3197results about How to "Avoid warping" patented technology

A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.

A firing furnace comprising: a muffle formed so as to ensure a space for housing a formed body to be fired; a member that constitutes a heat generator and is placed on and / or around the muffle; and a heat insulating layer that contains said muffle and said heat generator inside thereof, wherein a carbon-natured sheet is placed in the vicinity of corner portions of an inner face of said heat insulating layer.

Disclosed herein is a flat panel display manufacturing apparatus in a predetermined process is performed using plasma generated therein. In such a flat panel display manufacturing apparatus, a process gas is supplied into a chamber in an evenly diffused state to generate even plasma inside a symmetrical interior space of the chamber. Consequently, the flat panel display manufacturing apparatus can appropriately control flow rate of the plasma, thereby being capable of performing even processing on a large-scale substrate. In the flat panel display manufacturing apparatus, a substrate pedestal thereof is provided with a combination of vertical and horizontal shielding members, thereby being entirely protected from attack of the plasma, resulting in an increased life-span.

In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower chip and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips / wafers is greatly improved, while providing complete fill of the gap. In addition, mechanical reliability is improved and CTE mismatch is reduced, alleviating the problems associated with warping, cracking and delamination, and leading to an improvement in device yield and device reliability.

The invention provides a selective laser melting forming device of a medical magnesium alloy metal part, which comprises a control device, a powder delivering and spreading device, a laser transmission mechanism, an air purification device and a closed forming chamber, wherein the powder delivering and spreading device comprises a hopper and powder spreading brushes arranged on two sides below the hopper, the upper part of the hopper is arranged in a way of corresponding to a feeding opening on the upper part of the forming chamber, and the lower parts of the powder spreading brushes horizontally correspond to the upper surface of a forming cylinder; the laser transmission mechanism is arranged outside and above the forming chamber and is arranged in a way of corresponding to the forming cylinder; the side wall of the forming chamber is provided with an air inlet and an air outlet, and the air purification device is connected with the air inlet and the air outlet respectively; and the control device is connected with the powder delivering and spreading device, the laser transmission mechanism, the forming cylinder and the air purification device respectively. The invention also provides a selective laser melting forming method of the medical magnesium alloy metal part. The device and the method can manufacture parts which have complex shapes required in the medical field directly, and have the advantages of high forming efficiency and the like.

A process for fabricating an integrated circuit package includes mounting a semiconductor die on a first surface of a metal carrier and forming electrical connections between the semiconductor die and ones of a plurality of contacts on the metal carrier. Next, using a molding material in a mold, the semiconductor die and the contacts are molded in the molding material, between the metal carrier and a metal strip. The metal carrier and the metal strip are etched away and the integrated circuit package is singulated.

A multi-slice computed tomography imaging system is provided including a source that generates an x-ray beam and a detector array that receives the x-ray beam and generates projection data. A translatable table has an object thereon and is operable to translate in relation to the source and the detector array. The source and the detector array rotate about the translatable table to helically scan the object. An image reconstructor is electrically coupled to the detector array and reconstructs an image in response to the projection data using a computed tomography modeled iterative reconstruction technique. The iterative reconstruction technique includes determining a cross-section reconstruction vector, which approximately matches the projection data via a computed tomography model. Methods for performing the same are also provided including accounting for extended boundary regions.

Flanging press for folding over a flange of a component, preferably of a vehicle part, the press being arranged in a stationary manner and including at least the following: (a) a basic structure with a flanging bed, against which the component can be pressed in a pressing direction in order for the flange to be folded over, (b) a flanging die unit with a flanging die for folding over the flange, (c) and a pressing drive for generating a pressing force which acts on the component in order for the flange to be folded over, (d) wherein the flanging die and the flanging bed can be moved relative to one another in the pressing direction by the pressing drive in order for the pressing force to be exerted, characterized in that (e) the pressing drive includes a bellows which can be subjected to the action of pressurized fluid, preferably compressed gas, and, under the action of pressure, acts on the flanging die unit or the flanging bed in the pressing direction and thus generates at least some of the pressing force, and the bellows has a bellows surface which extends transversely to the pressing direction and can be subjected to the action of the pressurized fluid.

A photovoltaic element which directly converts an optical energy such as solar light into an electric energy. After many uneven sections are formed on the surface of an n-type crystalline silicon substrate (1), the surface of the substrate (1) is isotropically etched. Then the bottoms (b) of the recessed sections are rounded and a p-type amorphous silicon layer (3) is formed on the surface of the substrate (1) through an intrinsic amorphous silicon layer (2). The shape of the surface of the substrate (1) after isotropic etching is such that the bottoms of the recessed sections are slightly rounded and therefore the amorphous silicon layer can be deposited in a uniform thickness.

There is provided a supporting plate having a structure in which a solvent can be supplied to an adhesive layer between the supporting plate and a substrate such as a semiconductor wafer in a short period of time after the substrate is thinned, and also a method for stripping the supporting plate.The supporting plate may have a larger diameter than the semiconductor wafer, and penetrating holes are formed in the supporting plate. The outer peripheral portion of the supporting plate is a flat portion in which no penetrating hole is formed. When alcohol is poured from above the supporting plate, the alcohol reaches the adhesive layer through the penetrating holes, dissolves and removes the adhesive layer.

The present invention provides a semiconductor device package comprising a substrate with at lease a pre-formed die receiving cavity formed and terminal contact metal pads formed within an upper surface of the substrate. At lease a first die is disposed within the die receiving cavity. A first dielectric layer is formed on the first die and the substrate and refilled into a gap between the first die and the substrate to absorb thermal mechanical stress there between. A first re-distribution layer (RDL) is formed on the first dielectric layer and coupled to the first die. A second dielectric layer is formed on the first RDL, and then a second die is disposed on the second dielectric layer and surrounded by core pastes having through holes thereon. A second re-distribution layer (RDL) is formed on the core pastes to fill the through holes, and then a third dielectric layer formed on the second RDL.

A multilayered wiring substrate constructed by staking a wiring layer 105, 108, 110, 112 and an insulating layer 104, 106, 107, 109 in predetermined number, which includes a reinforcing wiring layer 103 whose thickness is 35 to 150 μm is arranged in one layer or plural layers.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base, an ESD protection layer and an underlayer. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace, electrically isolated from the underlayer and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ESD protection layer is sandwiched between the base and the underlayer. The conductive trace provides signal routing between the pad and the terminal.

A wafer carrier for growing wafers includes a plate having a first surface and a second surface, a plurality of openings extending from the first surface to the second surface of the plate, and a porous element disposed in each of the plurality of openings, each porous element being adapted to support one or more wafers. The wafer carrier also has a blind central opening extending from the second surface toward the first surface of the plate, and a plurality of shafts extending outwardly from the blind central opening. Each shaft has a first end in communication with the blind central opening and a second end in communication with one of the porous elements for providing fluid communication between the blind central opening and one of the porous elements. Suction is formed at a surface of each porous element by drawing vacuum through the blind central opening and the shafts.