392results about How to "Reliable forming" patented technology

The substrate processing apparatus according to the present invention is aimed to stably and efficiently perform a deposition process on a substrate W. The substrate processing apparatus supports the substrate W in a position facing a heater portion and thus rotates a holding member holding the substrate W. Furthermore, the heating portion houses a SiC heater and a heat reflecting member in an internal portion of a quartz bell jar made of transparent quartz, and depressurizes an internal space of a processing vessel and an internal space of the quartz bell jar at the same time; thereby allowing the thickness of the quartz bell jar to be thinner, and thus improving thermal conductivity of heat from the SiC heater and preventing contamination by the SiC heater.

Methods of fabricating an energy-assisted magnetic recording (EAMR) head to compensate for a heat-induced protrusion of a near field transducer formed therein are disclosed. The methods can include applying optical power to the near field transducer to generate heat therein. The near field transducer protrudes beyond an air bearing surface of the EAMR head by the generated heat. The methods can further include removing a protruded portion of the near field transducer.

Methods of producing magnetic recording heads are disclosed. The methods can include providing a wafer comprising a substrate layer in which are disposed a plurality of damascene trenches. The method can further include depositing a pole material across the whole wafer, wherein the plurality of trenches are filled with the pole material. The methods can further include depositing a mask material over the pole material across the whole wafer. The methods can further include performing a first material removal process across the whole wafer to remove the mask material and a first portion of the pole material at a same material removal rate. The methods can further include performing a second material removal process to remove a second portion of the pole material above the substrate layer.

An object to be processed can be cut highly accurately along a line to cut.

An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

Provided herein is a composite, comprising: a polymer host selected from the group consisting of low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), and polypropylene (PP), polyurethane, polycaprolactone (PCL), polydimethylsiloxane (PDMS), polymethylmethacrylate (PMMA), and polyoxymethylene (POM); and a guest molecule comprising hyaluronic acid; wherein the guest molecule is disposed within the polymer host, and wherein the guest molecule is covalently bonded to at least one other guest molecule. Also provided herein are methods for forming the composite, and blood-contracting devices made from the composite, such as heart valves and vascular grafts.

A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface.

A semiconductor device includes: a first insulation film formed over a semiconductor substrate; and a plurality of first interconnects selectively formed in the first insulation film. A plurality of gaps are formed in part of the first insulation film located between adjacent ones of the first interconnects so that each of the gaps has a cylindrical shape extending vertically to a principal surface of the semiconductor substrate. A cap film is formed of metal or a material containing metal in upper part of each of the first interconnects.

In order to provide a battery in which a molded section can be fixed to a battery cell, a battery comprises a battery cell, a circuit board which is attached to the battery cell, an electrode terminal which connects the battery cell and the circuit board electrically, a molded section which adheres the circuit board and the electrode terminal to the battery cell as an entire unit, adhesion strengthened areas which are formed between the electrode terminal and the battery, and electrode terminal inner surface resin sections which are formed in a part of the molded section of the adhesion strengthened area.

A device and method for the manufacture of medical devices, specifically, endovascular grafts, or sections thereof. Layers of fusible material are disposed upon a shape forming member and seams formed between the layers in a configuration that can produce inflatable channels in desired portions of the graft. After creation of the seams, the fusible material of the inflatable channels may be fixed while the channels are in an expanded state. A five axis robotic seam forming apparatus may be used to create the seams in the layers of fusible material.

Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads and a solder resist in which opening portions which expose the pads are formed. Protrusion-shaped members are fixed to some of the surfaces of the pads. The surfaces of the pads and the surfaces of the protrusion-shaped members are covered with solder bumps. The height of the solder bumps is larger than the height H1 and H2 of the protrusion-shaped members. The opening portions have different inner diameters, and the volume of the protrusion-shaped members increases as the diameter of the opening portion decreases.

A processing method of a polishing pad for semiconductor wafer capable of forming a groove, a concave portion, a through hole and the like having a small surface roughness of the inner surface of the groove and the like of 20 mum or less, a high dimensional accuracy and a uniform cross-sectional shape, and a polishing pad for semiconductor wafer. In the processing method, a surface of a polishing pad including a water-insoluble matrix containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix is processed by cutting and the like. Additionally, when a groove and the like are formed, it is preferable that a polishing pad is placed on one surface side of a machining table having a sucking hole, the pad is fixed on the one surface side of the machining table by vacuuming sucking it from the other surface of the machining table, and then a groove and the like are formed.

The invention discloses a punching device for a buffer support of a rear shock absorber of an automobile, which comprises an upper die plate, a lower die plate, a die plate motion guide device, a male die, an upper stripper plate, a female die and a lower stripper plate, and is characterized in that the male die is fixed on the lower surface of the upper die plate, the upper stripper plate is fixed on the lower surface of the upper die plate through a stripper bolt penetrating a stripper spring, the female die is fixed on the upper surface of the lower die plate, the lower surface of the upper striper plate is in contact with the female die, the lower stripper plate is fixed with a tray of a punch through a pull rod penetrating the lower die plate, a stripper push rod is further arranged between the lower stripper plate and the tray of the punch, the male die and the upper stripper plate can slide relatively, and the female die and the lower stripper plate can slide relatively. The punching device can well realize blanking and forming once in the device, save a large number of process steps, greatly save the production cost, improve the production efficiency and ensure the product quality; furthermore, the punching device has low manufacturing cost, economy and durability.

Crystal lattice dislocations in material surrounding trench capacitors and other trench structures are avoided by alteration of stresses such as decreasing compressive stresses and/or development of persistent tensile forces within material deposited in the trench and thus at the material interface formed by the trench. Such alteration of stresses is achieved by volume reduction of a film deposited in the trench. The material is preferably a hydrogenated nitride of silicon, boron or silicon-carbon alloy which may be reduced in volume by partial or substantially complete dehydrogenation during subsequent heat treatment at temperatures where the film will exhibit substantial creep resistance. The amount of volume reduction can be closely controlled by control of concentration of hydrogen or other gas or volatile material in the film. Further fine adjustment of stresses can be achieved in combination with this mechanism by volume reduction of other materials which may be used, in part, to confine the film through other mechanisms such as annealing.

According to the present invention, in a carrying system comprising a carrying vehicle and a manufacturing apparatus the interior of which is kept cleaner than a surrounding environment, manufactured articles to be transferred are prevented from being contaminated by foreign matter or the like attached to transfer ports. A carrying vehicle includes a running unit 14 that runs along a predetermined carrying path, a cleaning unit 12 that supplies cleaned air, a housing section 13 to which the cleaned air is supplied and in which manufactured articles are housed, a transfer port 11 which is formed in a side of a housing and through which a manufactured article is loaded into or unloaded from the housing section 13, and an air injecting section 19A that blows out air toward the transfer port 11.

A top-fill hummingbird feeder has a generally upstanding liquid container with a large opening at its top end that is closed and sealed by a removable top or cap. The cap has a two-part construction including an outer shell and an inner sealing member. The inner sealing member includes a sealing element in the form of a vertically elongated, reinforced sealing ring that is received within the top of the container with a friction fit to automatically form a cork-type seal when the outer shell is threaded onto the container. Unthreading of the outer shell pulls the sealing ring out of engagement with the container to remove the cap.