8183 results about "Lead frame" patented technology

An imaging module for data collection devices, such as bar code scanners. The module includes an aiming or illumination light source or sources, seated on a support is mounted in a housing. The support is fixed in the housing to provide for its precise placement therein, in a predetermined position.

A semiconductor package having heat sink at the outer surface is constructed on a lead frame. The package comprises a chip, a die pad, a plurality of leads, a plurality of bonding wires, and a molding compound. The die pad has a first surface and a second surface, and the chip has its active surface bonded to the first surface of the die pad. The area of the die pad is smaller than the area of the chip in order to expose the bonding pads on the active surface of the chip. The leads having an inner lead portions and an outer lead portions are disposed at the periphery of the die pad, and the inner lead portions are electrically connected to the bonding pads by a plurality of bonding wires. The molding compound encapsulates the chip, the die pad, the inner lead portions of the leads, and the bonding wires. The second surface of the die pad is exposed on the top surface of the package structure while the outer lead portion of the leads is exposed at the side edge of the package structure.

An electrical connector according to the invention includes a linear contact array of electrically conductive contacts and a lead frame into which the contacts at least partially extend. The contacts may be selectively designated as either ground or signal contacts such that, in a first designation, the contacts form at least one differential signal pair comprising a pair of signal contacts, and, in a second designation, the contacts form at least one single-ended signal conductor.

An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the non-conductive layer.

A waferized connector connects to two twinax cables. The connector includes a molded lead frame, ground sleeve, twinax cable, and overmolded strain relief. The lead frame is molded to retain a lead frame containing both differential signal pins and ground pins. Termination sections are provided at the rear of the lead frame to terminate each of the signal wires of the cables to respective signal lands. The ground sleeve has two general H-shape structures connected together by a center cross-support member. Each of the H-shaped structures having curved legs, each of which fits over the signal wires of one of the twinax cables. The wings of the ground sleeve are terminated to the ground lands of the lead frame and the drain wire of the cable is terminated to the ground sleeve to terminate the drain wire to a ground reference. The ground sleeve controls the impedance in the termination area of the cables, where the twinax foil is removed to expose the wires for termination to the lands. The ground sleeve also shields the cables to reduce crosstalk between themselves and adjacent wafers when arranged in a connector housing. A conductive slab member is formed over the sleeve to provide a capacitive coupling with the conductive foil of the signal cable.

A solid-state semiconductor light emitting device is disclosed. A heat sink that comprises a receiving cup for receiving a chip is provided. A leadframe that comprises a connection base is mounted above the heat sink, wherein the chip is connected to the leadframe via a metal wire and a resin or silicone is applied to cover all of them so as to form the a light emitting device that emits light. In the leadframe, two holders that include two top sides on their two top portions are opposite to one another, and a holder having holes is mounted between these two top sides. The holder having the holes is connected to one of these two opposite holders. A plastic material is applied to mold the three holders into the connection base for receiving the receiving cup of the heat sink. As a result, the heat sink provides with good heat-dissipating efficacy and each holder of the leadframe also provides with heat-dissipating efficacy and enhances connection stability as well.

A method of packaging a device and an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes an injection molded plastic body and at least one electrically conductive lead. The body of the cover is connected to the base such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is electrically connected to the device.

A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.

An electrical interconnection system with high speed, high density electrical connectors. The connector is assembled from wafers containing columns of conductive elements, held in an insulative housing. The conductive elements may each have a plurality of beams of different lengths such that the mating contact surfaces of the first beam are offset, in a direction perpendicular with the columns, from the mating contact surfaces of the second beam. The mating contact surface of the shorter beam of each conductive element may be behind the mating contact of the longer beam such that the width of the conductive element is reduced while still protecting the shorter beam from stubbing upon connector mating. The multi-beam conductive elements may be used as signal or ground conductors.