1403results about How to "Thin thickness" patented technology

The substrate processing apparatus according to the present invention is aimed to stably and efficiently perform a deposition process on a substrate W. The substrate processing apparatus supports the substrate W in a position facing a heater portion and thus rotates a holding member holding the substrate W. Furthermore, the heating portion houses a SiC heater and a heat reflecting member in an internal portion of a quartz bell jar made of transparent quartz, and depressurizes an internal space of a processing vessel and an internal space of the quartz bell jar at the same time; thereby allowing the thickness of the quartz bell jar to be thinner, and thus improving thermal conductivity of heat from the SiC heater and preventing contamination by the SiC heater.

A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.

A substrate for a semiconductor device and a manufacturing thereof, and a semiconductor device using the same and a manufacturing method thereof are disclosed. For example, in the substrate according to the present invention, a core is eliminated, so that the substrate has a very thin thickness, as well, the length of electrically conductive patterns becomes shorter, whereby the electrical efficiency thereof is improved. Moreover, since a carrier having a stiffness of a predetermined strength is bonded on the substrate, it can prevent a warpage phenomenon during the manufacturing process of the semiconductor device. Furthermore, the carrier is removed from the substrate, whereby a solder ball fusing process or an electrical connecting process of the semiconductor die can be easily performed.

The present invention relates to a rechargeable battery. The rechargeable battery includes an electrode assembly, a case, electrode terminals, and a cap plate. The electrode assembly includes a separator and an anode and a cathode disposed at both sides of the separator. The case houses the electrode assembly. The electrode terminals are electrically connected to the electrode assembly and protrude outwardly from the case. The cap plate closes and seals the case. The cap plate includes a terminal hole for receiving the electrode terminals and a sealing reinforcing member formed along a circumference of the terminal hole and having a greater thicker than a periphery thereof.

A housing for an implantable medical device comprises a metallic wall including a telemetry window having a thickness that is thinner than the remainder of the housing wall and having an electrical conductivity that is less than that of the remainder of the housing wall. In another embodiment, an implantable medical device casing comprises a metallic wall including a telemetry window received within an aperture defined by said casing wall, the window having an electrical conductivity that is less than that of the remainder of the casing wall. Pursuant to another embodiment, there is provided an implantable medical device incorporating a casing as described above that is hermetically sealed and encloses a transceiver for bidirectional telemetric communication through the telemetry window.

The magnetic tape includes a magnetic layer having ferromagnetic powder and a binder on a non-magnetic support, in which a total thickness of the magnetic tape is equal to or smaller than 5.30 μm, the magnetic layer includes a timing-based servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, one or more components selected from the group consisting of fatty acid and fatty acid amide are included in the magnetic layer, and a C—H derived C concentration calculated from a C—H peak area ratio of C1s spectra obtained by X-ray photoelectron spectroscopic analysis performed on the surface of the magnetic layer at a photoelectron take-off angle of 10 degrees is equal to or greater than 45 atom %.

A method and apparatus for treating a nasal valve condition include surgically forming an access path to create a pocket on a side of the patient's nose. The pocket is positioned between a soft tissue layer and opposing surfaces of upper and lower cartilages of the nose. The pocket spans a junction between the upper and lower cartilages. An implant is selected having a length, width and thickness sized to reside within the pocket. The length is sized to span the junction. The width is sized to be less than the width of the upper and lower cartilages. The thickness of the implant is as thin as possible while maintaining material strength to resist bending in response to inhalation pressures at the nasal valve. The implant is placed through the access path into the pocket with the length oriented spanning the junction. A delivery system for placement of the implant includes a surgical tool for forming the access path and for delivering the implant into the access path.

A weight-adjustable golf club head includes a rear lightweight covering and a golf club head body combined therewith. The rear lightweight covering has a rear crown portion and a rear wall portion extended therefrom. The golf club head body is combined with the rear lightweight covering which is designed to have a striking face, a front crown portion and a sole portion. The rear lightweight covering is made from a low specific gravity metal, and is designed to have a thickness less than 0.6 mm. The rear lightweight covering has an inner surface formed with a plurality of reinforcing ribs.

