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21183results about "Transformers/inductances coils/windings/connections" patented technology

Planar coil and contactless electric power transmission device using the same

This invention has an object to a planar coil, a contactless electric power transmission device using the same. This planar coil is configured to suppress an eddy current developed between adjacent turns of wire for minimizing adverse effects on ambient electrical appliances resulting from heat generation. The planar coil 1 in the present invention is formed of spiral shaped wire 7 coated with thinned insulative film, in which adjacent turns of the wire 7 are spaced in radial direction at such a predetermined interval to suppress an eddy current. This planar coil 1 is preferably employed as a power transmission coil or power receiving coil.
Owner:PANASONIC CORP

Plated terminations

InactiveUS6960366B2Improved termination featureEliminate and greatly simplifyResistor terminals/electrodesFinal product manufactureTermination problemEngineering
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.
Owner:KYOCERA AVX COMPONENTS CORP
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