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52174results about How to "High hardness" patented technology

Composite rotary tool and tool fabrication method

A composite rotary tool includes at least first and second regions comprising first and second materials, respectively. The first and second regions are autogenously bonded and differ with respect to at least one characteristic such as, for example, modulus of elasticity, hardness, wear resistance, fracture toughness, tensile strength, corrosion resistance, coefficient of thermal expansion, or coefficient of thermal conductivity. A method for producing the composite rotary tool includes placing a first metallurgical powder into a first region of a void of a mold, and placing a second metallurgical powder into a second region of the void. The first metallurgical powder differs from the second metallurgical powder, and at least a portion of the first metallurgical is brought into contact with the second metallurgical powder. The mold is compressed to consolidate the first and second metallurgical powders to form a compact, and the compact subsequently is sintered.
Owner:KENNAMETAL INC

Short fiber-particle synergetically-reinforced copper-based composite material and preparation method thereof

The invention relates to a copper-based composite material, and particularly relates to a short fiber-particle synergetically-reinforced copper-based composite material which is prepared through powder metallurgy. Short fibers and particles are used as reinforced phases, the content of the short fiber is 0.1-0.1 wt%, and the content of reinforcement particles is 0.1-10 wt%. The short fibers can be carbon nanotubes, carbon nanofibers, ceramic short fibers, and the like, and the particles used as reinforced phases can be aluminum oxide, zirconium oxide, magnesium oxide, titanium dioxide, silicon carbide, titanium carbide, tungsten carbide, silicon nitride, aluminum nitride, titanium nitride, titanium diboride, Ti3SiC2, and the like. The composite material is prepared through the steps of mixing, forming, sintering and processing, and the room temperature and the high temperature strength of the composite material can be increased by more than 3 times in comparison with those of pure copper; the electrical conductivity of the composite material can reach more than 80% of that of pure copper; the thermal conductivity of the composite material can reach more than 70% of that of pure copper; the coefficient of friction of the composite material can be reduced to be below 70% of that of pure copper; and the wear rate of the composite material can be reduced to be below 50% of that of pure copper.
Owner:UNIV OF SCI & TECH BEIJING

Titanium carbonitride based metal ceramic based on high-entropy alloy binder phase and preparation method of metal ceramic

Disclosed is a titanium carbonitride based metal ceramic material based on a high-entropy alloy binder phase. The binder phase of the titanium carbonitride based metal ceramic material is high-entropy alloy, the hard phase of the titanium carbonitride based metal ceramic material is carbonitride solid solution, the high-entropy alloy binder phase includes at least four of ferrum, cobalt, nickel, chromium, aluminum, vanadium, titanium, copper, zirconium, molybdenum, manganese and rare earth elements, and the molar content ratio of each element ranges from 5% to 35%. In a preparation method, the titanium carbonitride based metal ceramic material based on the high-entropy alloy binder phase comprises raw materials including, in weight percent, 3-30% of the high-entropy alloy binder phase, 0-30% of second carbide powder and the balance carbonitride solid solution powder, the carbonitride solid solution powder includes at least one of Ti (Cx, N1-x), (Ti, M1...) and (Cx, N1-x), the M1 component of the (Ti, M1...) and (Cx, N1-x) includes at least one of W, Mo, Ta, Nb, V, Cr, Zr, Hf, Y and lanthanide, and 0<x<1 in the Ti (Cx, N1-x), (Ti, M1...) and (Cx, N1-x). The preparation method includes the process steps of (1) ball-milling mixing, (2) forming and (3) low-pressure sintering.
Owner:SICHUAN UNIV
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