256results about How to "Bonding strength" patented technology

A first semiconductor device includes: a first wiring layer including a first interlayer insulating film, a first electrode pad, and a first dummy electrode, the first electrode pad being embedded in the first interlayer insulating film and having one surface located on same plane as one surface of the first interlayer insulating film, and the first dummy electrode being embedded in the first interlayer insulating film, having one surface located on same plane as the one surface of the first interlayer insulating film, and being disposed around the first electrode pad; and a second wiring layer including a second interlayer insulating film, a second electrode pad, and a second dummy electrode, the second electrode pad being embedded in the second interlayer insulating film, having one surface located on same surface as one surface of the second interlayer insulating film, and being bonded to the first electrode pad, and the second dummy electrode having one surface located on same plane as the surface located closer to the first interlayer insulating film of the second interlayer insulating film, being disposed around the second electrode pad, and being bonded to the first dummy electrode. A second semiconductor device includes: a first semiconductor section including a first electrode, the first electrode being formed on a surface located closer to a bonding interface and extending in a first direction; and a second semiconductor section including a second electrode and disposed to be bonded to the first semiconductor section at the bonding interface, the second electrode being bonded to the first electrode and extending in a second direction that intersects with the first direction.

A method for joining a first structural member and a metallic substrate is provided. This method involves drawing projections from a metallic substrate using a Co-Meld or other like process. Individual plies of composite materials may be laid upon the metallic substrate and projections. These projections penetrate the individual ply or layers of the composite material. A mechanical feature that serves as a retaining device may be located at the distal end of the projections in order to prevent separation of the composite materials from the metallic substrate. The composite materials may be infused with a resin or other material to complete the formation of the composite material. Additionally, other layers of composite material may be placed over the mechanical features located at the distal ends.

A display panel includes: a first substrate; light-emitting elements on a region of the first substrate; a second substrate facing the first substrate with the light-emitting elements therebetween; a glass frit between the first substrate and the second substrate so as to surround the region of the first substrate in which the light-emitting elements are disposed, the glass frit providing a hermetic seal between the first substrate and the second substrate; and a light-shielding part formed on one of the first substrate and the second substrate so as to extend along the glass frit, the light-shielding part shielding light. The light-shielding part has a lower light-shielding property in a region corresponding to the outer region of the glass frit than in a region corresponding to the inner region of the glass frit. The glass frit has been irradiated with light through the light-shielding part.

A bonding pad with high bonding strength to a solder ball and a bump includes a carrier, a wiring layer formed on the carrier, a protection layer formed on top of the wiring layer and a solder mask layer surrounded around the protection layer and the wiring layer to form a bonding pad opening. The protection layer is extended outside the bonding pad opening such that when solder are extended into the bonding pad opening, the solder balls engage with side faces defining the bump pad opening as well as the protection layer outside the bump pad opening and a bonding strength between the bonding pad and the solder performance is increased.

A hermetic container comprises first and second substrates and bonded by bonding members to form a hermetically sealed space therebetween. Second bonding members placed on both sides of a first bonding member to form the hermetically sealed space between the substrates are sandwiched between the substrates, thereby bonding the substrates together with the first bonding member. A height of first bonding member is higher than that of second bonding member and at least one of the substrates is elastically deformed and is bonded by the first bonding member and the second bonding members. Thus, the hermetic container in which a compressing force has been applied to a height direction of the first bonding member is obtained.

To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

A high-precision slide bearing is provided which includes a substrate of sintered metal and a synthetic resin layer. This bearing can be used e.g. for rotary shafts in compressors of room air-conditioners or in transmissions of motor vehicles and construction machines to support relatively large radial and axial loads. The resin layer is integrally superposed on the radially inner surface of the sintered metal substrate of the slide bearing, which is a cylindrical member. The resin layer is made of a resin composition of an aromatic polyetherketone resin containing a fibrous filler. The fibrous filler are made up of fibers dispersed in the resin layer and oriented such that their length directions intersect the rotational direction of the bearing at angles of 45 to 90 degrees. The resin layer has a thickness of 0.1 to 0.7 mm.

In a flip chip type Group III nitride compound semiconductor light-emitting element, an Au layer is provided on each of a surface of a p-side electrode and a surface of an n-side electrode with interposition of a Ti layer.

A quartz-crystal oscillator has a configuration wherein a rectangular container 1 accommodating a piezoelectric oscillator device 5 therein is fixed to a rectangular supporting substrate 6 on which an IC device 7 is mounted via spacer members 12 formed of metal bodies. On the surface of the supporting substrate 6, part or all of the IC device 7 and side faces of the spacer members are coated with a resin material. When the quartz-crystal oscillator is implemented on a main board by soldering or the like, the problem that the solder for bonding the quartz-crystal oscillator to the main board is adhered to the spacer members 12, thereby causing a short-circuit can be effectively prevented.

A pulley includes a radial rolling bearing and a pulley main body which are integrated to each other by an insert molding method. Therefore, a metal insert member is not required between the resin pulley main body and the radial rolling bearing, thereby reducing production cost of the pulley. Further, an axial dimension of an outer ring of the radial rolling bearing is set larger than an axial dimension of an inner ring thereof, so that a contact area between the radial rolling bearing and the pulley main body is increased. Therefore, a connection strength between the radial rolling bearing and the pulley main body is increased, and a surface area of the radial rolling bearing is increased, thereby improving heat radiation performance of the radial rolling bearing.

A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.

A method for mounting a chip on a substrate includes applying the underfill agent onto at least one of the substrate and the chip and moving the chip to the substrate to bring the bump into contact with the electrode. The method also includes steps to distribute the underfill agent in a space between the chip and the substrate, to around the bump and the electrode, heating the bump or electrode in the state that the bump is buried in the underfill agent to melt the bump or electrode so as to weld the bump to the electrode.