The invention discloses a method for preparing the nanometer ink through ceramics, metal, semiconductors, glass and other high-melting-point materials, carrying out 3D printing and utilizing the laser heating sintering in the process of printing to obtain 3D devices formed by combining the ceramics, the metal, the semiconductors and other composite. The method comprises the first step of processing raw materials needed to prepare the device into nanometer particles of 1-500nm, the second step of preparing the particles into ink jet printing ink, the third step of carrying out 3D printing by utilizing an improved ordinary ink printer and adopting the laser heating sintering in the process of printing, and the fourth step of achieving the melting and sintering molding of the nanometer particles. According to the method, micron-level precision devices with any complex shape can be directly prepared, the high surface energy of the nanometer particles is utilized, the sintering temperature is lowered, high density is achieved, and a superior property is obtained. The method can be used for manufacturing automobile metal ceramic composite pistons, aviation engine tail pipes, and ceramic bearings and ceramal composite precise components of watches and other precision instruments and for directly printing a circuit board.