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1750results about How to "Efficient heat dissipation" patented technology

High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof

The invention discloses a high heat-conducting thin graphene-based composite material, as well as a preparation method and an application thereof. The composite material comprises a base body component and a packing component, wherein the base body component and the packing component respectively include thin graphene, polymer and / or polymer monomer and a high heat-conducting material; the preparation method comprises a step of compounding the base body component with the packing component; the compounding method comprises fusing, ball-milling, solution blending, electrostatic spinning, solution spinning, melt-spinning, extruding by double screws, mixing by an open mill or powder metallurgy. The polymer, the thin graphene, the traditional high heat-conducting material and the like are compounded by a simple process, so as to form the product with excellent heat conducting property, and good mechanical and electrical properties. Therefore, the process is easy to perform and control, and cost is low; and the obtained product has a wide application prospect in the aspects such as efficient heat conduction and radiation.
Owner:苏州格瑞丰纳米科技有限公司

Vertical extended cavity surface emission laser and method for manufacturing a light emitting component of the same

The present invention relates to a method of manufacturing the light emitting component of a VECSEL and the corresponding VECSEL. In the method a layer stack (2) is epitaxially grown on a semiconductor substrate (1). The layer stack comprises an active region (4), an upper distributed Bragg reflector (5) and a n- or p-doped current injection layer (13) arranged between the active region (4) and the semiconductor substrate (1). A mechanical support (6) or submount is bonded to an upper side of the layer stack (2) and the semiconductor substrate (1) is subsequently removed. A metallization layer (7) is optionally deposited on the lower side of the layer stack (2) and an optically transparent substrate (8) is bonded to this lower side. The proposed method allows the manufacturing of such a component in a standard manner and results in a VECSEL with a homogenous current injection and high efficiency of heat dissipation.
Owner:KONINKLIJKE PHILIPS ELECTRONICS NV

Process and apparatus for manufacturing ethylene polymers and copolymers

The invention relates to a process for the manufacture of ethylene polymers and copolymers in which ethylene is compressed in a primary compressor at a throughput of at least 55 tonnes / hour, mixed with recycled ethylene and further compressed in a two-stage reciprocating secondary compressor having at least 14 cylinders to a pressure of at least 2300 bar at a throughput of at least 120 tonnes / hour, heating at least a portion of that ethylene to a temperature of at least 95° C. and introducing it into a tubular reactor of diameter at least 65 mm and a length of at least 1500 m, introducing initiator in at least three reaction zones to give a conversion of at least 28% and maintaining a pressure drop over the reactor to maintain a flow velocity of at least 6 m / s.
Owner:EXXONMOBIL CHEM PAT INC

LED retrofit luminaire

A retrofit light emitting diode (LED) lighting luminaire designed to have detachable and replaceable components for convenience and low cost in the luminaire maintenance including a heat dissipation member that includes detachable upper and lower sections with aligned radially extending fins, and a driver retained within the luminaire. The LED chip is retained against a surface of the lower heat dissipation member so that heat from the LED is transmitted to the radially extending fins to thereby effectively cool the LED lighting source and driver.
Owner:RASHIDI HAMID

Hand-held, heat sink cryoprobe, system for heat extraction thereof, and method therefore

A cryoprobe system utilizing a monolithic, insulated, hand-held thermal mass having an exposed tip for cryosurgical applications and the like, as well as a heat extraction base configured to interface with the thermal mass to quickly and efficiently reduce the heat of the thermal mass to cryogenic temperatures. The heat extraction base of the preferred embodiment of the present invention is configured to interface with the tip of the thermal mass, such that the tip plugs in securely to the base, to permit an efficient thermal transfer of heat from the thermal mass through the base via a heat exchange system communicating with the base which employs a low temperature cryo-refrigeration unit. The cryo-refrigeration unit may comprise a single low temperature cooling unit to reduce the temperature of the base to around minus one hundred degrees Centigrade utilizing off-the-shelf cryogenic refrigeration methods, or may utilize a series of more conventional refrigeration units in a primary and secondary heat extraction arrangement, which method may further utilize thermocouple or Peltier effect device assist to further reduce the temperature of the heat extraction base to the required temperature. Also claimed is the method of cryosurgery employing the device(s) of the present invention.
Owner:CRYOPEN

Millimeter wave module with an interconnect from an interior cavity

A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).
Owner:VEONEER US LLC

Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

InactiveUS20060091290A1Parasitic resistance and parasitic capacity be minimizeMinimum of parasitic resistanceTelevision system detailsSemiconductor/solid-state device detailsImage sensorEngineering
A semiconductor image sensor module and a method for manufacturing thereof as well as a camera and a method for manufacturing thereof are provided in which a semiconductor image sensor chip and an image signal processing chip are connected with a minimum parasitic resistance and parasitic capacity and efficient heat dissipation of the image signal processing chip and shielding of light are simultaneously obtained. A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.
Owner:SONY CORP

LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same

An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips.
Owner:HARVATEK CORPORATION

Hand-held, heat sink cryoprobe, system for heat extraction thereof, and method therefore

A cryoprobe system utilizing a monolithic, insulated, hand-held thermal mass having an exposed tip for cryosurgical applications and the like, as well as a heat extraction base configured to interface with the thermal mass to quickly and efficiently reduce the heat of the thermal mass to cryogenic temperatures. The heat extraction base of the preferred embodiment of the present invention is configured to interface with the tip of the thermal mass, such that the tip plugs in securely to the base, to permit an efficient thermal transfer of heat from the thermal mass through the base via a heat exchange system communicating with the base which employs a low temperature cryo-refrigeration unit. The cryo-refrigeration unit may comprise a single low temperature cooling unit to reduce the temperature of the base to around minus one hundred degrees Centigrade utilizing off-the-shelf cryogenic refrigeration methods, or may utilize a series of more conventional refrigeration units in a primary and secondary heat extraction arrangement, which method may further utilize thermocouple or Peltier effect device assist to further reduce the temperature of the heat extraction base to the required temperature. Also claimed is the method of cryosurgery employing the device(s) of the present invention, and a heat pipe appliance to engage a remote treatment area.
Owner:CRYOPEN
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