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42494results about How to "Improve thermal stability" patented technology

Organic electroluminescent device having an azatriphenylene derivative

Azatriphenylene derivatives and their use in the electron-transporting layer of an electroluminescent device that comprises an anode, a spaced-apart cathode, and at least one electron-transporting layer disposed between the spaced-apart anode and cathode. Such EL devices provide lower drive voltage, improved power efficiency, and longer operational lifetime.
Owner:GLOBAL OLED TECH

Silicone polymer insulation film on semiconductor substrate and method for forming the film

A method for forming a silicone polymer insulation film having a low relative dielectric constant, high thermal stability and high humidity-resistance on a semiconductor substrate is applied to a plasma CVD apparatus. The first step is introducing a silicon-containing hydrocarbon compound expressed by the general formula SialphaObetaCxHy (alpha, beta, x, and y are integers) to the reaction chamber of the plasma CVD apparatus. The silicon-containing hydrocarbon compound has at most two O-CnH2n+1 bonds and at least two hydrocarbon radicals bonded to the silicon. The residence time of the material gas is lengthened by, for example, reducing the total flow of the reaction gas, in such a way as to form a silicone polymer film having a micropore porous structure with a low relative dielectric constant.
Owner:ASM JAPAN

Method of making low kappa dielectric inorganic/organic hybrid films

A method of depositing a dielectric film exhibiting a low dielectric constant in a semiconductor and / or integrated circuit by chemical vapor deposition (CVD) is provided. The film is deposited using an organosilicon precursor in a manner such that the film is comprised of a backbone made substantially of Si-O-Si or Si-N-Si groups with organic side groups attached to the backbone.
Owner:APPLIED MATERIALS INC

Ketoreductase polypeptides and related polynucleotides

The present invention is directed to variant polypeptides having enhanced ketoreductase activity and / or thermostability for use in the stereospecific reduction of ketones. In addition, the present invention is directed to polynucleotides that encode the ketoreductase polypeptides, including codon optimized versions of the polynucleotides which provide for enhanced expression in host cells. In another aspect, the present invention is directed to nucleotide constructs, vectors and host cells that are transformed with polynucleotides of the present invention.
Owner:CODEXIS INC

Attapulgite argil powder with air purifying function

The invention discloses an attapulgite argil powder with an air purifying function. The technical scheme is as follows: the attapulgite argil powder with an air purifying function is prepared from high-viscosity attapulgite clay, an attapulgite constant-humidity conditioner, a natural mineral adsorbing / filtering agent, Cacumen Biotae, aluminum silicate fiber and polyacrylamide. The attapulgite argil powder is prepared by the following steps: pulverizing the materials, soaking and aging to obtain a wet mixture, extruding the wet mixture into a strip, airing the strip, pulverizing to obtain powder, and packaging to obtain the finished product. The attapulgite argil powder has favorable cohesive property, plasticity, thixotropy, fire resistance and thermal stability; the pottery prepared from the attapulgite argil powder with an air purifying function contains a great deal of micropores and activated carbon, thus, has the characteristics of low shrinkage, no cracking or deformation and favorable adsorbability, and can effectively adsorb formaldehyde, ammonia, benzene and other harmful substances in the air, thereby protecting the environment and improving good health of people. The invention is suitable for producing pottery artware with an air purifying function.
Owner:江苏世澳非金属应用科技有限公司

Methods of atomic layer deposition of hafnium oxide / erbium oxide bi-layer as advanced gate dielectrics

Provided is a two-step ALD deposition process for forming a gate dielectric involving an erbium oxide layer deposition followed by a hafnium oxide layer deposition. Hafnium oxide can provide a high dielectric constant, high density, large bandgap and good thermal stability. Erbium oxide can act as a barrier against oxygen diffusion, which can lead to increasing an effective oxide thickness of the gate dielectric and preventing hafnium-silicon reactions that may lead to higher leakage current.
Owner:INTERMOLECULAR

