The magnetic tape has a nonmagnetic layer containing nonmagnetic powder and binder on a nonmagnetic support, and a magnetic layer containing ferromagnetic powder and binder on the nonmagnetic layer; wherein the combined thickness of the nonmagnetic layer and the magnetic layer is less than or equal to 0.60 μm, the coefficient of friction as measured on the base portion of the surface of the magnetic layer is less than or equal to 0.35, at least the magnetic layer contains one or more components selected from the group consisting of a fatty acid and a fatty acidamide, and a C—H derived carbon, C, concentration calculated from a C—H peak area ratio in a C1s spectrum obtained by X-ray photoelectron spectroscopy conducted at a photoelectron take-off angle of 10 degrees on the surface of the magnetic layer is greater than or equal to 45 atom %.
An object is to eliminate electric discharge due to static electricity generated by peeling when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element. A substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers. The film is bent along a curved surface of the pressurization roller on a side of the pressurization rollers, where the film is collected, and accordingly, peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid such as pure water is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
Disclosed herein is an MMIC package which comprises a base substrate, a composite capacitor substrate made of a ceramics plate mounted on the base substrate, an MMIC bare chip which functions as a high frequencysemiconductor element and face-down bonded on the composite capacitor substrate, and an electroconductive covering which covers, together with the base substrate, the MMIC bare chip. In order to suppress the deterioration of the electrical characteristics of the above MMIC, the above components are so arranged that the interconnection length between the components is made to be minimum.