3243 results about "Thermal contact" patented technology

A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.

A respiratory apparatus for delivering breathable gas to a patient includes a flow generator that generates a supply of pressurised gas to be delivered to the patient; a humidifier for vaporising water and delivering water vapor to humidify the gas; a gas flow path leading from the flow generator to the humidifier and from the humidifier to a patient interface; and a heater in thermal contact with the gas and / or the water, wherein the heater comprises an elongate heating filament in the form of a tape. A humidifier for respiratory apparatus includes a first respiratory gas passage for receiving gas from a flow generator, a humidifier chamber, a second respiratory gas passage for delivering humidified gas to a patient interface, and a heater in thermal contact with the gas and / or the water, wherein the heater comprises an elongate heating filament extending along at least part of both said first and second respiratory gas passages. A conduit for use in a respiratory apparatus for delivering breathable gas to a patient includes a tube; a helical rib on an outer surface of the tube; and a plurality of wires supported by the helical rib in contact with the outer surface of the tube.

A video mirror system for a vehicle comprising an interior rearview mirror assembly having a transflective electro-optic reflective element that transmits at least about ten percent of visible light incident thereon and reflects at least about sixty percent of visible light incident thereon. A display module is disposed at a rear of the transflective electro-optic reflective element and comprises a plurality of individual light sources. A thermally conductive element may be in substantial thermal contact with the display module and is exposed at a rear casing portion of the mirror assembly so as to draw heat generated by the display module away from the display module and to the exterior of the interior rearview mirror assembly. The exposure of the thermally conductive element at the rear casing portion may be substantially not discernible to a viewer viewing the rear casing portion of the interior rearview mirror assembly.

A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.

A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.

A method for thermoforming a resilient, fluid-filled bladder structure with thermal contact molding is disclosed. The bladder includes two sheets of thermoplastic material that are separated by at least one core formed of two spaced outer layers connected together by a plurality of connecting members. The bladder is formed by bonding the sheets to the core, bonding the sheets to each other around the periphery of the core and forming a sidewall between the sheets in a single mold. A fluid is then inserted into the space bounded by the peripheral bond and the two sheets such that the connecting members are extended.

A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

A light fixture using LEDs includes a lower skin layer possessing heat transfer properties. A circuit board is affixed to the lower skin layer, and a single LED, or a plurality of LEDs, is electrically connected to the circuit board. The single LED, or plurality of LEDs, when electrically activated, emits light through substantially around a vertical axis. The light fixture also includes a core possessing heat transfer properties that is in thermal contact with the LED and has an interior cavity for the LED. The core is affixed to the lower skin layer, and an upper skin layer, containing a window or windows over the LED or LEDs, is affixed to the core. The LEDs may be white, infrared, ultraviolet, and / or colored and may be mounted on a printed circuit board or individually.

An LED lamp may be made with a heat sink optic. The lamp has a base having a first electrical contact and a second electrical contact for receiving current. At least one LED is mounted on a thermally conductive support; that supports electrical connections for the LED and provides thermal conduction of heat from the LED to the optic. The LED support mounted in the base and electrically coupled through the first electrical contact to electrical current. The light transmissive, and heat diffusing optic has an external an internal wall defining a cavity with the LED positioned in the cavity. The optic is in thermal contact with the LED support and mechanically coupled to the base. The snap together structure enables rapid manufacture while allowing numerous variations.

Particle formation in semiconductor fabrication process chambers is reduced by preventing condensation on the door plates that seal off the process chambers. Particles can be formed in a process chamber when reactant gases condense on the relatively cool surfaces of a door plate. This particle formation is minimized by heating the door plate to a temperature high enough to prevent condensation before flowing reactant gases into the process chamber. The door plate can be heated using a heat source, e.g., a resistive heater, that is in direct contact with the door plate or the heat source can heat the door plate from a distance by radiative or inductive heating. In addition, the door plate can open to allow loading and unloading of a wafer load. As it passes flanges near the door plate, the wafer load can transfer heat to those flanges. To prevent overheating, the flange is provided with a coolant-containing channel having walls that are spaced from the flange by O-rings. The spacing of the channel walls to the flange can be varied to vary the amount of thermal contact and cooling achieved using the channels.

