281 results about "Thermal equilibrium" patented technology

A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.

A submerged gas processor in the form of an evaporator or a submerged gas reactor includes a vessel, a gas delivery tube partially disposed within the vessel to deliver a gas into the vessel and a process fluid inlet that provides a process fluid to the vessel at a rate sufficient to maintain a controlled constant level of fluid within the vessel. A weir is disposed within the vessel adjacent the gas delivery tube to form a first fluid circulation path between a first weir end and a wall of the vessel and a second fluid circulation path between a second weir end and an upper end of the vessel. During operation, gas introduced through the tube mixes with the process fluid and the combined gas and fluid flow at a high rate with a high degree of turbulence along the first and second circulation paths defined around the weir, thereby promoting vigorous mixing and intimate contact between the gas and the process fluid. This turbulent flow develops a significant amount of interfacial surface area between the gas and the process fluid resulting in a reduction of the required residence time of the gas within the process fluid to; achieve thermal equilibrium and / or to drive chemical reactions to completion, all of which leads to a more efficient and complete evaporation, chemical reaction, or combined evaporation and chemical reaction process.

Supercritical conversion of hydrocarbons boiling above 538° C. (1000° F.) with a solvating hydrocarbon at a weight ratio of solvating hydrocarbon to high-boiling hydrocarbons of at least 2:1 and at conditions above the critical temperature and pressure of the high-boiling hydrocarbons-solvent mixture, in the presence of hot fluidized solids. The hydrocarbons are supplied to a reaction zone at a temperature below that of the hot solids supplied thereto, whereby the resulting hydrocarbons-solids suspension has a thermal equilibrium temperature corresponding to the reaction temperature. The conversion has high rates of sulfur, nitrogen and metals removal, nearly complete conversion to lower molecular weight products, high naphtha and distillate selectivity, and low coke formation. The supercritical conversion can replace crude distillation, vacuum distillation, solvent deasphalting, coking, hydrocracking, hydrotreating, and / or fluid catalytic cracking, and / or used in parallel with such unit operations for debottle-necking or increasing capacity.

A desalination system in the form of a submerged gas evaporator that includes a vessel, a gas delivery tube partially disposed within the vessel to deliver a gas into the vessel and a fluid inlet that provides a fluid to the vessel at a rate sufficient to maintain a controlled constant level of fluid within the vessel. A weir is disposed within the vessel adjacent the gas delivery tube to form a first fluid circulation path between a first weir end and a wall of the vessel and a second fluid circulation path between a second weir end and an upper end of the vessel. During operation, gas introduced through the tube mixes with the fluid and the combined gas and fluid flow at a high rate with a high degree of turbulence along the first and second circulation paths defined around the weir, thereby promoting vigorous mixing and intimate contact between the gas and the fluid. This turbulent flow develops a significant amount of inter facial surface area between the gas and the fluid resulting in a reduction of the required residence time of the gas within the fluid to achieve thermal equilibrium which leads to a more efficient and complete evaporation. Additionally, vapor exiting the submerged gas evaporator is condensed in a condensing unit thus precipitating vapor into a liquid for removal.

An ionization apparatus comprises a first electrode provided on the outer periphery of a dielectric cylindrical body and a second cylindrical electrode placed inside at a center of the cylindrical body. When an AC high voltage is impressed across the first electrode and the second cylindrical electrode, a barrier discharge occurs within the cylindrical body. A distal end portion of the second cylindrical electrode projects outwardly from the distal end of the cylindrical body, a thermal equilibrium plasma P having a low electron temperature is generated outwardly from the distal end of the cylindrical body without a plasma jet ascribable to the barrier discharge emerging outwardly from the distal end of the cylindrical body. By exposing a sample S to the thermal equilibrium plasma P, particles (atoms, molecules) desorbed from the sample S undergo soft ionization without being decomposed or polymerized.

The verification of accuracy of an IR thermometer is provided at any temperature in the range of -25° C. to +100° C., preferably at the room temperature. The magnetic surface of a thermo-conductive mat of the present invention is applied to any metallic surface in a room. The user waits to give the contact thermometer arranged on the mat time to reach thermal equilibrium, and then aims the beam of the IR thermometer at the black body target on the mat. The reading of the IR thermometer is then compared with the reading of a contact thermometer, which is attached to the mat adjacent to the black body target. The lightweight, portable, low-cost temperature verification mats of the present invention can be used for verification of IR thermometers in different customer environments, such as in industrial environments, and with retail equipment, or home appliances, including ovens and freezers, etc.

Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer.