The invention discloses a manufacture method of a golden finger printed board, which comprises the steps of: producing a normal inner pattern, laminating, drilling, depositing copper, electroplating a board surface, and firstly transferring an outer layer pattern, wherein the copper surface of a pattern part of a circuit on an outer layer board is exposed, and a non-pattern part is covered by a first layer dry film; electroplating copper nickel golden on a circuit board, so that the pattern part which is not covered with the first layer dry film is plated with the copper by means of thickening, and a nickel layer and a normal golden layer is plated thereon; secondly transferring the outer layer pattern, arranging a light-resistant through window at the golden finger part of the film pattern, exposing the other part, and covering a second layer dry film on the board surface; exposing and developing, exposing a normal golden layer of the golden finger part in the window, and respectively covering the first layer dry film or the second layer dry film or the two layer dry films at the other part; and plating a hard golden layer, removing the film, and etching the outer layer. The manufacture method reduces a step for removing a golden finger lead wire, has a flexible designing way, saves cost, and improves production efficiency.