A system for treating a selected dermatologic problem and a head for use with such system are provided. The head may include an optical waveguide having a first end to which EM radiation appropriate for treating the condition is applied. The waveguide also has a skin-contacting second end opposite the first end, a temperature sensor being located within a few millimeters, and preferably within 1 to 2 millimeters, of the second end of the waveguide. A temperature sensor may be similarly located in other skin contacting portions of the head. A mechanism is preferably also provided for removing heat from the waveguide and, for preferred embodiments, the second end of the head which is in contact with the skin has a reflection aperture which is substantially as great as the radiation back-scatter aperture from the patient's skin. Such aperture may be the aperture at the second end of the waveguide or a reflection plate or surface of appropriate size may surround the waveguide or other light path at its second end. The portion of the back-scattered radiation entering the waveguide is substantially internally reflected therein, with a reflector being provided, preferably at the first end of the waveguide, for returning back-scattered light to the patient's skin. The reflector may be angle dependent so as to more strongly reflect back scattered light more perpendicular to the skin surface than back scattered radiation more parallel to the skin surface. Controls are also provided responsive to the temperature sensing for determining temperature at a predetermined depth in the patient's skin, for example at the DE junction, and for utilizing this information to detect good thermal contact between the head and the patient's skin and to otherwise control treatment. The head may also have a mechanism for forming a reflecting chamber under the waveguide and drawing a fold of skin therein, or for providing a second enlarged waveguide to expand the optical aperture of the radiation.

Apparatus suitable for atomizing and vaporizing at least a first liquid by colliding at least one gas with the first liquid. The apparatus includes a gas inlet through which the gas enters the apparatus and a first liquid inlet through which the first liquid enters the apparatus. A discharge end of the apparatus includes at least one first liquid discharge outlet through which at least one stream of the first liquid is discharged from the apparatus. The discharge end also includes at least one gas discharge outlet through which at least one stream of gas is discharged from the apparatus to collide with and thereby atomize the discharged stream of the first liquid. A first liquid passageway interconnects the first liquid inlet with the first liquid discharge outlet. A gas passageway interconnects the gas inlet with the at least one gas discharge outlet. In one embodiment, the gas passageway comprises at least one gas chamber in thermal contact with an initial portion of the first liquid passageway such that a heated quantity of the gas in the chamber preheats the first liquid in the initial portion of the first liquid passageway. In alternative embodiments, the gas passageway includes a pressure dampening chamber allowing gas to be continuously discharged without pulsating.

A method and system for cooling a heat source are presented. The system includes a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat rejector configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in a cooling system to enhance the cooling efficiency of the system.

A compact LED light source providing intensive LED positioning along with thermal dissipation can be made with a heat conductive plate supporting a plurality of LEDs mounted on the plate and in thermal contact with the plate. The plate further supports electrical circuitry providing electrical connection to the LEDs. A heat conductive stem mechanically supports the plate and may provide a thermal conduction path from the plate away from the LEDs. A high concentration of LED can then be conveniently mounted and held in close proximity for increased optical system intensity, while providing a thermal exit path for the associated increase in heat concentration.

There is provided an antenna for use in an ultra-wideband device, wherein the antenna is used as an RF radiator and as a heat sink. There is also provided a device for use in an ultra wideband network, the device comprising a component, for example an integrated circuit package, that generates unwanted heat as part of its normal operation, the device further comprising an antenna as described above placed in thermal contact with the component. The antenna may be electrically connected to one or more pins of the component. Alternatively, the antenna may be capacitively connected to the component. There is also provided a heat sink for a wireless communications device, the heat sink being shaped such that it can operate as an antenna for radio frequencies.

A thermal path is formed in a layer transferred semiconductor structure. The layer transferred semiconductor structure has a semiconductor wafer and a handle wafer bonded to a top side of the semiconductor wafer. The semiconductor wafer has an active device layer formed therein. The thermal path is in contact with the active device layer within the semiconductor wafer. In some embodiments, the thermal path extends from the active device layer to a substrate layer of the handle wafer. In some embodiments, the thermal path extends from the active device layer to a back side external thermal contact below the active device layer.

A light emitting device has a light emitting diode (LED) encapsulated by an encapsulant member. The encapsulant member includes a luminescent material, such as a phosphor, and a thermal insulating material. The thermal insulating material effectively insulates the luminescent material from the heat generated by the LED. A thermal conducting material is desirably placed in thermal contact with a back side of the LED to assist heat dissipation. The encapsulant member may be formed in two separate layers with the luminescent material forming a luminescent layer, and the thermal insulating material forming a thermal insulation layer disposed between the luminescent layer and the LED.

An LED down light replacement apparatus is disclosed for insertion into a recessed-light housing can, which includes an LED light source, a means for mounting said LED light source within the housing can, an LED driver circuit electrically connected to the LED light source, a heat sink in thermal contact with the LED light source, and means for removing heat generated by the LED light source. The means for removing heat generated by the LED light source can include a fan and / or ventilation holes in the top of the housing can.

A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.

The present invention provides an apparatus and method for performing heat-exchanging reactions on an electro wetting-based micro fluidic device. The apparatus provides one or multiple thermal contacts to an electro wetting-based device, where each thermal contact controls the part of the electro wetting-based device it communicates with to a designed temperature. The electrowetting-based device can be used to create, merge and mix liquids in the format of droplets and transport them to different temperature zones on the micro fluidic device. The apparatus and methods of the invention can be used for heat-exchanging chemical processes such as polymerase chain reaction (PCR) and other DNA reactions, such as ligase chain reactions, for DNA amplification and synthesis, and for real-time PCR.

