A multilayer
printed circuit board (“PCB”) coil that simulates a coil formed from
litz wire. The PCB includes a plurality of alternating conductor and insulating
layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across
layers to provide a plurality of current flow paths (or filaments) that undulate between the
layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual
inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly / downwardly, but also inwardly / outwardly in a regular, repeating pattern.