3347results about "Graft polymer adhesives" patented technology

Cationic and hybrid radiation-curable pressure sensitive adhesive compositions for digital versatile discs and other substrates, a method for bonding versatile digital disc layers together with a cationic or hybrid radiation-curable pressure sensitive adhesive, and a digital versatile disc bonded by cationic or hybrid radiation-curable pressure sensitive adhesive.

A polypropylene type aqueous dispersion comprising the following components (a) to (c):

wherein the component (a) has a main chain having the following features (1) and (2) and dispersion particles in the dispersion have an average particle size of at most 0.5 μm,

Feature (1) when observing a peak derived from a carbon atom of a methyl group in a propylene unit chain part comprising a head-to-tail bond by ¹³C-NMR and fixing a chemical shift of a peak top at a peak attributable to pentad expressed by mmmm to 21.8 ppm, a ratio (S₁/S) of an area S₁ of a peak of a peak top at 21.8 ppm to a total area S of peaks at from 19.8 ppm to 22.1 ppm is at least 10% and at most 60%, and when an area of a peak (mmmr) of a peak top at 21.5 to 21.6 ppm is expressed as S₂, 4+2S₁/S₂>5, and Feature (2) a content ratio (mol ratio) of propylene unit (A): other olefin unit (B) is from 100:0 to 90:10.

The invention provides an ultraviolet curable organic silicon-acrylic resin electronic adhesive, which comprises the following components: (1) 100 parts of doublebond-containing acrylic monomers or prepolymer, (2) 5 to 500 parts of doublebond-containing organic silicon resin with a molecular weight of 1,000 to 10,000, (3) 1 to 100 parts of vinyl compound modified inorganic nano particle, (4) 1 to 50 parts of radical ultraviolet initiator, (5) 1 to 100 parts of organosilan, (6) 0 to 200 parts of inorganic reinforcing agent, and (7) 0 to 50 parts of auxiliary agent, wherein the ultraviolet curable organic silicon-acrylic resin is prepared by carrying out ultraviolet curing on the materials, and the solid content thereof is 100 weight percent. The product produced by the invention has the excellent characteristics of firm bonding with metal, glass and plastic materials and electronic devices, good optical property, good elasticity, good weather resistance, safety, non-toxicity, convenient construction and the like, can replace traditional solvent electronic adhesives, and is used for protective coatings, protective adhesives, packaging materials and the like of electronic devices, integrated circuits, printed circuits, LED chips and the like.

A 2K epoxy adhesive is provided that has rapid cure time and good strength characteristics. Both the epoxy resin composition and the hardener composition of the 2K epoxy comprise a reactive toughener. Such adhesives are useful in the manufacture and/or repair of large machinery (e.g., automobiles), and are useful for bonding like or unlike materials, such as metal and composites (e.g., carbon fiber or glass fiber composites).

Crosslinkable compositions are provided that readily crosslink in situ to provide biocompatible, nonimmunogenic crosslinked materials that may be used as adhesive compositions. The compositions comprise collagen and a plurality of crosslinkable components having reactive functional groups thereon, with the functional groups selected so as to enable inter-reaction between the components, i.e., crosslinking. Methods for preparing and using the compositions are also provided. Exemplary uses include tissue augmentation, biologically active agent delivery, bioadhesion, prevention of adhesions following surgery or injury, and coating of surgically acceptable patches and solid implants, the latter including sutures.

The invention relates to compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at least one thixotropic agent C, based on a urea derivative in a non-diffusing support material; and at least one curing agent D for epoxy resins, which is activated by an increased temperature. According to preferred embodiments, the invention also relates to compositions containing at least one core-shell polymer E and/or filler F and/or reactive diluent G. The invention also relates to the use of said compositions as a single-component adhesive and to a method for producing the compositions. The invention further relates to the use of the thixotropic agent C, based on a urea derivative in a non-diffusing support material as an agent for increasing the impact resistance.

A method for using a thermoplastic elastomeric composition which contains a multi-staged emulsion polymer binder is provided. An elastomeric composition which contains a multi-staged emulsion polymer binder and a photosensitive composition and a method for using the elastomeric composition in elastomeric coatings, caulks, or sealants is also provided.

