6400 results about "Bisphenol" patented technology

Disclosed herein is a process for preparing a linear hydroxyaryloxy-functional polydiorganosiloxanes having controlled structures. The process includes the step of reacting a linear α,ω-bisacyloxypolydiorganosiloxane with at least one bisphenolic compound, or hydroxy-functional oligomer thereof, in such a molar ratio that the phenolic groups in the bisphenolic compound or the hydroxy-functional oligomer thereof to the acyloxy groups in the α,ω-bisacyloxypolydiorganosiloxane is less than 2.0. Also disclosed are hydroxyaryloxy-functional polydiorganosiloxanes produced from the process and the polysiloxane/polyorgano block copolymers made using the hydroxyaryloxy-functional siloxanes.

Dielectric compositions encompassing one or more poly(arylene ether) polymers are provided. The dielectric compositions have the repetitive structural unit: where n=0 to 1; m=0 to 1-n; and Y1, Y2, Ar1 and Ar2 are each a divalent arylene radical, Y1 and Y2 derived from biphenol compounds, Ar1 derived from difluoroarylethynes and Ar2 derived from difluoroaryl compounds. Where both Y1 and Y2 are derived from fluorene bisphenol, n=0.1 to 1. Such poly(arylene ether) polymers are employed with a variety of microelectronic devices, for example, integrated circuits and multichip modules.

The invention relates to an epoxy resin potting adhesive which consists of component A and component B. By weight portion, the component A consists of 90-130 portions of bisphenol A type epoxy resin, 240-320 portions of filling, 15-25 portions of thinner, 10-25 portions of toughener, 1-2.5 portions of defoamer and 0.8-2 portions of black pigment, and the component B consists of 60-130 portions of estolide and 1-3 portions of imidazole accelerator. The mixing proportion of the component A and the component B is (3-5):1. The invention also provides a preparation method of the epoxy resin potting adhesive. The epoxy resin potting adhesive provided by the invention has low cost and long resting period; after being mixed, the component A and the component B have low viscidity, good wetting quality, good heat resistance, good defoaming performance, good fluidity and long operating time and are solidified between 70 DEG C and 160 DEG C; a product after solidifying has bright surface, good mechanical performance and insulating performance and high glass transition temperature; and the quality of a potting component is stable.

PCT No. PCT/US96/12540 Sec. 371 Date Feb. 17, 1998 Sec. 102(e) Date Feb. 17, 1998 PCT Filed Aug. 7, 1996 PCT Pub. No. WO97/07163 PCT Pub. Date Feb. 27, 1997Epoxy resins, particularly those based on bisphenol A, can constitute the principal film forming polymer component of a storage stable autodepositable composition wherein the particle size distribution of all the film forming polymers in the composition satisfies certain criteria of size distribution, and an accelerator component which is an acid, oxidizing agent or complexing agent is present in amount sufficient to provide an oxidation-reduction potential at least 100 mV more oxidizing than a standard hydrogen electrode. Such dispersions can conveniently be prepared using a two stage process in which a solution of the film forming polymers is emulsified into water to form a preliminary dispersion and this preliminary dispersion is subjected to at least one particle size refinement stage in which the preliminary dispersion is forced through a narrow aperture.

A permanent photoresist composition comprising: (A) one or more bisphenol A-novolac epoxy resins according to Formula I; wherein each group R in Formula I is individually selected from glycidyl or hydrogen and k in Formula I is a real number ranging from 0 to about 30; (B) one or more epoxy resins selected from the group represented by Formulas BIIa and BIIb; wherein each R₁, R₂ and R₃ in Formula BIIa are independently selected from the group consisting of hydrogen or alkyl groups having 1 to 4 carbon atoms and the value of p in Formula BIIa is a real number ranging from 1 to 30; the values of n and m in Formula BIIb are independently real numbers ranging from 1 to 30 and each R₄ and R₅ in Formula BIIb are independently selected from hydrogen, alkyl groups having 1 to 4 carbon atoms, or trifluoromethyl; (C) one or more cationic photoinitiators (also known as photoacid generators or PAGs); and (D) one or more solvents.

