553results about How to "Improve leakage current" patented technology

An EL element (60) comprises an anode (61), a cathode (67), and an emissive element layer (66) interposed between the two electrodes. A TFT is connected to the anode (61) at its source electrode (33s). The peripheral portion of the anode (61) and the entire region over the TFT are covered with a planarizing insulating film (17), and a part of the exposed portion of the anode (61) is connected to the emissive element layer (66). According to the above arrangement, it is possible to prevent disconnection of the emissive element layer (66) which may be caused by an uneven surface created by the thickness of the anode (61), and to avoid formation of a short circuit between the anode (61) and the cathode (67).

Provided is a two-step ALD deposition process for forming a gate dielectric involving an erbium oxide layer deposition followed by a hafnium oxide layer deposition. Hafnium oxide can provide a high dielectric constant, high density, large bandgap and good thermal stability. Erbium oxide can act as a barrier against oxygen diffusion, which can lead to increasing an effective oxide thickness of the gate dielectric and preventing hafnium-silicon reactions that may lead to higher leakage current.

A method for forming an aluminum nitride-based film on a substrate by plasma-enhanced atomic layer deposition (PEALD) includes: (a) forming at least one aluminum nitride (AlN) monolayer and (b) forming at least one aluminum oxide (AlO) monolayer, wherein steps (a) and (b) are alternately conducted continuously to form a laminate. Steps (a) and (b) are discontinued before a total thickness of the laminate exceeds 10 nm, preferably 5 nm.

When a natural oxide film is left at the interface between a metal silicide layer and a silicon nitride film, in various heating steps (steps involving heating of a semiconductor substrate, such as various insulation film and conductive film deposition steps) after deposition of the silicon nitride film, the metal silicide layer partially abnormally grows due to oxygen of the natural oxide film occurring on the metal silicide layer surface. A substantially non-bias (including low bias) plasma treatment is performed in a gas atmosphere containing an inert gas as a main component on the top surface of a metal silicide film of nickel silicide or the like over source/drain of a field-effect transistor forming an integrated circuit. Then, a silicon nitride film serving as an etching stop film of a contact process is deposited. As a result, without causing undesirable cutting of the metal silicide film, the natural oxide film over the top surface of the metal silicide film can be removed.

By introducing a atomic species, such as carbon, fluorine and the like, into the drain and source regions, as well as in the body region, the junction leakage of SOI transistors may be significantly increased, thereby providing an enhanced leakage path for accumulated minority charge carriers. Consequently, fluctuations of the body potential may be significantly reduced, thereby improving the overall performance of advanced SOI devices. In particular embodiments, the mechanism may be selectively applied to threshold voltage sensitive device areas, such as static RAM areas.

A process is disclosed which incorporates implantation of a carbon cluster into a substrate to improve the characteristics of transistor junctions when the substrates are doped with Boron and Phosphorous in the manufacturing of PMOS transistor structures in integrated circuits. There are two processes which result from this novel approach: (1) diffusion control for USJ formation; and (2) high dose carbon implantation for stress engineering. Diffusion control for USJ formation is demonstrated in conjunction with a boron or shallow boron cluster implant of the source/drain structures in PMOS. More particularly, first, a cluster carbon ion, such as C₁₆H_x⁺, is implanted into the source/drain region at approximately the same dose as the subsequent boron implant; followed by a shallow boron, boron cluster, phosphorous or phosphorous cluster ion implant to form the source/drain extensions, preferably using a borohydride cluster, such as B₁₈H_x⁺ or B₁₀H_x⁺. Upon subsequent annealing and activation, the boron diffusion is reduced, due to the gettering of interstitial defects by the carbon atoms.

An aspect of the present invention provides a semiconductor device that includes a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region.

