352results about How to "Solve the low heat dissipation efficiency" patented technology

A light emitting apparatus includes a metallic substrate having at least one recess on the surface and at least one projection opposing the recess on the back surface thereof, a light emitting element mounted in the recess of the metallic substrate, the light emitting element having a pair of positive and negative electrodes formed on one side thereof, and electrically conductive members formed via an insulating member on the surface of the metallic substrate, the electrically conductive members being electrically connected with the pair of positive and negative electrodes of the light emitting element.

A heat dissipation structure of LED light, including a ventilation lampshade, a ventilation power supply seat module and a streamlined curved-surface thermal module. The ventilation lampshade and the ventilation power supply seat module are formed with ventilation holes for expediting fluid convection and enhancing heat dissipation efficiency. The thermal module is composed of multiple radiating fins, which are adjacently annularly stacked to form the thermal module. The radiating fins are formed with streamlined curved surfaces, whereby fluid can more smoothly flow through the radiating fins to greatly enhance heat dissipation ability of the thermal module.

Electrically conductive lamina are attached by an electrically insulating, thermally conductive adhesive and/or solder to one or more semiconductor devices such as chips and extend beyond the periphery of the chip or chips to form heat sink fins. Electrical connections may be made between such chips through holes (e.g. by a wire or plated through hole) in the electrically conductive lamina lined with an insulating material such as the electrically insulating adhesive to provide a structurally robust assembly. Surface pads and connections may overlie patterns of insulator on the lamina. A further lamina can be wrapped around lateral sides of the assembly to provide further heat sink area and mechanical protection for other heat sink fins. A graphite/carbon fiber composite matrix material is preferred for the lamina and the coefficient of thermal expansion of such materials may be matched to that of the semiconductor material attached thereto. Conductivity of the lamina also provides shielding against electrical noise to improve the noise immunity of short connections between chips made through the lamina as well as that of surface connections which may be formed on the lamina.

An LED illuminating device includes a mounting module and a lamp unit mounted in the mounting module. The lamp unit includes a light-emitting module and a heat sink. The light-emitting module includes a light source having a plurality of LEDs, and a light penetrable cover located below the light source and defining a plurality of air venting holes therein. The heat sink includes an elongated base defining a plurality of air exchanging holes therein and a plurality of fins. The base has an outer convex surface and an opposite inner concave surface defining an elongated recess. The light source is received in the recess and thermally attached to the concave surface. Air flows into and out of a chamber defined between the base and the cover via the venting holes of the cover and the air exchanging holes of the base.

An LED illumination device includes a lamp housing, a heat sink, a cooling fan, and a light source. The heat sink, the cooling fan and the light source are received in the lamp housing. The heat sink includes a base and a plurality of fins extending from the base. The light source is attached to the base of the heat sink. The cooling fan causes ambient air to enter into the lamp housing and flow through the heat sink. A plurality of air-disturbing plates extends from the lamp housing towards the heat sink. The air-disturbing plates disturb the air in the lamp housing and guide the disturbed air into air passageways defined between adjacent fins of the heat sink.

A divided LED lamp includes an LED assembly, a casing assembly, LED electronics, power and signal cables, a control panel including a display screen and operation buttons, and a bracket for mounting the lamp. The casing assembly includes a first casing member and a second casing member. At least one cable tube is formed between the first casing member and the second casing member. The power and signal cables that connect the LED assembly received in the first casing member and the LED electronics received in the second casing member are received through the cable tube. This arrangement allows the LED assembly and the LED electronics to be received in individual and independent casing members and are associated with respective individual heat dissipation fins or heat radiators, so as to realize high efficiency of heat dissipation, stabilized operation, and extended lifespan.

A light-emitting apparatus with improved dissipation efficiency of heat transmitted to a specific electrode of a light-emitting device is provided. A light-emitting device mounting substrate used for the light emitting apparatus include a base body (1) which mounts thereon a light-emitting device (3); a first electrically conductive path (L1) formed within the base body (1), one end thereof being electrically connected to a first electrode (3a) of the light-emitting device (3) and the other end thereof being led out to a surface of the base body (1); and a second electrically conductive path (L2) formed in the base body (1), one end thereof being electrically connected to a second electrode (3b) of the light-emitting device (3), and the other end thereof being formed on the surface of the base body (1). The first electrically conductive path (L1) is made smaller in thermal resistance than the second electrically conductive path (L2).

An LED illuminating device includes an optical module and a heat dissipation device. The optical module includes a plurality of LEDs. The heat dissipation device includes a housing and a heat sink. The heat sink includes a base and a plurality of spaced fins formed on the base. The LEDs are thermally attached to a heat absorbing surface formed at a bottom of a bottom plate of the housing. The heat sink and the housing cooperatively define a hermetical chamber therebetween. A closed sidewall of the chamber is sandwiched between the base of the heat sink and the bottom plate of the housing. A wick structure is received in the chamber and attached to the heat dissipation device at a periphery of the chamber. A working fluid is filled in the chamber and saturated in the wick structure.

An LED illuminating device includes a boiling room, an optical module, a heat insulating member and a heat exchanging member communicating with the boiling room. The boiling room defines a horizontal room and an annular, vertical room having a bottom end surrounding the horizontal room. A wick structure is received in the boiling room. Working fluid is received in the boiling room and saturated in a bottom portion of the wick structure. The optical module includes a plurality of LEDs attached to a heat absorbing member connecting with the bottom portion of the wick structure. The heat insulating member is received in the boiling room and attached to a middle portion of the wick structure for thermally insulating the middle portion of the wick structure from vaporized working fluid in the horizontal room of the boiling room.

An LED illuminating device includes an optical section (10), an electrical section (30), and a heat dissipation section (20). The heat dissipation section is provided with a heat dissipation device (21) which includes a heat sink (22) and a cooling fan (23) provided over the heat sink. The heat sink includes a solid base (231) and a plurality of fins (222) extending radially and outwardly from the base. A blind hole (225) is axially provided in the base. A plurality of air passage holes (226) are radially defined through the base and communicate the blind hole with an outside of the base. The cooling fan provides an airflow towards the heat sink. A portion of the airflow flows through the blind hole and the air passage holes of the base.

An LED streetlight with heat-dissipating structure. The LED streetlight includes a light housing composed of an upper cover and a lower cover connected therewith to define an opening, a common rail assembly fixedly attached to an inner face of a bottom of the light housing, and a gas-permeable shade. The common rail assembly includes multiple common rail base seats connected with multiple LED light bulbs and multiple circuit boards. The gas-permeable shade is fitted with the end of the light housing to seal the opening thereof. The heat generated by the LED light bulbs are conducted by the common rail base seats and dissipated to internal space and outer side of the light housing. The heat on outer side of the light housing is carried away by external cold air. The heat in the internal space of the light housing is quickly dissipated through the gas-permeable shade to outer side of the light housing by way of thermal convection.

An electronic assembly includes a casing (10) of an electronic product, and a thermal module disposed in the casing. The casing has a sidewall (102) defining a plurality of slots (1011) therein. The thermal module includes a centrifugal blower (50), a fin assembly (40) and a plurality of sub-fins (701). The centrifugal blower defines an air outlet (502) therein. The fin assembly is disposed at the air outlet of the centrifugal blower and includes a plurality of fins (401) and has a plurality of air passages (402) formed between adjacent fins. The sub-fins are located between the fin assembly and the sidewall of the casing, and forming a plurality of air channels (702) therebetween. The air channels of the sub-fins communicate the air passages of the fin assembly with the slots of the sidewall of the casing.