8715results about "Coupling device connections" patented technology

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

A solid-state light source 10 compatible with existing sockets normally reserved for filamented lamps may be formed with a hollow base 12 formed to mechanically and electrically adapt to a socket. A sub-assembly 14 adapted to cooperate with and fit into the hollow base 12 comprises a metal core 16 having a bulbous body 18 and a narrow, depending foot 20. A circuit board 22 substantially surrounds the metal core 16 on two sides. The board 22 is preferably formed from a flexible printed circuit board material capable of sustaining a bend radius of at least 0.25 inches (6 mm). Solid-state light sources 30, for example, light emitting diodes (LEDs) are mechanically and electrically connected to one side of the circuit board by suitable electrically conductive traces. A glass dome 34 covers the sub-assembly 14 after it is inserted into the hollow base 12 and is sealed thereto.

A light element includes a translucent shell and a base. The base supports a plurality of LEDs positioned so as to emit a light show through the shell. The device also includes a compartment for receiving and securing a replaceable volatile active cartridge and a heater for enabling the device to effectively emit an active ingredient from the cartridge when the cartridge is secured in the compartment. A white light source is provided in the shell as a source of illumination along with the LEDs The device can be used as a white light source, for displaying a colored light show, for displaying colored light schemes and for volatile active emission The devise may include an acoustic transducer for producing light and sound show. The devise may also include a light sensor, a motion detector and / or a microphone or acoustic receiver thereby enabling the light and sound show to be dependent upon ambient light intensity, motion detection and or / ambient noise.