A semiconductor integrated circuit device having a mechanism of compensating not only circuit operational speed but also variations in leakage current, which includes: a main circuit constructed with CMOS device, a delay monitor for simulating a critical path of the main circuit constructed by a CMOS and monitoring a delay of the path, a PN Vt balance compensation circuit for detecting a threshold voltage difference between a PMOS transistor and an NMOS transistor, and a well bias generating circuit for receiving outputs of the delay monitor and the PN Vt balance compensation circuit and applying a well bias to the delay monitor and the main circuit so as to compensate the operation speed of the delay monitor to a desired speed and reduce a threshold voltage difference between the PMOS and NMOS transistors.

The present invention is a high-sensitivity insulation resistance detection method and circuit for an ungrounded DC power supply systems. When the ratio of the voltage of the positive bus to that of the negative bus exceeds a preset range, the DC current is injected into the ungrounded DC power supply systems. DC power supply systems have essentially some grounded stray and external capacitors, so some of the injected DC current will flow into the grounded capacitor, increasing the voltage of the fault bus and the leakage current. The proposed method increases the leakage current by the injection of DC current, so the current sensor can detect the leakage current from which the insulation resistance can be calculated. The DC current injection method can significantly improve the detection of ground insulation faults in ungrounded DC power supply systems.

In a level shifter, OFF leakage currents flow through two N-type transistors for signal input even when they are OFF. However, another N-type transistor serving as an OFF leakage generation circuit and three P-type transistors serving as current mirrors, which constitute a current conversion circuit, supply to the signal-input transistors a current equivalent to or greater than the OFF leakage currents flowing through the signal-input transistors when they are OFF, thereby canceling the OFF leakage currents. Therefore, one of nodes which is at H level is surely fixed to a potential equal to a higher voltage supply. Thus, the level shifter surely operates with a high speed even when large OFF leakage currents flow through the signal-input transistors.

Method for manufacturing a semiconductor device, includes: forming a layer of dicobalt monosilicide (Co₂Si) or of cobalt (Co) on a device-forming surface of a silicon substrate in a sputter apparatus, by utilizing a predetermined temperature profile; elevating a temperature of the silicon substrate to a predetermined temperature T2, which is equal to or higher than 600° C., conducted after forming the layer of Co or Co₂Si; and forming a layer of monocobalt monosilicide (CoSi) on the device-forming surface of the silicon substrate at a temperature equal to or higher than T2, conducted after heating the silicon substrate to T2, wherein, the silicon substrate is elevated to a temperature between a highest reachable temperature T1 of the silicon substrate during forming the layer of Co or Co₂Si and the temperature T2 at a temperature ramp rate of equal to or higher than 50° C./sec.

A high reverse voltage diode includes a hetero junction made up from a silicon carbide base layer, which constitutes a first semiconductor base layer, and a polycrystalline silicon layer, which constitutes a second semiconductor layer, and whose band gap is different from that of the silicon carbide base layer. A low concentration N type polycrystalline silicon layer is deposited on a first main surface side of the silicon carbide base layer, and a metal electrode is formed on a second main surface side of the silicon carbide base layer which is opposite to the first main surface side thereof.

A nonvolatile memory cell has charge trapping dielectric (160) which has been modified (i.e. oxidized) adjacent to edges of blocking dielectric (180). The modification reduces the charge-trapping density adjacent to the edges of the blocking dielectric, and hence reduces the leakage current at the edges. Other features are also provided.

An aspect of the present invention provides a semiconductor device that includes a semiconductor base made of a first semiconductor material of a first conductivity type, a hetero-semiconductor region forming a heterojunction with the semiconductor base and made of a second semiconductor material having a different band gap from the first semiconductor material, a first gate electrode arranged in the vicinity of the heterojunction, a first gate insulating film configured to insulate the first gate electrode from the semiconductor base, a source electrode formed in contact with the hetero-semiconductor region, a dram electrode formed in contact with the semiconductor base, and an electric field extending region partly facing the first gate electrode, the first gate insulating film and hetero-semiconductor region interposed between the electric field extending region and the first gate electrode, the electric field extending region extending a built-in electric field into the hetero-semiconductor region.