An electronic device module comprising:A. At least one electronic device, e.g., a
solar cell, andB. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an
ethylene-based
polymer composition characterized by a
Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit / 1,000,000C, preferably the
ethylene-based
polymer compositions comprise up to about 3
long chain branches / 1000 carbons, more preferably from about 0.01 to about 3
long chain branches / 1000 carbons; the
ethylene-based
polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit / 1,000,000C; the ethylene-based polymer compositions can have a bimodal molecular
weight distribution (MWD) or a multi-
modal MWD; the ethylene-based polymer compositions can have a
comonomer distribution profile comprising a mono or bimodal distribution from 35° C. to 120° C., excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl
silane, (3) optionally, a free
radical initiator, e.g., a
peroxide or
azo compound, or a
photoinitiator, e.g.,
benzophenone, and (4) optionally, a co-agent.