62results about How to "High precision cutting" patented technology

An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

A plurality of modified parts are formed at a first formation pitch for a line arranged along the M-plane of a single-crystal sapphire substrate to construct a modified region and cause a fracture occurring from the modified region to reach a principal surface of the single-crystal sapphire substrate. A plurality of modified parts are formed at a second formation pitch narrower than the first formation pitch for a line arranged along the A-plane of the single-crystal sapphire substrate to construct a modified region and cause a fracture occurring from the modified region to reach the principal surface of the single-crystal sapphire substrate. Along the lines, a knife edge is pressed against a wafer from the side of the single-crystal sapphire substrate opposite from the principal surface of the single-crystal sapphire substrate where the fractures have reached, to cut the wafer along the lines.

A method for cutting a food strand into portions including the steps:feeding the food strand through a feed device towards a cutting device;continuously measuring a cross section of the food strand during feeding with a measuring device;continuously generating a marking on a surface of the food strand through a marking device;continuously detecting the marking through three first detectors arranged on identical sides of the marking with respect to the feed direction;continuously determining a size of a cross sectional surface of the food strand through a processing device from image data generated by the first detectors and a fourth detector;controlling the cutting device and / or the feed device through a control device using data of the size of the cross sectional surface; andcontinuously detecting the marking through a fourth detector arranged on another side of the marking than the three first detectors.

The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

The specification discloses a tire inflation pressure regulator facilitating precise tire inflation. The regulator includes a body, a two-position valve within the body, and a rotational lock. The body includes an air inlet, an air outlet, and an air vent. In one position, the valve directs air from the air inlet to the air outlet when the tire pressure is below a preset level; and, in a second position, the valve directs air from the air inlet to the air vent when the tire pressure exceeds the preset level to prevent overfilling. The valve moves rapidly between the two positions, and is unstable between the two positions. The valve includes a regulator enabling the preset level to be adjusted. The rotational lock enables the regulator to be screwed onto a tire stem, but prevents removal of the regulator from the tire stem without a key. The regulator preferably includes a cap removably sealed over the air inlet and the air vent to prevent the undesired loss of air.

For the measurement, orientation and fixation of at least one single crystal, it is the object of the invention to ensure increased accuracy in the determination of crystallographic orientation and oriented fixation regardless of the outer geometry of the single crystals, and the fixation should guarantee a highly accurate cutting also with very hard materials such as sapphire or silicon carbide. The single crystal is adjustably positioned on a revolving table for determining the crystal lattice orientation, wherein the crystal lattice orientation is determined during at least one revolution of the revolving table based on a plurality of x-ray reflections. The orientation of the crystal lattice is carried out with reference to the determined angles of the normal of the lattice plane relative to the axis (X-X) of the revolving table as reference direction before carrying out the fixation of the single crystal and the fastening on a support oriented in reference direction. By virtue of the invention, a plurality of single crystals can be oriented, fixated, stacked one on top of the other and connected to one another and subsequently connected simultaneously to a common support. Further, the invention makes it possible to monitor the orientation of every single crystal after fastening to the common support.

A method of dividing a plate-like workpiece having a layer that is made of a different material from that of a substrate and is formed on the front surface of the substrate along predetermined dividing lines, comprising a laser beam application step for applying a laser beam along the dividing lines formed on the plate-like workpiece to form a plurality of grooves deeper than the layer and a cutting step for cutting the plate-like workpiece with a cutting blade along the plurality of grooves formed in the laser beam application step, wherein a length between the outer sides of grooves on both sides formed in the laser beam application step is set to be larger than the thickness of the cutting blade and the cutting blade cuts the area between the outer sides of the grooves on both sides in the cutting step.

[Problem] To provide a fixed-abrasive-grain wire-saw that enables improved workpiece cutting plane accuracy and grinding efficiency and further allows for a longer product service life, a method for manufacturing the fixed-abrasive-grain wire-saw, and a method for cutting a work piece using the fixed-abrasive-grain wire-saw. [Solution] When abrasive grains (2) are to be affixed to the external peripheral surface of a metallic core wire (1), a plurality of transfer rollers (18) provided with a plurality of very small holes (18a) filled with an adhesive (3a) are used to transfer the adhesive (3a) onto the external peripheral surface of the metallic core wire, whereby a plurality of lines (li) of a punctate adhesive layer (3) axially arranged in straight lines at a regular pitch are formed on the metallic core wire; and, after being provisionally bonded to the adhesive layer, the abrasive grains are permanently bonded by electrodeposition on a metallic plating layer (4).

A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone at the interface ring, and providing at least one controllable low-pressure zone in the vicinity of at least one of the first surface and the second surface. The technique also includes supplying the high-pressure zone with a controllable high-pressure force, and attacking the interface ring with at least one mechanical force in combination with the high-pressure force to cut the assembly.