58results about How to "Layer deteriorates" patented technology

Aspects of the disclosure relate to systems and methods for providing and displaying a hierarchy of selectable data items.

An object is to provide a programmable logic device having logic blocks connected to each other by a programmable switch, where the programmable switch is characterized by an oxide semiconductor transistor incorporated therein. The extremely low off-state current of the oxide semiconductor transistor provides a function as a non-volatile memory due to its high ability to hold a potential of a gate electrode of a transistor which is connected to the oxide semiconductor transistor. The ability of the oxide semiconductor transistor to function as a non-volatile memory allows the configuration data for controlling the connection of the logic blocks to be maintained even in the absence of a power supply potential. Hence, the rewriting process of the configuration data at starting of the device can be omitted, which contributes to the reduction in power consumption of the device.

A coating and developing apparatus comprises a washing section for washing the surface of a substrate after it has been subjected to a dipping exposure process in an exposing apparatus, and a first substrate carrying means adapted to transfer the substrate carried out from the exposing apparatus after the dipping exposure process to the washing section. The first substrate carrying means is controlled by a control means. Namely, the control means controls the first substrate carrying means such that the substrate can be washed in the washing section in a period of time prior to a time zone in which the size of liquid drops remaining on the substrate due to the dipping exposure process becomes smaller quite rapidly, based on a carrying-out ready signal for the substrate from the exposing apparatus, by using a relationship between the time elapsed from the end of the dipping exposure process and the size of liquid drops remaining on the substrate due to the dipping exposure process.

A light emitting element includes a base member, a sealing member disposed to face the base member, a concave-convex structure layer, a first electrode, an organic layer, a second electrode, and an adhesive layer. The concave-convex structure layer, the first electrode, the organic layer, and the second electrode are formed on the base member in that order. The adhesive layer is positioned between the base member and the sealing member. An outer periphery of the concave-convex structure layer is positioned between an inner periphery and an outer periphery of the adhesive layer. The light emitting element includes the concave-convex structure layer functioning as a diffracting grating, and thus light extraction efficiency thereof is excellent. Further, a light emitting part is sealed with sufficient sealing performance and deterioration of the light emitting part due to moisture and oxygen is prevented. Thus, the light emitting element has a long service life.

A semiconductor light emitting device made of nitride III-V compound semiconductors includes an active layer made of a first nitride III-V compound semiconductor containing In and Ga, such as InGaN; an intermediate layer made of a second nitride III-V compound semiconductor containing In and Ga and different from the first nitride III-V compound semiconductor, such as InGaN; and a cap layer made of a third nitride III-V compound semiconductor containing Al and Ga, such as p-type AlGaN, which are deposited in sequential contact.

An exemplary PDP according to an embodiment of the present invention includes first and second substrates, an address electrode, first and second barrier ribs, first and second electrodes, and a phosphor layer. The first and second substrates face each other, the address electrode is formed on the first substrate and extends in a first direction, and the first barrier rib is formed on the first substrate and partitions a plurality of first discharge cells. The first and second electrodes extend along the second direction and are disposed in the first discharge cells. The second barrier rib is formed on the second substrate and partitions second discharge cells that correspond to the first discharge cells. The phosphor layer is formed in the discharge cells on the second substrate.