The present invention provides a multiphase, ultra low k film which exhibits improved
elastic modulus and
hardness as well as various methods for forming the same. The multiphase, ultra
low k dielectric film includes atoms of Si, C, O and H, has a
dielectric constant of about 2.4 or less, nanosized pores or voids, an
elastic modulus of about 5 or greater and a
hardness of about 0.7 or greater. A preferred multiphase, ultra
low k dielectric film includes atoms of Si, C, O and H, has a
dielectric constant of about 2.2 or less, nanosized pores or voids, an
elastic modulus of about 3 or greater and a
hardness of about 0.3 or greater. The multiphase, ultra low k film is prepared by
plasma enhanced
chemical vapor deposition in which one of the following alternatives is utilized: at least one precursor gas comprising
siloxane molecules containing at least three Si—O bonds; or at least one precursor gas comprising molecules containing reactive groups that are sensitive to e-beam
radiation. Electronic structures including the multiphase, ultra low k film are also disclosed.