9847results about "Epoxy resin adhesives" patented technology

A transformable pressure sensitive adhesive composition comprised of from about 15 to about 80% by weight of a polymer having a softening point greater than 60° C.; from about 20 to about 85% by weight of a polymerizable resin having a softening point less than 30° C.; a latent initiator in an amount sufficient to cause a reaction between said polymer and said resin; and optionally, a crosslinking agent. The transformable pressure sensitive adhesive has particular applicability in connection with organic light emitting diode display devices, light emitting diode display devices, medical diagnostic testing devices, flexible or rigid LCD display devices, plasma display devices, and electrochromic devices.

The invention is a composition comprising applying to a substrate a stream of an adhesive comprising: one or more epoxy resins; one or more rubber modified epoxy resins; one or more toughening compositions comprising the reaction product of one or more isocyanate terminated prepolymers and one or more capping compounds having one or more phenolic, benzyl alcohol, aminophenyl, or, benzylamino groups wherein the reaction product is terminated with the capping compounds; one or more curing agents for epoxy resins and one or more catalysts which initiate cure at a temperature of about 100° C. or greater; and optionally; fillers adhesion promoters, wetting agents or rheological additives useful in epoxy adhesive compositions; wherein the adhesive composition has a viscosity at 45° C. of about 20 Pa.s to about 400 Pa.s. The composition can be used as an adhesive and applied as a stream using a high speed streaming process.

The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and / or tetrafunctional epoxy resins and / or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

An activatable (e.g., heat expandable) material and articles incorporating the same is disclosed. The material includes an epoxy resin; an epoxy / elastomer hybrid or reaction product; a blowing agent; a curing agent; and optionally, a filler. In preferred embodiments, the material includes aramid fiber, nanoclay or both.

The invention is an epoxy resin based adhesive composition comprising an epoxy resin and a compound comprising an elastomeric prepolymer residue selected from the group of a polyurethane, a polyurea and a polyurea polyurethane having isocyanate end groups, the isocyanate end groups of said prepolymer residue being capped by a capping compound selected from the group consisting of a primary aliphatic, cycloaliphatic, heteroaromatic and araliphatic amine, a secondary aliphatic, cycloaliphatic, aromatic, heteroaromatic and araliphatic amine, a thiol and an alkyl amide, said capping compound being bound to the end of the polymer chain of the elastomeric prepolymer in a manner such that the end to which it is bonded no longer has a reactive group. In addition to the capping compound defined above above, a capping compound selected from the group consisting of a phenol and a polyphenol can be used for capping the isocyanate end groups of the prepolymer residue

The invention relates to an epoxy adhesive composition comprising a) a first epoxy resin, b) a second epoxy resin modified with an acrylonitrile-butadiene rubber, the latter comprising on average less than about 25 weight percent acrylonitrile, and c) a toughener. The total amount of component b) and component c) is higher than about 30 percent based on the total weight of the composition, and the weight ratio of component c) to component b) is greater than about 1:1. The invention further relates to the use of said epoxy adhesive composition for the assembly of parts of a vehicle. It also relates to a vehicle, parts of which are assembled by said epoxy adhesive composition.

A coated print bed for a 3D printer having a permanent print-surface coating permanently secured to a print bed substrate plate, having a smooth, planar surface that provides an adhesive interface layer between a first layer of an applied plastic print material and the coated print bed. The coating contains a matrix-forming compound, such as a solvent- or water-based epoxy resin, an adhesive material, and optionally a filler. The user can print a series of print object directly onto the permanent print surface coating of the coated print bed, without having to refresh or refurbish the print surface, such as by applying to the print bed surface a temporary coating such as painter's tape, or a liquid adhesive.

The invention discloses an epoxy resin composition, a metal-based copper-clad plate and a manufacturing method thereof. The epoxy resin composition comprises the following components by mass: 90-110 parts of epoxy resin, 10-50 parts of thermoplastic resin, 1-100 parts of a curing agent, 0.05-5 parts of a curing accelerant, 1-10 parts of an additive, 20-500 parts of heat conduction filler and 0-30 parts of an organic solvent. The metal-based copper-clad plate has the characteristic that 1, the heat conductivity is high; 2, the insulation property is high as the puncture-withstand voltage is higher than 6KV; 3, the anti-bending property is high, so that the metal-based copper-clad plate can be used for manufacturing a three-dimensional aluminum substrate; 4, the thickness of the insulation layer is uniform, the coating thickness tolerance can be controlled at + / - 2 microns, and the press-fit thickness tolerance can be controlled at + / - 5 microns, so that the performance of a product can be guaranteed; 5, the production efficiency is high; 6, the cost is low and is about 1 / 4-1 / 3 of the cost of an imported product.

