3496 results about "Total thickness" patented technology

A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm², wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.

A method for rapid growth of gallium and nitrogen containing material is described. The method includes providing a bulk gallium and nitrogen containing substrate. A first epitaxial material of first thickness is formed over the substrate, preferably with a pseudomorphical process. The method also forms a second epitaxial layer over the first to create a stacked structure. The stacked structure consists of a total thickness of less than about 2 microns.

Laminated shingles are manufactured from roll stock roofing material that is wider than that used to make similar laminated shingles. The roll stock includes longitudinal edge strips having a reduced thickness. The roll stock is cut into strips of tabbed top sheets and backing sheets. The strips of material used for the backing sheets are at once wider than commonly used in the industry, and include the longitudinal edge strips of reduced-thickness material. Because the backing sheet is wider two rain seal strips are laid down on the backing sheet prior to being laminated to the tabbed top sheet. The backing sheets are laminated to the tabbed top sheets with the longitudinal edges aligned. The wider backing sheet provides a substantially wider nail zone. In addition, since it allows for a second rain seal strip, provides somewhat more protection against leakage. The portion of the backing sheet that comprises the added width is relatively thinner than the remaining portions of the sheet. Paired shingles may therefore be oriented adjacent one another in opposite directions and stacked and bundled. The total thickness of the stack will be the same throughout the stack, so the stack of shingles is flat.

Various embodiments provide semiconductor devices including a package structure and methods of forming the semiconductor devices. In one embodiment, the package structure can include a through-hole at least partially filled by one or more layers of material(s) to form a through-hole interconnect between semiconductor devices in the package structure. The through-hole can be filled by an insulating layer, a diffusion barrier layer, a metal interconnect layer, and/or a protective layer having a total thickness from the sidewall of the through-hole of less than or equal to the radius of the through-hole.

The magnetic tape comprises, on a nonmagnetic support, a nonmagnetic layer comprising nonmagnetic powder and binder, and on the nonmagnetic layer, a magnetic layer comprising ferromagnetic powder, nonmagnetic powder, and binder, wherein a total thickness of the magnetic tape is less than or equal to 4.80 μm, and a coefficient of friction as measured on a base portion of a surface of the magnetic layer is less than or equal to 0.35.

An organic light-emitting diode (OLED) device is described, comprising: a) a substrate; b) an OLED formed over the substrate comprising a first electrode, a partially transparent second electrode through which light from the OLED is emitted, and at least one layer of organic light-emitting material disposed between the first electrode and partially transparent second electrode; and c) an encapsulating layer deposited on the partially transparent second electrode, wherein the encapsulating layer comprises one or more component layers, and wherein the encapsulating layer and the partially transparent second electrode combined have a transparency greater than the transparency of the partially transparent second electrode in the absence of the encapsulating layer, or wherein the encapsulating layer and the partially transparent second electrode combined have an absorbance less than the absorbance of the partially transparent second electrode in the absence of the encapsulating layer. To provide adequate encapsulation, in accordance with various embodiments of the invention at least one component layer of the encapsulating layer is deposited by atomic layer deposition, or the total thickness of encapsulating layer is at least about 150 nm. In a preferred embodiment, both such features are incorporated.

A reusable silicon substrate device for use with layer transfer process. The device has a reusable substrate having a surface region, a cleave region, and a total thickness of material. The total thickness of material is at least N times greater than a first thickness of material to be removed. In a specific embodiment, the first thickness of material to be removed is between the surface region and the cleave region, whereupon N is an integer greater than about ten. The device also has a chuck member adapted to hold a handle substrate member in place. The chuck member is configured to hold the handle substrate in manner to facilitate bonding the handle substrate to the first thickness of material to be removed. In a preferred embodiment, the device has a mechanical pressure device operably coupled to the chuck member. The mechanical pressure device is adapted to provide a force to cause bonding of the handle substrate to the first thickness of material to be removed.

Provided is a magnetic tape with the total thickness of a non-magnetic and magnetic layers is equal to or smaller than 0.60 μm, a C—H derived C concentration calculated from a C—H peak area ratio of C1s spectra by ESCA on the surface of the magnetic layer at a photoelectron take-off angle of 10 degrees is equal to or greater than 45 atom %, full widths at half maximum of spacing distribution measured by optical interferometry regarding the surface of the magnetic layer before and after vacuum heating with respect to the magnetic tape are respectively greater than 0 nm and equal to or smaller than 7.0 nm, and a difference between a spacing measured after the vacuum heating and a spacing measured before the vacuum heating is greater than 0 nm and equal to or smaller than 8.0 nm.

Provided is a magnetic tape in which the total thickness of a non-magnetic layer and a magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, the magnetic layer includes fatty acid ester, a full width at half maximum of spacing distribution measured by optical interferometry regarding the surface of the magnetic layer before performing vacuum heating with respect to the magnetic tape is greater than 0 nm and equal to or smaller than 7.0 nm, a full width at half maximum of spacing distribution measured after performing the vacuum heating is greater than 0 nm and equal to or smaller than 7.0 nm, and a difference between a spacing measured after performing the vacuum heating and a spacing measured before performing the vacuum heating is greater than 0 nm and equal to or smaller than 8.0 nm.