Disclosed is a specific adhesive polyethylene composition comprising [1] a modified ethylene/alpha-olefin copolymer resin or elastomer obtained by modifying a specific ethylene/alpha-olefin copolymer resin or elastomer, each of which comprises ethylene and an alpha-olefin of 3 to 20 carbon atoms, with an unsaturated carboxylic acid or anhydride, ester, amide, imide or metallic salt derivative of a unsaturated carboxylic acid thereof, [2] an unmodified ethylene/alpha-olefin copolymer resin and/or an unmodified ethylene/alpha-olefin copolymer elastomer and [3] a tackifier. Also disclosed is a multi-layer laminated film of 3 or more layers in which a layer of the above composition is interposed between an ethylene polymer layer and either a polyamide resin layer, an ethylene/vinyl alcohol copolymer layer or a layer of a mixture of polyamide resin and ethylene/vinyl alcohol copolymer. The adhesive polyethylene composition shows excellent adhesion strength to ethylene polymers, polyamide resins and ethylene/vinyl alcohol copolymers, high heat-sealing strength and heat resistance. The multi-layer laminated film shows excellent strength, heat resistance and gas barrier properties, and besides this film has heat shrinkability, so that the film is suitably used as a shrink film.

Adhesive composition comprises a polyfarnesene and a tackifier. The polyfarnesene can be a farnesene homopolymer derived from a farnesene (e.g., α-farnesene or β-farnesene) or a farnesene interpolymer derived from a farnesene and at least a vinyl monomer. In some embodiments, the at least one vinyl monomer is ethylene, an α-olefin such as styrene, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof. The composition disclosed herein can be used as a hot melt adhesive, a pressure sensitive adhesive or the like.

A curable composition is provided comprising an oligomer having a plurality of pendent and/or terminal ethylenically unsaturated, free-radically polymerizable functional groups, a free-radically polymerizable crosslinking agent, and/or a diluent monomer, and a photoinitiator. The composition, when cured, is non-yellowing, exhibits low shrinkage and low birefringence making it suitable for many optical applications such as optical lenses, optical fibers, prisms, light guides, optical adhesives, and optical films.

A transdermal drug delivery system is provided which includes an optionally crosslinked macromer-reinforced (meth)acrylic ester base copolymer pressure sensitive adhesive wherein the macromer includes repeat hydrophilic units.

The invention relates to a high weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby. The high weather-proof thermosetting resin composite comprises the following components in parts by weight: 10-40 parts of allyl compound, 8-80 parts of bismaleimide compound, 0-30 parts of epoxy resin and 0.05-5 parts of catalyst, wherein the molar ratio of allyl compound to bismaleimide compound is 1:2-4. The high weather-proof thermosetting resin composite provided by the invention has higher heat resistance, and the coefficient of thermal expansion (CTE) can be lowered to be below 2.0% to satisfy the requirements of manufacturing high multi-layer PCB. The prepreg prepared by the high weather-proof thermosetting resin composite has simple manufacture, better heat-resistant effect and high heat conductivity. The copper-clad laminate of the invention can be applied to heat-resisting and high multi-layer circuits and has simple manufacturing technology and low cost.

A polymerizable composition which contains a component (A): a (meth)acrylic monomer, a component (B): a (meth)acrylic polymer having at least one functional group capable of undergoing a cross-linking reaction in its molecule, a component (C): a (meth)acrylic oligomer having at one terminal of its molecule a functional group capable of undergoing a cross-linking reaction, a component (D): a cross-linking agent having a functional group capable of undergoing a cross-linking reaction, a compound (E): a photopolymerization initiator and/or a thermal polymerization initiator, and a component (F): a thermally conductive filler, is disclosed. Further, a (meth)acrylic thermally conductive sheet having a pressure-sensitive adhesive layer prepared by polymerizing and cross-linking the polymerizable composition on a support is disclosed. The thermally conductive sheet prepared by using the polymerizable composition according to the invention is excellent in flexibility, adhesiveness and bleed resistance and can dissipate heat generated from a heat-generating body such as an electronic device with good efficiency.