This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.

In one embodiment the invention is An adhesive composition comprisinga) a polymer having a flexible backbone and a reactive moiety capable of cross-linking,b) a particle comprising an active agent encapsulated in an encapsulating agent wherein the active agent comprises a catalyst for cross-linking of the reactive moiety, a curing agent for the reactive moiety, an accelerator for the curing reaction or a mixture thereof; and the encapsulating agent comprises a side chain crystallizable polymer wherein the active agent is not substantially extractable from the particle at ambient conditions in a first extraction after particle formation.This composition is used in binding two subtracters together.

The present invention provides a room-temperature curable, reinforced thermosetting epoxy resin composition. The composition includes an epoxy resin first component, and an epoxy resin hardener second component. The epoxy resin component includes an epoxy resin, and may further include an inorganic and / or organic filler component, such as a structural reinforcement component. The epoxy resin hardener component includes an amine-based hardener, and may further include an inorganic and / or organic filler component. Cured reaction products of the composition demonstrate at about room temperature an adhesive strength of at least about 6500 psi, such as about 8000 to about 10000, and a fracture toughness of at least about 10 in-lbs / in.sup.2, such as about 20 to about 35 in-lbs / in.sup.2. In addition, the cured reaction products of the composition demonstrate a creep resistance at about room temperature at least about 6000 psi of at least about 1 hour. After mixing together the first and second components and at about room temperature, the composition has a pot life of at least about 3 hours at about room temperature, and after application onto a surface of a substrate has a slump resistance at about 30 minutes of less than about 0.5 inches.

Disclosed is a nanocomposite comprising a nano-reinforcing material (e.g., layered clay), a polymer matrix (e.g., a polyolefin), and, an epoxy-functionalized graft polymer compatible with the polymer matrix (e.g., epoxy-grafted polyolefin). Such nanocomposites are useful in the fabrication of a variety of materials including parts for the transportation and packaging industries, electronics, business equipment, building and construction materials.

Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii) at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein. A second variant of the method involves using an adhesive composition that comprises a reaction product of (i) a protein or lignin, (ii) a first compound that includes at least one amine, amide, imine, imide or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the protein and (iii) a curing agent.

It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability / formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and / or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and / or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and / or metal carboxylate in a dispersion medium.

The present invention relates to a material, method, and application for reinforcement of structural members, especially joints such as a hem flange joint of an automobile. The method and material of the present invention comprises of combining, in parts by weight: less than about twenty percent (<20%) ethylene copolymer, less than about forty percent (<40%) epoxy, less than about thirty percent (<45%) epoxy-based resin, less than about two percent (<2%) blowing agent and from about one percent (1%) to about five percent (5%) curing agent (and optionally add any of the following components: less than about two percent (<2%) curing agent accelerator, from about twenty-five percent (25%) to fifty-five percent (55%) filler, and less than about one percent (<1%) of coloring agent). The application of the present invention comprises of: (1) providing a structural member having two substrates forming a space to be joined; (2) placing the material of the present invention in proximity of the space to be joined; (3) exposing the material to a heat source causing it to flow, fill, and cure in the defined area or space to be joined.

The invention relates to a high-temperature resisting adhesive and a preparation method thereof; the adhesive is formed by the following ingredients: carboxyl contained polyimide resin powder, epoxide resin, curing agent and organic solvent with weight ratio of 1:10-20:0.1-2:20-30. The preparation method of the high-temperature resisting adhesive comprises the following steps: adding the carboxylcontained polyimide resin powder, the epoxide resin and the curing agent into a reaction kettle, heating the reaction kettle to 80-90 DEG C for carrying out stirring reaction for 0.5-1.5 hours, and then adding the organic solvent continuously, and stirring the mixture uniformly at room temperature, thus obtaining the high-temperature resisting adhesive. The preparation method has simple process and low cost and is environment-friendly, the preparation process can be carried out in a general device, thereby being suitable for industrial production.