A method for torrefaction of wood which includes providing a first endless conveyor belt; heating the first endless belt; and positioning a planar wood product on the first belt to heat the wood product by conduction to achieve torrefaction. Other forms provide a second endless belt that disposed in sandwich relation to wood to be torrefied. Some embodiments of the method provide a metal chamber having opposed planar sides dimensioned and configured for receiving a wood sheet with the respective opposed sides of the wood sheet in intimate thermal contact with respective opposed sides of the metal chamber. Other embodiments include the apparatus for torrefaction of an associated wood sheet.

One embodiment of the present invention is a socket useful to contact an electronic device, the socket including: (a) one or more contactor holder plates including one or more first through holes having a first hole cross sectional area, and one or more second through holes having a second hole cross sectional area; (b) one or more first contactors having a body with a first body cross sectional area disposed in the first through holes; (c) one or more second contactors having a body with a second body cross sectional area disposed in the second through holes; and (d) a heat sink in thermal contact with one or more of the one or more contactor holder plates; wherein a first ratio of the first hole cross sectional area to the first body cross sectional area is different from a second ratio of the second hole cross sectional area to the second body cross sectional area.

A carbon nanotube heat-exchange system (10) and method for producing the same. One embodiment of the carbon nanotube heat-exchange system (10) comprises a microchannel structure (24) having an inlet end (30) and an outlet end (32), the inlet end (30) providing a cooling fluid into the microchannel structure (24) and the outlet end (32) discharging the cooling fluid from the microchannel structure (24). At least one flow path (28) is defined in the microchannel structure (24), fluidically connecting the inlet end (30) to the outlet end (32) of the microchannel structure (24). A carbon nanotube structure (26) is provided in thermal contact with the microchannel structure (24), the carbon nanotube structure (26) receiving heat from the cooling fluid in the microchannel structure (24) and dissipating the heat into an external medium (19).

A polymer electrochemical generator having a plurality of electrochemical cells, each including at least one current collecting terminals, as well as a resilient heat sink material positioned adjacent and in mechanical contact with the current collecting terminals. The resilient heat sink material is electrically resistive and thermally conductive. A thermally conductive structural housing having walls encloses the plurality of electrochemical cells and the resilient heat sink material. The walls of the structural housing are positioned adjacent the resilient heat sink material and are in thermal contact therewith, for dissipating thermal energy generated by the plurality of electrochemical cells.

A device configured to treat a human or animal body part or limb by providing a heating and / or cooling effect in addition to a compressive force. A metallic conductive material is positioned in thermal contact with at least one Peltier cell whereby the heating and cooling effect generated at an active face of the Peltier cell is conducted and distributed over the surface area of the conductive material. The conductive material comprises a significantly greater surface area than the active face of the Peltier cell. A compressive force may be applied to the human or animal body part or limb by the control of a fluid into an expandable sack secured with the conductive material to the body part by suitable strap means.

A lighting system including modules containing LEDs or other electroluminescent devices and loosely constrained magnetic structures at least partially contained within cavities in the module substrate that are connected to fixtures under magnetic force. The loosely constrained magnetic structures accommodate mechanical variations in the system and provide a method to connect modules mechanically, electrically and thermally to different fixtures or positions in fixtures without tools. The relatively short distance separating magnetic structures provides high connection forces with the use of relatively small magnets. Magnets and electrical contacts are not located directly between the LED subassembly and the fixture, which provides higher thermal conductivity pathways to remove heat from the LEDs. Biasing members may be used to increase thermal contact. Magnetic structures may, but are not required, to conduct electricity. Fixtures that attach to modules include rails, sockets, heat sinks and two-dimensional structures with recessed electrodes for improved electrical safety.

A washing system for high temperature cleaning applications, such as carpet-cleaning, is disclosed that provides a consistent cleaning fluid temperature. The washing system utilizes multiple heat exchangers and multiple heat paths. The heating and power source is provided by a medium duty, diesel cycle engine. Multi-stage heating involves heat transfer from the engine's coolant to the cleaning fluid and heat transfer from the exhaust of the engine to the cleaning fluid via an intermediate medium. The system also includes a fluid clutch used to engage a power takeoff from the engine to operate the pump and blower of the washing plant. A failsafe source cutoff diverts the exhaust flow from thermal contact with an intermediate heat transfer oil.

The flow sensor comprises a semiconductor device (1) on which a heat source and, symmetrically thereto, two temperature sensors are arranged. The semiconductor device (1) is arranged on an exterior side of a tube section (2), and a liquid, the flow velocity of which has to be measured, is led through the tube section (2). The temperature sensors and the heat source are in thermal contact with the exterior side of the tube section (2). It has been found that such an assembly allows to carry out flow measurements with high accuracy and sensitivity.