A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.

A light emission apparatus that can restrict deterioration of resin used for the light emission apparatus, and that has a reasonable structure fit for actual use is provided, in which a light reflective layer is provided to cover the side surfaces of the chips 26 provided in the concave 2a. According to this, excitation light reflected by the phosphor layer 32, such as ultraviolet light, is reflected again by the light reflective layer 27. Therefore, the excitation light will not reach the resin layer 21, thereby restraining the deterioration of the resin. Moreover, the light reflective layer 27 covers the side surfaces of the chips 26, thereby efficiently conducting the heat emitted from the chips 26 to the metal substrate 20 via the resin layer 21. This improves the heat-dissipation efficiency of the chips 26.

Provided herein are orthodontic devices and methods for patients whose orthodontic devices are causing a lisp. The device can comprise an aligner configured to fit over a patient's dental arch and comprising an occlusal surface section positioned over an occlusal surface of the patient's teeth. The aligner can comprise a barrier portion extending laterally and adjacent to a region of the dental arch, the barrier portion allowing the patient's tongue to form a seal against the barrier portion when the patient is speaking while wearing the device.

The present invention discloses a system and method for mounting a flexible material, such as a web of photovoltaic material, onto a surface, such as a roof. The system and method comprises providing a first and a second elongated web of flexible material and disposing the first and second webs on the surface in a longitudinally aligned relationship with one another, wherein a first edge of said first web abuts a first edge of said second web to form a longitudinal engagement point to produce a substantially triangular shape. At least one clamping strip is secured onto the longitudinal engagement point, wherein the clamping strip(s) is adapted to secure the longitudinal engagement point in a stable position for the length of the web. At least one batten cap is clamped onto the clamping strip(s), wherein the batten cap(s) is adapted to secure the clamping strips. Additionally, securing means, such as screws, nails or adhesives, may be incorporated to attach the sides of the substantially triangular shape to the surface.

The invention relates to a substrate (1) comprising at least a first (2) and a second (8) coating layer on one surface of the substrate, for nanoimprint lithography, said first coating layer (2) consisting of a positive resist and said second (8) coating layer consisting of a negative resist. The invention also relates to a process in connection with nanoimprint lithography on the substrate (1), a pattern (3) of nanometre size being impressed in a first stage into the second coating layer (8) by means of a template (610), following which the first coating layer (2), in a second stage, is exposed to a chiefly isotropic developing method on surfaces thereof that have been exposed in connection with said first stage, a method for developing and material for said first and second coating layers being selected so that the first coating layer (2) is developed more quickly than the second coating layer (8), so that an undercut profile is obtained in the coating layers.

The present invention relates to a subminiature bone conduction speaker by using a vibrating plate and a mobile phone having the subminiature bone conduction speaker. A subminiature bone conduction speaker using a vibrating plate according to the present invention comprises a body having a shape of a cylinder of which upper portion is opened; yoke which is disposed in a lower portion of the body and of which center has a protrusion; a ring type magnet which is formed on the edge of the yoke and apart from an end portion of the protrusion by a predetermined clearance; an upper plate which is formed on the magnet; a mastoid which is contacted to bone conduction of a user and by which vibration is transmitted to the user; an acoustic vibrating plate which is inserted at a lower side of the mastoid to cover the opening portion of the body and which is made of an elastic material; an auxiliary vibrating plate which is inserted under the acoustic vibrating plate which is inserted to the mastoid; a voice coil which is attached to the auxiliary vibrating plate and which is inserted between the end portion of the protrusion of the yoke and the ring type magnet; a front cap for fixing the acoustic vibrating plate on the body; and a electrical signal input unit for inputting an electric signal to the voice coil.

A multi-chips bumpless assembly package with a patterned conductive layer, a patterned dielectric layer and an insulation layer interposed between the chips is provided, which can shorten the distance of the electrical connection between the chips so as to upgrade the electrical performance of the assembly package and make the package thinner and thinner. Moreover, a manufacturing method thereof is also provided to form a package with high electrical performance.