The present invention relates to compositions which contain at least one epoxide adduct A having on average more than one epoxide group per molecule, at least one polymer B of the formula (I), at least one thixotropic agent C, based on a urea derivative in a nondiffusing carrier material, and at least one curing agent D for epoxy resins, which is activated by elevated temperature. This composition serves in particular as an adhesive and has an extremely high dynamic resistance to cleavage, in particular at low temperatures. The invention furthermore relates to impact strength modifiers terminated with epoxide groups and of the formula (I). It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular in two-component epoxy resin compositions.

It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and / or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

A two part system for producing structural reinforcing adhesives is provided wherein one component containing epoxy resin is combined with a second component containing a specified curative system. An aliphatic polyamine, an amidoamine, an alcohol and an adduct of a polyamine and an epoxide are present in the curative system. When a thermally activated blowing agent is utilized, the resulting foam is remarkably uniform in cell structure and has improved strength and modulus. Hollow inorganic microspheres are employed to reduce the density of the thermoset produced from the two part system.

A method for sealing an electronic device includes providing an electronic device on a substrate, providing a lid, activating a getter material in an environment substantially free of contaminants, applying a sealing material to at least a portion of the lid, and attaching the substrate and the lid in an inert environment. The time elapsed between activating the getter material and attaching the substrate and the lid is less than 20 minutes. A sealing assembly for an electronic device includes an activation tool for activating a getter material, a dispensing tool for dispensing a sealing material, and an encapsulation tool for sealing the electronic device. The sealing assembly is in an environment substantially free of contaminants.

The invention relates to an aqueous binder which is compounded and modified by micro nano material. The modified aqueous binder of the invention adopts emulsion adhesive as matrix and micro-size and nano-size inorganic powder as modifier to prepare the compound and modified aqueous binder. The method of the invention can not only enhance the interface binding force of the aqueous binder, but also greatly improve the properties of water resistance, toughness and extensibility, leading comprehensive performance of the aqueous binder to be improved.

The invention discloses an epoxy resin adhesive for manufacturing blades of a wind driven generator and a preparation method thereof. The epoxy resin adhesive is prepared by combining a resin part and a curing agent part, wherein the resin part comprises epoxy resin, a dilutent, filler, a thixotropic agent and an auxiliary agent; the curing agent part comprises an amine curing agent, filler and athixotropic agent; and the filler comprises a powdery filler part and a fibrous filler part. The epoxy resin adhesive prepared by using the general epoxy resin has high strength, particularly furtherimproves the strength of materials by adding the fibrous filler, improves the anti-cracking performance of the materials, meets the special requirements of the blades of wind driven generators with megawatt or more on the materials and has low material cost and high economy.

Electromagnetic interference (EMI) shielding structure and methods of making such structures are provided. In one case, a method is provided for making a lightweight composite structure for electromagnetic interference shielding, including the steps of providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and combining the nanoscale fiber film with one or more structural materials to form a composite material which is effective as an electromagnetic interference shielding structure. In another case, a method is provided for shielding a device which includes an electrical circuit from electromagnetic interference comprising the steps of providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and incorporating the nanoscale fiber film into an exterior portion of the device to shield an interior portion of the device from electromagnetic interference.

A 2K epoxy adhesive is provided that has rapid cure time and good strength characteristics. Both the epoxy resin composition and the hardener composition of the 2K epoxy comprise a reactive toughener. Such adhesives are useful in the manufacture and / or repair of large machinery (e.g., automobiles), and are useful for bonding like or unlike materials, such as metal and composites (e.g., carbon fiber or glass fiber composites).

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.

The invention relates to adhesive for collecting formaldehyde and paint for collecting the formaldehyde, both of which use formaldehyde collecting agent as a composition of active components. The adhesive is used for adhesion of the outmost layer in a man-made board or adhesion and edge sealing at a kerf of the man-made board, can effectively absorb formaldehyde released by the man-made board, does not cause influence on the adhesive strength of the board, and is comparatively cheap. The paint is used for painting indoor walls, absorbs the formaldehyde in the indoor air, can also be used for painting the surface of the man-made board, seals and absorbs formaldehyde gas, and reduces the release amount of the formaldehyde. Compared with the prior art, the adhesive and the paint for collecting the formaldehyde have the advantages that the adhesive and the paint are cheap, can efficiently adsorb the formaldehyde and generate stable compounds, and do not re-decompose and release the formaldehyde, so the adhesive and the paint cannot generate other secondary pollutants.

The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and / or tetrafunctional epoxy resins and / or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.