62results about How to "High precision cutting" patented technology

The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

An object to be processed can be cut highly accurately along a line to cut.

An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

A machining method of machining a transfer optical surface on a optical element producing die having the transfer optical surface made of a material having Vickers hardness of Hv1500 or more, comprising: machining the transfer optical surface on the optical element producing die by cutting with a cutting tool, wherein a rake face of a tip of a blade of the cutting tool is set with an angle of minus values at an incising point on a surface to be machined.

A system to manufacture orthodontic appliances, program product, and associated methods are provided. An embodiment of a system can include a virtual orthodontic appliance design computer having orthodontic appliance design program product provided to design a virtual dimensional representation of an orthodontic appliance including bracket bodies and bracket pads, and a mold apparatus positioned to form each bracket body and bracket pad. The system also includes a data processing computer including computer-aided manufacturing program product provided to derive electrical discharge device control instructions including a virtual dimensional representation of a bracket slot in the bracket, and an electrical discharge machining apparatus. The electrical discharge machining apparatus can include a controller including control program product to derive a control signal carrying the electrical discharge device control instructions and an electrical discharge device.

A plurality of modified parts are formed at a first formation pitch for a line arranged along the M-plane of a single-crystal sapphire substrate to construct a modified region and cause a fracture occurring from the modified region to reach a principal surface of the single-crystal sapphire substrate. A plurality of modified parts are formed at a second formation pitch narrower than the first formation pitch for a line arranged along the A-plane of the single-crystal sapphire substrate to construct a modified region and cause a fracture occurring from the modified region to reach the principal surface of the single-crystal sapphire substrate. Along the lines, a knife edge is pressed against a wafer from the side of the single-crystal sapphire substrate opposite from the principal surface of the single-crystal sapphire substrate where the fractures have reached, to cut the wafer along the lines.

For the measurement, orientation and fixation of at least one single crystal, it is the object of the invention to ensure increased accuracy in the determination of crystallographic orientation and oriented fixation regardless of the outer geometry of the single crystals, and the fixation should guarantee a highly accurate cutting also with very hard materials such as sapphire or silicon carbide. The single crystal is adjustably positioned on a revolving table for determining the crystal lattice orientation, wherein the crystal lattice orientation is determined during at least one revolution of the revolving table based on a plurality of x-ray reflections. The orientation of the crystal lattice is carried out with reference to the determined angles of the normal of the lattice plane relative to the axis (X-X) of the revolving table as reference direction before carrying out the fixation of the single crystal and the fastening on a support oriented in reference direction. By virtue of the invention, a plurality of single crystals can be oriented, fixated, stacked one on top of the other and connected to one another and subsequently connected simultaneously to a common support. Further, the invention makes it possible to monitor the orientation of every single crystal after fastening to the common support.

To provide a cutting method and a cutting device for improving cutting accuracy by preventing deformation by preventing the push-down of a workpiece by an upper cutting blade at the time of cutting (full cut or half cut) of the upper cutting blade. The workpiece W inserted into a hole W1 opened in a sheet WH for a thin work holder is temporarily fastened to the sheet WH for the work holder by being located in a middle region of the thickness of the workpiece W not to be in contact with the upper and lower cutting blades C1 and C2 for the half cut. The workpiece W is half-cut by being shared over the whole width without cutting the sheet WH for the work holder by the upper and lower cutting blades C1 and C2 of required lengths which are longer than the whole width of the workpiece W and shorter than the sheet WH for the work holder. The push-down of the workpiece W by the upper cutting blade C1 at the time of the half-cut is prevented by a lower stripper ST2 fixedly provided in the table surface height of cutting machine 1. The push-up of the workpiece W by the lower cutting blade C2 is prevented by an upper stripper ST1.

A cutting machine 10 includes an upper blade 12A and a lower blade 12B installed at upper and lower positions, and resilient members 19A, 19B installed on both sides of the blades and protruding more than the blades for supporting a hard plastic sheet 7 during cutting. The resilient members installed on both sides of either of the upper and lower blades include a resilient member at a section near the blade and a resilient member at a section far from the blade, and the hardness of the resilient member at a section near the blade is different from the hardness of the resilient member at a section far from the blade.