The magnetic tape includes a non-magnetic support; a non-magnetic layer including non-magnetic powder and a binder on the non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic layer, in which the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder, the magnetic layer includes an abrasive, and a tilt cos η of the ferromagnetic hexagonal ferrite powder with respect to a surface of the magnetic layer acquired by cross section observation performed by using a scanning transmission electron microscope is 0.85 to 1.00.

Provided is a magnetic tape in which the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes ferromagnetic hexagonal ferrite powder and an abrasive, a percentage of a plan view maximum area of the abrasive confirmed in a region having a size of 4.3 μm×6.3 μm of the surface of the magnetic layer by plane observation using a scanning electron microscope, with respect to the total area of the region is equal to or greater than 0.02% and less than 0.06%, and a tilt cos 0 of the ferromagnetic hexagonal ferrite powder with respect to a surface of the magnetic layer acquired by cross section observation performed by using a scanning transmission electron microscope is 0.85 to 1.00.

The magnetic tape includes a non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic support, in which the total thickness of the magnetic tape is equal to or smaller than 5.30 μm, the magnetic layer includes a timing-based servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder, the magnetic layer includes an abrasive, and a tilt cos θ of the ferromagnetic hexagonal ferrite powder with respect to a surface of the magnetic layer acquired by cross section observation performed by using a scanning transmission electron microscope is 0.85 to 1.00.

The magnetic tape includes a non-magnetic support; a non-magnetic layer including non-magnetic powder and a binder on the non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic layer, in which the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, and logarithmic decrement acquired by a pendulum viscoelasticity test performed regarding the surface of the magnetic layer is equal to or smaller than 0.050.

The magnetic tape includes a non-magnetic layer including non-magnetic powder and a binder on a non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic layer, the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, one or more components selected from the group consisting of fatty acid and fatty acid amide are at least included in the magnetic layer, and a C—H derived C concentration calculated from a C—H peak area ratio of C1s spectra obtained by X-ray photoelectron spectroscopic analysis performed on the surface of the magnetic layer at a photoelectron take-off angle of 10 degrees is equal to or greater than 45 atom %.

The magnetic tape includes a magnetic layer having ferromagnetic powder and a binder on a non-magnetic support, in which a total thickness of the magnetic tape is equal to or smaller than 5.30 μm, the magnetic layer includes a timing-based servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, one or more components selected from the group consisting of fatty acid and fatty acid amide are included in the magnetic layer, and a C—H derived C concentration calculated from a C—H peak area ratio of C1s spectra obtained by X-ray photoelectron spectroscopic analysis performed on the surface of the magnetic layer at a photoelectron take-off angle of 10 degrees is equal to or greater than 45 atom %.

The magnetic tape has on one surface of a nonmagnetic support a magnetic layer containing ferromagnetic powder and binder, and on the other surface of the nonmagnetic support, a backcoat layer containing nonmagnetic powder and binder, wherein the total thickness of the magnetic tape is less than or equal to 4.80 μm, the backcoat layer contains one or more components selected from the group consisting of a fatty acid and a fatty acid amide, and a C—H derived carbon, C, concentration calculated from a C—H peak area ratio in a C1s spectrum obtained by X-ray photoelectron spectroscopy conducted at a photoelectron take-off angle of 10 degrees on a surface on the backcoat layer side of the magnetic tape ranges from 35 to 60 atom %.

A flexible protective padding material is described and comprises an array of resilient multilayered elements or blocks which have generally planar top and bottom surfaces and each of which have at least two layers which include a first layer bonded to an outer second layer. The total compressibility of each element with the at least two layers, the spacing between the elements and the total thickness of the elements provides the elements with the ability to compress such that at least one side wall of each of adjacent elements move together and touch each other to provide a joined outer surface of elements which dissipates a blow to the protective padding.

The magnetic tape includes a magnetic layer including ferromagnetic powder and a binding agent, in which a magnetic tape total thickness is equal to or smaller than 5.30 μm, the magnetic layer has a servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder, an intensity ratio of a peak intensity of a diffraction peak of a (110) plane with respect to a peak intensity of a diffraction peak of a (114) plane of a hexagonal ferrite crystal structure obtained by an X-ray diffraction analysis of the magnetic layer by using an In-Plane method is 0.5 to 4.0, and a vertical direction squareness ratio of the magnetic tape is 0.65 to 1.00, and a magnetic tape device including this magnetic tape.

A method for fabricating an electronic component embedded substrate including an electronic component that is embedded within a buildup layer is disclosed. The method includes a first buildup layer lamination step of laminating plural first buildup layers on a core substrate such that the total thickness of the first buildup layers corresponds to the thickness of the electronic component; a cavity formation step of forming a cavity for accommodating the electronic component at the laminated first buildup layers; an accommodating step of accommodating the electronic component within the cavity; and a second buildup layer lamination step of laminating a second buildup layer on the first buildup layers and the electronic component.