Method for depositing metal-containing film using particle-reduction step

A method for forming a metal oxide or nitride film on a substrate by plasma-enhanced atomic layer deposition (PEALD), includes: introducing an amino-based metal precursor in a pulse to a reaction space where a substrate is placed, using a carrier gas; and continuously introducing a reactant gas to the reaction space; applying RF power in a pulse to the reaction space wherein the pulse of the precursor and the pulse of RF power do not overlap, wherein conducted is at least either step (a) comprising passing the carrier gas through a purifier for reducing impurities before mixing the carrier gas with the precursor, or step (b) introducing the reactant gas at a flow rate such that a partial pressure of the reactant gas relative to the total gas flow provided in the reaction space is 15% or less.
Owner:ASM IP HLDG BV

Luminescent body and optical device including the same

A luminous body of prolonged fluorescence lifetime characterized by comprising not only an activator but also at least one coactivator selected from the group consisting of La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Bi, Sn, Sb and analogues thereof as a further luminescent center for enhancing the thermostability of luminous body. This luminous body excels in thermostability and fluorescence lifetime, so that it is useful as a luminous body for LED.
Owner:TOYODA GOSEI CO LTD +2

Ternary systems of benzoxazine, epoxy, and phenolic resins

Low viscosity ternary mixtures of benzoxazine, epoxy and phenolic resins have been developed. The blends render homogeneous and void free cured specimen with a wide range of properties. Melt viscosity values as low as 0.3 Pa.s at 100° C. can be achieved. The phenolic resin acts as a cure accelerator to the system, besides its typical function as a hardener of epoxy resin. Glass transition temperatures Tg as high as 170° C. can also be obtained.
Owner:EDISON POLYMER INNOVATION EPIC

Luminescent ink for printing of organic luminescent devices

Organic luminescent ink (L-ink) is disclosed for use in printing thin films of organic luminescent material. The L-ink is particularly useful in fabricating organic optoelectronic devices, e.g. organic luminescent devices. The L-ink contains at least one organic luminescent material mixed with a solvent and other functional additives to provide the necessary optical, electronic and morphological properties for light-emitting devices (LEDs). The additives play an important role either for enhanced thin film printing or for better performance of the optoelectronic device. The functional additives may be chemically bound to the luminescent compounds or polymers. Luminescent organic compounds, oligomers, or polymers with relatively low solution viscosity, good thin film formability, and good charge transporting properties, are preferred. The L-inks can be cross-linked under certain conditions to enhance thin film properties. The L-ink can be used in various printing methods, such as screen printing, stamp printing, and preferably ink-jet printing (including bubble-jet printing).
Owner:CANON KK

Devices and methods for pattern generation by ink lithography

The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and / or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS

Thermally stable diamond polycrystalline diamond constructions

Thermally stable diamond constructions comprise a diamond body having a plurality of bonded diamond crystals and interstitial regions disposed among the crystals. A metallic substrate is attached to the body. The body includes a first region substantially free of a catalyst material that extends a partial depth from a surface into the body, and a second region that includes the catalyst material. The body can include natural diamond grains and / or a blend of natural and synthetic diamond grains, and is treated to form the first region. Before treatment, a portion of the body to be treated is finished to an approximate final dimension so that the depth of the first region of the finished product is substantially the same as when treated. During treatment, catalyst materials as well as non-catalyst metallic materials are removed from the diamond body to provide a further enhanced degree of thermal stability.
Owner:SMITH INT INC

Vertical light emitting diode and method of manufacturing the same

Provided is a vertical LED including an n-electrode; an n-type GaN layer formed under the n-electrode, the n-type GaN layer having a surface coming in contact with the n-electrode, the surface having a Ga+N layer containing a larger amount of Ga than that of N; an active layer formed under the n-type GaN layer; a p-type GaN layer formed under the active layer; a p-electrode formed under the p-type GaN layer; and a structure support layer formed under the p-electrode.
Owner:SAMSUNG ELECTRONICS CO LTD

Polycrystalline diamond compact (PDC) cutting element having multiple catalytic elements