The invention provides a novel epoxy coating and a preparation method thereof. The coating not only has excellent corrosion resistance, but also has excellent compatibility with a base material or a lower coating film, particularly an epoxy coating, a polyurethane coating, a fluorocarbon coating or an alkyd resin coating. The epoxy coating comprises a main paint and a curing agent, wherein the main paint contains bisphenol A epoxy resin and modifying resin for modifying the bisphenol A epoxy resin; and the curing agent contains polyamino amide and cardanol modified phenolic amine.

Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.

The invention relates to resin emulsion for cathode electrophoretic coating with high throwing power and a preparation method of the resin emulsion, wherein the emulsion is obtained by the following steps: heating and mixing modified epoxy resin aminated by various single molecular amines and one or two of fully-closed aromatic polyisocyanates; using organic acid to neutralize the mixture; and using de-ionized water to disperse the mixture, wherein the weight ratio of raw materials in the resin emulsion solid is as follows: 45-70wt% of modified epoxy resin, 4-10wt% of total single molecular amines, 20-40wt% of fully-closed aromatic polyisocyanates and 1.6-3.5wt% of organic acid; the modified epoxy resin is obtained by replacing part of solvent with plasticizer, and using flexible polymer to extend chain of bisphenol A epoxy resin to be of molecular weight of 1500-3000; in the modified epoxy resin solid, the content of flexible polymer is 10-35% and the content of the plasticizer is 4-14%. The resin emulsion is stable and low in solvent content; the film has smooth appearance and throwing power of more than 22cm.

The invention relates to organic-inorganic hybrid ultraviolet cured paint for metal surface protection. The paint comprises the following components in percentage by weight: 10 to 25 percent of epoxy modified silicon dioxide gel-resin, 15 to 30 percent of bisphenol-A epoxy acrylic ester, 5 to 15 percent of urethane acrylate, 35 to 45 percent of reactive diluent, 2 to 5 percent of toughener, 4 to 6 percent of photoinitiator, 0.5 to 0 percent of addition agent, wherein the epoxy modified silicon dioxide gel-resin is prepared by hydrolyzing a mixture of ethyl orthosilicate and gamma-glycidoxy propyl trimethoxy silane by a sol-gel method first and then adding diethylenetriamine. The paint film formed after the curing of paint has good strength, hardness, flexibility and strong acid and base resistance. The invention solves the problems that the organic-inorganic hybrid paint has high requirement on curing and common ultraviolet cured paint has poor adhesive force and flexibility when cured on metal base materials.

The invention relates to a thermosetting polyimide resin and a preparation method thereof. A homogeneous transparent sticky maleimide-based polyimide resin solution is taken as a component A, and a 4-maleimide-based bisphenol solution A is taken as a component B. The preparation method of the thermosetting polyimide resin comprises the following steps: (1) preparing the maleimide-based polyimide resin solution as the component A; (2) preparing the 4-maleimide-based bisphenol solution A as the component B; and (3) uniformly mixing the component A and the component B at room temperature to obtain the thermosetting polyimide resin. The thermosetting polyimide resin of the invention not only can be applied to the matrix resin of high temperature resistant adhesives and glass fiber reinforced composite materials but also can be applied to the matrix resin of high-performance fiber (carbon fiber, aramid fiber and the like) reinforced advanced composite materials, thus the thermosetting polyimide resin has wide application prospects; and the invention has simple preparation technology, low cost and environmental protection, can finish preparation processes in the general equipment, and is suitable for industrial production.

A polyethersulfone composition is disclosed which comprises structural units derived from a monomer mixture comprising fluorenylidene bisphenol-A and at least 50 mole percent of 4,4′-biphenol based on total moles of diphenolic monomers, wherein the polyethersulfone has a minimum glass transition temperature of 235° C. and a notched Izod impact value of 1 ft-lb/in. as measured by ASTM D256.

