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2209 results about "Liquid crystalline" patented technology

Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers

Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and were end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The resulting reactive end-capped liquid crystal oligomers exhibit a variety of improved and preferred physical properties. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystal oligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oligomers are stable for up to an hour in the melt phase. These properties make the end-capped liquid crystal oligomers highly processable by a variety of melt process shape forming and blending techniques including film extrusion, fiber spinning, reactive injection molding (RIM), resin transfer molding (RTM), resin film injection (RFI), powder molding, pultrusion, injection molding, blow molding, plasma spraying and thermo-forming. Once processed and shaped, the end-capped liquid crystal oligomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures. The resulting thermosets display many properties that are superior to their non-end-capped high molecular weight analogs.
Owner:NASA

Methods for fabricating three-dimensional all organic interconnect structures

The present invention comprises methods for making three-dimensional (3-D) liquid crystalline polymer (LCP) interconnect structures using a high temperature singe sided liquid crystalline polymer, and low temperature single sided liquid crystalline polymer, whereas both the high temperature LCP and the low temperature LCP are drilled using a laser or mechanical drill or mechanically punch to form a z-axis connection. The single sided Conductive layer is used as a bus layer to form z axis conductive stud conductive stud within the high temperature and low temperature LCP, followed by deposition of a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis electrical connection. High temperature and low temperature LCP circuit layers are etched or built up to form circuit patterns and subsequently bonded together to form final 3-D multilayer circuit pattern whereas the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas, metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer. The resultant structure is then packaged using two metallized organic cores that are laminated onto either side of the device using a low temperature adhesive with similar electrical properties and subsequently metallized to form the input output terminals and EM shielding.
Owner:GEORGIA TECH RES CORP
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