A polycrystalline diamond compact useful for wear, cutting, drilling, drawing and like applications is provided with a first diamond region remote from the working surface which has a metallic catalyzing material and a second diamond region adjacent to or including the working surface containing a non-metallic catalyst and the method of making such a compact is provided. This compact is particularly useful in high temperature operations, such as hard rock drilling because of the improved thermal stability at the working surface.
Owner:US SYNTHETIC CORP

Magnetic element with improved out-of-plane anisotropy for spintronic applications

ActiveUS20120205758A1Without degrading thermal stability and MR ratioEnhanced interfacial perpendicular anisotropyMagnetic-field-controlled resistorsGalvano-magnetic material selectionPerpendicular anisotropyAlloy
A magnetic element is disclosed wherein first and second interfaces of a free layer with a Hk enhancing layer and tunnel barrier, respectively, produce enhanced surface perpendicular anisotropy to lower switching current or increase thermal stability in a magnetic tunnel junction (MTJ). In a MTJ with a bottom spin valve configuration where the Hk enhancing layer is an oxide, the capping layer contacting the Hk enhancing layer is selected to have a free energy of oxide formation substantially greater than that of the oxide. The free layer may be a single layer or composite comprised of an Fe rich alloy such as Co20Fe60B20. With a thin free layer, the interfacial perpendicular anisotropy may dominate the shape anisotropy to generate a magnetization perpendicular to the planes of the layers. The magnetic element may be part of a spintronic device or serve as a propagation medium in a domain wall motion device.
Owner:TAIWAN SEMICON MFG CO LTD

Ionic silicone hydrogels having improved hydrolytic stability

ActiveUS20100249356A1Improve thermal stabilityDesirable protein uptakeOptical partsOptical elementsPolymer scienceProtein uptake
The present invention relates to ionic silicone hydrogel polymers displaying improved thermal stability. More specifically, the present invention relates to a polymer formed from reactive components comprising at least one silicone component and at least one ionic component comprising at least one anionic group. The polymers of the present invention display good thermal stability and desirable protein uptake.
Owner:JOHNSON & JOHNSON VISION CARE INC

Thermally stable diamond polycrystalline diamond constructions

Thermally stable diamond constructions comprise a diamond body having a plurality of bonded diamond crystals, a plurality of interstitial regions disposed among the crystals, and a substrate attached to the body. The body includes a working surface and a side surface extending away from the working surface to the substrate. The body comprises a first region adjacent the side surface that is substantially free of a catalyst material and that extends a partial depth into the diamond body. The first region can further extend to at least a portion of the working surface and a partial depth therefrom into the diamond body. The diamond body can be formed from natural diamond grains and / or a mixture of natural and synthetic diamond grains. A surface of the diamond body is treated to provide the first region, and before treatment is finished to an approximate final dimension.
Owner:SMITH INT INC

Thermally conductive thermoplastic

This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W / m DEG K and it is capable of being molded using high speed molding techniques such as injection molding.
Owner:FERRO CORP

Thermally-stable polycrystalline diamond materials and compacts

Thermally-stable polycrystalline diamond materials of this invention comprise a first phase including a plurality of bonded together diamond crystals, and a second phase including a reaction product formed between a binder / catalyst material and a material reactive with the binder / catalyst material. The reaction product is disposed within interstitial regions of the polycrystalline diamond material that exists between the bonded diamond crystals. The first and second phases are formed during a single high pressure / high temperature process condition. The reaction product has a coefficient of thermal expansion that is relatively closer to that of the bonded together diamond crystals than that of the binder / catalyst material, thereby providing an improved degree of thermal stability to the polycrystalline diamond material.
Owner:SMITH INT INC

Spin scattering and heat assisted switching of a magnetic element

A method and system for providing a magnetic element is disclosed. The magnetic element include providing a pinned layer, a spacer layer, and a free layer. The method and system also include providing a heat assisted switching layer and a spin scattering layer between the free layer and the heat assisted switching layer. The spin scattering layer is configured to more strongly scatter majority electrons than minority electrons. The heat assisted switching layer is for improving a thermal stability of the free layer when the free layer is not being switched. Moreover, the magnetic element is configured to allow the free layer to be switched due to spin transfer when a write current is passed through the magnetic element.
Owner:SAMSUNG SEMICON