Disclosed is a method for producing an aromatic polycarbonate, which comprises reacting acetone with a phenol material, thereby producing bisphenol A, and polymerizing the resultant bisphenol A with diphenyl carbonate to produce an aromatic polycarbonate while producing phenol as a by-product, wherein the by-product phenol is recovered as a crude phenol product containing the by-product phenol as a main component and containing impurities, and the crude phenol product is used as at least a part of the phenol material for producing bisphenol A. According to the method of the present invention, a crude phenol product as such, containing, as a main component, a by-product phenol which is by-produced during the polymerization reaction for producing an aromatic polycarbonate, and containing impurities, can be utilized for producing an aromatic polycarbonate, without any purification or the like. In the method of the present invention, not only can a necessity for complicated operations, such as a purification treatment, be reduced, but also the amount of wastes can be reduced and the yield of the aromatic polycarbonate, based on any of phenol and bisphenol A, can be improved.

The present invention relates to a flame retardant epoxy prepreg composite material and its preparation method and its use, the composite material contains 20 to 70% of epoxy resin matrix and 30-80% of fiber reinforced materials; wherein the epoxy resin matrix comprises the following components by mass part: 100 parts of an F type epoxy resin, 10-50 parts of an E type epoxy resin, 5-40 parts of tetrabromobisphenol A, 5-20 parts of a curing agent, 1-10 parts of a curing accelerator, 5-25 parts of a toughening agent, 1-10 parts of antimonous oxide and 20-80 parts of an organic solvent. According to the invention, F46 type epoxy resin containing a rigid frame structure is taken as a main component, the flame retarding and toughening modification are carried out on the resin matrix by a combination technology, the epoxy composite material with high toughness, high flame retardancy and good overlaying manufacturability can be realized, the flue gas density is obviously decreased when the flame is carried out, and the epoxy prepreg composite material possesses important popularization and application prospects in the fields of large aircraft, ships, high-speed rails and the like.

The invention relates to a halogen-free phosphorus-containing flame retardant polyimide resin composite, which is characterized by comprising the following components in part by weight: 150 to 180 parts of bismaleimide, 90 to 110 parts of allyl compound, 10 to 20 parts of bisphenol A epoxy resin and 10 to 50 parts of phosphorus-containing compound. The invention also relates to a preparation method for the halogen-free phosphorus-containing flame retardant polyimide resin composite. The method comprises the following steps of: adding the bismaleimide, the allyl compound, the bisphenol A epoxyresin and the phosphorus-containing compound into a reaction kettle, and reacting at the temperature of between 120 and 140 DEG C for 3 to 5 hours to obtain the halogen-free phosphorus-containing flame retardant polyimide resin composite. The halogen-free phosphorus-containing flame retardant polyimide resin composite is synthesized in one step and does not contain halogens and has high flame retardant performance; according to UL94 V0 flame retardant grade tests, the toughness of the cured composite is improved; and the moist heat resistant performance of the composite is high, and the composite meets the requirements of flame retardance and processing in the process of processing copper-clad plates and has high the storage stability.

A material comprising a specific bisphenol compound of formula (1) is useful in forming a photoresist undercoat wherein R¹ and R² are H, alkyl, aryl or alkenyl, R³ and R⁴ are H, alkyl, alkenyl, aryl, acetal, acyl or glycidyl, R⁵ and R⁶ are alkyl having a ring structure, or R⁵ and R⁶ bond together to form a ring. The undercoat-forming material has an extinction coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm, and a high etching resistance as demonstrated by slow etching rates with CF₄/CHF₃ and Cl₂/BCl₃ gases for substrate processing.

A polyethersulfone composition is disclosed which comprises structural units derived from a monomer mixture comprising bisphenol-A and at least 55 mole percent of 4,4′-biphenol based on total moles of diphenolic monomers, wherein the polyethersulfone has a minimum weight average molecular weight which is a function of the mole percent of structural units derived from biphenol monomer. In addition the polyethersulfones possess a notched Izod impact strength value of greater than 470 Joules per meter as measured by ASTM D256.