will produce an elastomeric polymer using such catalyst systems. Typical useful amounts of incorporated ethylene include about 1 to 3 mole %. Preferred polymers of this invention retain sufficient crystallinity to provide a high melting point (by DSC) of about 80° C., preferably above 100° C., including in the range of from about 120° C. to about 140° C. and above. Novel flexible alpha-olefin homo and copolymers having elongation in excess of 600% and substantially no retained force are disclosed.

A transfer film comprising a base film, a transfer layer, and a transfer auxiliary layer formed between the base film and the transfer layer so as to be in contact with at least the transfer layer, this transfer auxiliary layer having a melting point or a glass transition temperature lower than that of the transfer layer, wherein at least a portion of the transfer layer can be thermally transferred onto a substrate.

A foamed electrical wire, containing: a conductor; and a foamed insulating layer; in which the foamed insulating layer comprises a thermoplastic resin that is a crystalline thermoplastic resin having a melting point of 150° C. or more or a non-crystalline thermoplastic resin having a glass transition temperature of 150° C. or more, and the average bubble diameter of the foamed insulating layer is 5 μm or less.

The present invention relates to compositions and methods for forming a bit body for an earth-boring bit. The bit body may comprise hard particles, wherein the hard particles comprise at least one carbide, nitride, boride, and oxide and solid solutions thereof, and a binder binding together the hard particles. The binder may comprise at least one metal selected from cobalt, nickel, and iron, and, optionally, at least one melting point reducing constituent selected from a transition metal carbide in the range of 30 to 60 weight percent, boron up to 10 weight percent, silicon up to 20 weight percent, chromium up to 20 weight percent, and manganese up to 25 weight percent, wherein the weight percentages are based on the total weight of the binder. In addition, the hard particles may comprise at least one of (i) cast carbide (WC+W2C) particles, (ii) transition metal carbide particles selected from the carbides of titanium, chromium, vanadium, zirconium, hafnium, tantalum, molybdenum, niobium, and tungsten, and (iii) sintered cemented carbide particles.

A primary carpet backing that is tuftable with carpet face yarn has a self-bonded or spunbonded or needlepunched nonwoven adhesive fabric needled or thermally bonded to a supporting fabric. The supporting fabric is a tuftable woven primary backing fabric comprising thermoplastic warp and weft yarns having substantially rectangular cross-sections. The nonwoven adhesive fabric comprises fibers or filaments of a thermoplastic resin having flow properties corresponding to a MI of above 30 g / 10 min. as measured in accordance with ASTM D 1238 at 190° C. The nonwoven adhesive fabric also has a melting point at least about 20° C. less than a melting point of the thermoplastic of the yarns of the supporting fabric so that the nonwoven-adhesive fabric is capable of melting fully in a final product. The melted fabric can help secure pile to the backing in carpet applications.

The invention relates to a telecommunications cable module comprising at least one optical fiber surrounded by a protective skin of a thermoplastic elastomer having flexible diol segments, and in particular a polyester thermoplastic elastomer. In the invention, the thermoplastic elastomer having flexible diol segments presents a melting point greater than 130° C. and an initial resistance to tearing less than 60 kN / m. The material proposed by the invention is easily applied to fibers, in particular by extrusion.

The present invention relates to film layers and compositions having improved hot tack properties. The compositions comprise at least one ethylene / α-olefin interpolymer, wherein the ethylene / α-olefin interpolymer may have, for example, a Mw / Mn from about 1.7 to about 3.5, at least one melting point, Tm, in degrees Celsius, and a density, d, in grams / cubic centimeter, wherein the numerical values of Tm and d correspond to the relationship:Tm>−2002.9+4538.5(d)−2422.2(d)2.

A method for producing shaped articles of ceramic composites provides a high degree of dimensional tolerance to these articles. A fiber preform is disposed on a surface of a stable formed support, a surface of which is formed with a plurality of indentations, such as grooves, slots, or channels. Precursors of ceramic matrix materials are provided to the fiber preform to infiltrate from both sides of the fiber preform. The infiltration is conducted under vacuum at a temperature not much greater than a melting point of the precursors. The melt-infiltrated composite article substantially retains its dimension and shape throughout the fabrication process.

Improved thermoplastic polymer blend compositions comprising an isotactic polypropylene component and an alpha-olefin and propylene copolymer component, said copolymer comprising crystallizable alpha-olefin sequences. In a preferred embodiment, improved thermoplastic polymer blends are provided comprising from about 35% to about 85% isotactic polypropylene and from about 30% to about 70% of an ethylene and propylene copolymer, wherein said copolymer comprises isotactically crystallizable propylene sequences and is predominately propylene. The resultant blends manifest unexpected compatibility characteristics, increased tensile strength, and improved process characteristics, e.g., a single melting point.

A semiconductor device includes a semiconductor chip and a printed circuit board. Metal electrodes of the semiconductor chip and the internal connection terminals of the printed circuit board are electrically connected through the metallic joining via precious metal bumps. A melting point of a metal material constituting each of the metallic joining parts is equal to or higher than 275 degrees, and a space defined between the chip and the board is filled with resin (under fill) containing 50 vol % or more inorganic fillers.

A golf club head includes a golf club head body and a weight member. The golf club head member has a recession in which the weight member is mounted. The weight member is securely mounted in the recession of the golf club head body by a welding procedure that uses a welding material. The weight member is made of a material having a melting point higher than that of the golf club head body, avoiding melting of the weight member during the welding procedure. Only a portion of the golf club head body fuses with the welding material while using the welding material for proceeding with the welding procedure for the weight member.