The present invention relates to silicone (meth)acrylate particles, to a process for preparing such silicone (meth)acrylate particles including the steps of:

• a) obtaining an emulsion composed of water and an organic phase comprising organopolysiloxanes modified terminally and/or laterally with acrylate groups, and
• b) polymerizing the inner phase to completion by means of a free-radical initiator, the free-radical initiator being added to the outer phase (aqueous phase) in a concentration of 0.1 to 40% by weight based on the inner phase, and to the use of the particles alone or in a mixture with further particles, pigments and/or further customary additives in the form of powders or dispersions in coating, adhesive or sealant materials, in polymers, in defoamers, in wetting and levelling aids, in cosmetic or pharmaceutical formulations and care products, in cleaning and detergent compositions, or in applications for modifying the interface properties of solid and liquid substrates, for example tactile properties, hydrophobization, or sliding and/or release properties.

The invention relates to aqueous bonding agent for lithium ion batteries, a preparation method and a positive plate for the lithium ion batteries, belonging to the energy storage device such as battery manufacturing field. The aqueous bonding agent for the lithium ion batteries provided by the invention is aqueous polymer emulsion formed after polyvinyl alcohol or ethylidene ether derivatives thereof is taken as a main polymer and two or more than two monomers with different polarities are taken as a graft comonomer to undergo a graft modification in water medium, the solid content of the emulsion is between 5 and 40 percent, and the viscosity is between 200 and 20000 centipoise (40 DEG C). The positive electrode prepared by the aqueous bonding agent for the lithium ion batteries of the invention has higher compacted density, so the volume energy density of the lithium ion batteries is improved; at the same time, the positive plate has good flexibleness after the drying, which contributes to the production of the batteries, improves the finished product rate of battery production, and solves the problems that the positive electrode of the lithium batteries has lower compacted density and the positive plate is brittle and has bad flexibleness after the drying.

The invention discloses a high-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards, and a preparation method thereof. The high-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards is made from, by weight percent, 30-50% of polyester elastomer with above 180 DEG C of melting point, 10-40% of polyolefin copolymer modified by maleic anhydride, 0-40% of polyolefin copolymer, 10-30% of tackifying resin, 0-15% of filler, and 1-3% of functional aid. The components add up to 100%. The high-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards has the advantages of high adhesion strength, instantaneous resistance to the temperature up to 170-190 DEG C, and long-term resistance to the temperature up to 130 DEG C.

The invention discloses a modified-starch-based wood adhesive and a preparation method thereof. The preparation method comprises the steps that oxidized corn starch is used as a main raw material, a cross-linking agent is added into the oxidized corn starch to conduct crosslinking modification, and then an initiating agent and a high molecular monomer are added to the oxidized corn starch to conduct graft modification, so as to obtain a modified starch emulsion in a complex net structure; and after the modified starch emulsion is warmed up and pasted, modifying agents comprising a stabilizing agent, a defoaming agent, a plasticizing agent and the like are added into the modified starch emulsion, and the high-performance green environment-friendly adhesive is manufactured. Each performance of the adhesive disclosed by the invention can reach or exceed requirements of a GB/T9846-2004 standard, the adhesive has the characteristics of high bonding strength, good water resistance, long storage time, high solid content, low cost, greenness, environment friendliness and wide use range, and can be widely applied to the bonding and the use of wood materials such as artificial boards, plywood and cellulose boards.

A method of tissue repair is provided using a biocompatible nonimmunogenic adhesive composition. The adhesive composition comprises collagen and a plurality of crosslinkable components having reactive functional groups thereon, with the functional groups selected so as to enable inter-reaction between the components, i.e., crosslinking. Kits for use in carrying out the method of the invention are also provided, as are pretreated surgically acceptable patches that have been coated with the aforementioned adhesive composition.

The invention provides a composition comprising at least the following: an olefin multi-block interpolymer, a functionalized olefin-based polymer, and a thermoplastic polyurethane. The invention also provides for articles prepared from the inventive compositions and for methods for making the same.

The invention relates compositions containing at least one silane-grafted polyolefin, and in particular, to compositions containing at least one silane-grafted ethylene/α-olefin polymer, which has a melt viscosity less than 50,000 cP, and adhesives containing the same. In one embodiment, the at least one silane-grafted ethylene/α-olefin polymer is formed from an ethylene/α-olefin polymer that has a molecular weight distribution from 1 to 3.5. The invention also relates to the preparation of the silane-grafted polymers, by reacting, for example, an ethylene/α-olefin polymer with at least one silane compound and at least one initiator.

The use of a polyalphaolefin oil or combinations of polyalphaolefin oils to modify the softening point characteristics of a tackifier and compositions containing a tackifier and polyalphaolefin oil are disclosed herein.