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2217results about How to "Reduce unevenness" patented technology

Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device

In order to fabricate a high performance thin film semiconductor device using a low temperature process in which it is possible to use low price glass substrates, a thin film semiconductor device has been fabricated by forming a silicon film at less than 450 DEG C., and, after crystallization, keeping the maximum processing temperature at or below 350 DEG C. In applying the present invention to the fabrication of an active matrix liquid crystal display, it is possible to both easily and reliably fabricate a large, high-quality liquid crystal display. Additionally, in applying the present invention to the fabrication of other electronic circuits as well, it is possible to both easily and reliably fabricate high-quality electronic circuits.
Owner:INTELLECTUAL KEYSTONE TECH

Ultrathin silicon oxynitride film material and preparation method and application thereof

The invention discloses an ultrathin silicon oxynitride film material and a preparation method thereof. The preparation method comprises the following steps: placing a substrate in a chemical vapor deposition equipment cavity, introducing NH3, O2 gas and SiH4-containing gas as reactant gases, introducing a carrier and protective gas, performing vapor deposition, thereby obtaining the silicon oxynitride film material, wherein the operating temperature of the chemical vapor deposition equipment cavity is 100-260 DEG C, the working pressure is 1-4Pa, and the power is 200-450W; the vapor deposition time is 15-40 seconds; the volume ratio of the SiH4 gas to the O2 gas is 9-110; the volume ratio of the SiH4-containing gas to the NH3 gas is 3-11; and the volume ratio of the SiH4-containing gas to the carrier and the protective gas is 0.1-1. The thickness of the silicon oxynitride film material prepared on a four-inch silicon substrate is 6-9nm, and the non-uniformity of the film is lower than 0.7 percent.
Owner:THE NAT CENT FOR NANOSCI & TECH NCNST OF CHINA

Image displaying apparatus

An image displaying apparatus, comprises: a plural number of electron sources, being disposed in matrix-like manner, each for emitting electrons therefrom; a driver for producing drive voltage for driving the electron sources upon basis of a video signal, to be supplied to the electron sources; and a correct circuit for correcting the video signal, wherein the correct circuit determines a predetermined number of correction points in horizontal and vertical directions, for the plural number of electron sources disposed in the matrix-like manner, corrects the video signal to the electron source corresponding to the correction point upon basis of a first correction value, which is determined in advance, and corrects the video signal corresponding to the electron source located between the correction points, upon basis of a second correction value, which is obtained through an interpolation calculation with using said first correction values, which are determined at each of the correction points, thereby correcting or compensating the unevenness in brightness, with using a small number of correction values therein.
Owner:HARUNA FUMIO +1

Light emitting device using light emitting diode chip

A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.
Owner:MATSUSHITA ELECTRIC WORKS LTD
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