Magnetoresistive element, magnetic head, magnetic memory and magnetic recording apparatus using the same

A magnetoresistive element includes a multilayer film configuration including: a tunnel insulation layer; and a pair of magnetic layers that are laminated with the tunnel insulation layer interposed therebetween. A resistance value of the magnetoresistive element varies with a relative angle between magnetic orientations of both of the magnetic layers, and at least one of the magnetic layers includes a magnetic film having a thermal expansion coefficient not greater than a value obtained by adding 2×10−6 / K to a thermal expansion coefficient of the tunnel insulation layer. The thus configured magnetoresistive element can exert excellent thermal stability. The use of such a magnetoresistive element can realize a magnetic head, a magnetic memory element and a magnetic recording apparatus with excellent thermal stability.
Owner:PANASONIC CORP

MTJ incorporating CoFe/Ni multilayer film with perpendicular magnetic anisotropy for MRAM application

ActiveUS20110096443A1Minimize impinging ion energyMaximize PMA propertyMagnetic measurementsVacuum evaporation coatingSpin transferSpin valve
A MTJ for a spintronic device is disclosed and includes a thin composite seed layer made of at least Ta and a metal layer having fcc(111) or hcp(001) texture as in Ta / Ti / Cu to enhance perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (CoFe / Ni)X, (Co / NiFe)X, (Co / NiCo)X, (CoFe / NiFe)X, or (CoFe / NiCo)X composition where x is from 5 to 30. In one embodiment, a CPP-TMR spin valve has one or both of a laminated free layer and laminated reference layer with the aforementioned compositions. The MTJ includes an interfacial layer made of CoFeB, CoFeB / CoFe, or CoFe / CoFeB between each laminated structure and the tunnel barrier. The laminated layers are deposited by a low power and high Ar pressure process to avoid damaging interfaces between adjoining layers. Annealing occurs at 220° C. to 400° C. A laminated layer with high PMA may also be included in one or more layers of a spin transfer oscillator.
Owner:TAIWAN SEMICON MFG CO LTD

Organic light emitting compound, organic light emitting device comprising the same, and method of manufacturing the organic light emitting device

Provided are an organic light emitting compound represented by Formula 1 below, an organic light emitting device comprising the same, and a method of manufacturing the organic light emitting device:where CY1 and CY2 are each independently a fused C6-C50 aromatic ring, Ar1 is a substituted or unsubstituted C6-C50 arylene group, Ar2, Ar3, Ar4, and Ar5 are each independently a substituted or unsubstituted C6-C50 aryl group, m and n are independently 0-3, and R1 and R2 are substituent groups. An organic light emitting device comprising the organic light emitting compound has low turn-on voltage, high efficiency, high color purity and high luminance.
Owner:SAMSUNG ELECTRONICS CO LTD

Branched polyphosphonates that exhibit an advantageous combination of properties, and methods related thereto

Disclosed are branched polyphosphonates produced via a superior transesterification process, and methods related thereto. These branched polyphosphonates exhibit a unique and advantageous combination of properties, such as outstanding fire resistance, improved heat stability, improved toughness, and superior processing characteristics. Also disclosed are polymer compositions that comprise these branched polyphosphonates and at least one other polymer, wherein the resulting polymer compositions exhibit flame retardant properties. Further disclosed are articles of manufacture produced from these polymers, such as fibers, films, coated substrates, moldings, foams, fiber-reinforced articles, or any combination thereof; these articles may be coated with a moisture barrier to enhance their moisture resistance properties.
Owner:FRX POLYMERS LLC

Flip chip assembly structure for semiconductor device and method of assembling therefor

A semiconductor device includes a semiconductor chip and a printed circuit board. Metal electrodes of the semiconductor chip and the internal connection terminals of the printed circuit board are electrically connected through the metallic joining via precious metal bumps. A melting point of a metal material constituting each of the metallic joining parts is equal to or higher than 275 degrees, and a space defined between the chip and the board is filled with resin (under fill) containing 50 vol % or more inorganic fillers.
Owner:HITACHI LTD
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