A thermally conductive interface, which may be in the form of a double-sided,
pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first
heat transfer surface formed of a first material having a low
surface energy, and a
thermal dissipation member having a second
heat transfer surface which is formed of a second material having a
surface energy substantially higher than the
surface energy of the first material, and which is disposable opposite the first
heat transfer surface of the heat-generating source in a spaced-apart, heat transfer adjacency therewith. The interface includes a first
pressure sensitive adhesive (PSA) surface which is bondable under pressure to at least a portion of the first heat transfer surface of the heat-generating source, and an opposing second
pressure sensitive adhesive (PSA) surface bondable under pressure to at least a portion of the second heat transfer surface of the heat-generating source. The first PSA surface is presented from a layer of a thermally-conductive, first pressure sensitive adhesive composition, preferably
silicone-based, having an affinity to the first heat transfer surface of the heat generating source. In turn, the second PSA surface is presented from a layer of a second pressure sensitive adhesive composition, preferably acrylic-based, different from the first composition and having an affinity to the second heat transfer surface of the
thermal dissipation member. The interface is particularly adapted for bonding a plastic packaged
electronic component to a
metal heat sink.