3178 results about "Metallic substrate" patented technology

Disclosed is a polycrystalline diamond or diamond-like element with greatly improved wear resistance without loss of impact strength. These elements are formed with a binder-catalyzing material in a high-temperature, high-pressure (HTHP) process. The PCD element has a body with a plurality of bonded diamond or diamond-like crystals forming a continuous diamond matrix that has a diamond volume density greater than 85%. Interstices among the diamond crystals form a continuous interstitial matrix containing a catalyzing material. The diamond matrix table is formed and integrally bonded with a metallic substrate containing the catalyzing material during the HTHP process. The diamond matrix body has a working surface, where a first portion of the interstitial matrix in the body adjacent to the working surface is substantially free of the catalyzing material, and a second portion of the interstitial matrix in the body adjacent to the working surface contains the catalyzing material. The first portion of the interstitial matrix and the second portion of the interstitial matrix have substantially the same impact strength.

Polycrystalline diamond constructions include a diamond body comprising a matrix phase of bonded together diamond crystals formed at high pressure / high temperature conditions with a catalyst material. The sintered body is treated remove the catalyst material disposed within interstitial regions, rendering it substantially free of the catalyst material used to initially sinter the body. Accelerating techniques can be used to remove the catalyst material. The body includes an infiltrant material disposed within interstitial regions in a first region of the construction. The body includes a second region adjacent the working surface and that is substantially free of the infiltrant material. The infiltrant material can be a Group VIII material not used to initially sinter the diamond body. A metallic substrate is attached to the diamond body, and can be the same or different from a substrate used as a source of the catalyst material used to initially sinter the diamond body.

A thin-film solar cell (10) is provided. The thin-film solar cell (10) comprises a flexible metallic substrate (12) having a first surface and a second surface. A back metal contact layer (16) is deposited on the first surface of the flexible metallic substrate (12). A semiconductor absorber layer (14) is deposited on the back metal contact. A photoactive film deposited on the semiconductor absorber layer (14) forms a heterojunction structure and a grid contact (24) deposited on the heterjunction structure. The flexible metal substrate (12) can be constructed of either aluminium or stainless steel. Furthermore, a method of constructing a solar cell is provided. The method comprises providing an aluminum substrate (12), depositing a semiconductor absorber layer (14) on the aluminum substrate (12), and insulating the aluminum substrate (12) from the semiconductor absorber layer (14) to inhibit reaction between the aluminum substrate (12) and the semiconductor absorber layer (14).