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Method for growing thin films

PCT No. PCT / FI95 / 00658 Sec. 371 Date Sep. 25, 1996 Sec. 102(e) Date Sep. 25, 1996 PCT Filed Nov. 28, 1995 PCT Pub. No. WO96 / 17107 PCT Pub. Date Jun. 6, 1996A method for growing a thin film on a substrate. A substrate is placed in a reaction space. The substrate is subjected to at least two vapor phase reactants in the form of vapor phase pulses, repeatedly and alternately. Gas within the reaction space is purged between two successive vapor phase pulses essentially entirely by use of a pump connected to the reaction space. The reaction space is purged between two successive vapor phase pulses such that less than 1% of the residual components from the first vapor phase pulse remains prior to the inflow of the second vapor phase pulse.
Owner:ASM AMERICA INC

Thermally applied coating for piston rings, consisting of mechanically alloyed powders

InactiveUS20030180565A1Minimize negative affectConstant sliding wearPiston ringsMolten spray coatingBearing surfaceWear resistant
The invention relates to a wear-resistant coating used for bearing surfaces and flanks of piston rings in internal combustion engines. The wear-resistant inventive coating is obtained by mechanically alloying powders which form a metallic matrix with hard material dispersoids and lubricant material dispersoids. The coating is then thermally applied to the workpieces, especially by means of high velocity oxygen fuel spraying (HVOF). The workpieces coated are bearing surfaces and parts of flanks pertaining to piston rings in internal combustion engines.
Owner:FEDERAL MOGUL BURSCHEID

Method of forming a thin wafer stack for a wafer level package

A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.
Owner:SAMSUNG ELECTRONICS CO LTD
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